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Circular Connectors - Housings

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10000 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Mounting Type

Housing Material

Number of Positions or Pins (Grid)

Contact Material - Mating

Contact Material - Post

Contact Finish Mating

Mfr

Package

Product Status

RoHS

Operating Temperature

Packaging

Series

Part Status

Termination

Type

Gender

Current Rating

Pitch - Mating

Number of Contacts

Contact Finish - Post

Contact Style

Contact Resistance

Termination Post Length

Pitch - Post

Features

Contact Finish Thickness - Mating

Contact Finish Thickness - Post

Material Flammability Rating

DIV40E17-06SNC001
DIV40E17-06SNC001

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

Glenair

Retail Package

Active

-

-

-

*

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

DJT14F19-66PAC001
DJT14F19-66PAC001

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

Glenair

Retail Package

Active

-

-

-

*

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

D38999/26WG75BE
D38999/26WG75BE

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

PEI-Genesis

Bulk

Active

-

-

-

*

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

AFD56-18-32SW-6141
AFD56-18-32SW-6141

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Non-Compliant

-

-

-

-

-

-

Male

-

-

12

-

Pin

-

-

-

-

-

-

-

DIV46G25-61PCC001
DIV46G25-61PCC001

TE Connectivity

In Stock

-

-

Through Hole

Polyamide (PA46), Nylon 4/6, Glass Filled

--

Beryllium Copper

Brass

Gold

-

-

-

-

-55°C ~ 105°C

Bulk

PGM

Active

Solder

PGA

-

3A

0.100 (2.54mm)

-

Tin

-

--

0.165 (4.19mm)

0.100 (2.54mm)

--

10.0µin (0.25µm)

200.0µin (5.08µm)

UL94 V-0

DIV46G15-35SAC001
DIV46G15-35SAC001

TE Connectivity

In Stock

-

-

Through Hole

Polyamide (PA46), Nylon 4/6, Glass Filled

48 (2 x 24)

Beryllium Copper

Brass

Gold

-

-

-

-

--

Bulk

518

Active

Solder

DIP, 0.6 (15.24mm) Row Spacing

-

3A

0.100 (2.54mm)

-

Tin

-

--

0.125 (3.18mm)

0.100 (2.54mm)

Open Frame

10.0µin (0.25µm)

200.0µin (5.08µm)

UL94 V-0

DIV46E23-55SCC003
DIV46E23-55SCC003

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

42 (2 x 21)

Beryllium Copper

Brass

Gold

-

-

-

-

--

Bulk

6556

Active

Wire Wrap

DIP, 0.6 (15.24mm) Row Spacing

-

3A

0.100 (2.54mm)

-

Tin

-

--

0.283 (7.19mm)

0.100 (2.54mm)

Open Frame

30.0µin (0.76µm)

200.0µin (5.08µm)

UL94 V-0

DIV46E23-53PNC001
DIV46E23-53PNC001

TE Connectivity

In Stock

-

-

Through Hole

Polyamide (PA46), Nylon 4/6, Glass Filled

40 (1 x 40)

Phosphor Bronze

Phosphor Bronze

Tin

-

-

-

-

-55°C ~ 105°C

Bulk

700 Elevator Strip-Line™

Active

Solder

SIP

-

1.5A

0.100 (2.54mm)

-

Tin

-

--

0.150 (3.81mm)

0.100 (2.54mm)

Elevated

200.0µin (5.08µm)

200.0µin (5.08µm)

UL94 V-0

DIV46E19-35SCC003
DIV46E19-35SCC003

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

48 (2 x 24)

Beryllium Copper

Beryllium Copper

Tin

-

-

-

-

--

Bulk

57

Active

Solder

DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing

-

1A

0.100 (2.54mm)

-

Tin

-

--

0.110 (2.78mm)

0.100 (2.54mm)

Closed Frame

200.0µin (5.08µm)

200.0µin (5.08µm)

UL94 V-0

DIV46G13-04SNC001
DIV46G13-04SNC001

TE Connectivity

In Stock

-

-

Through Hole, Right Angle, Horizontal

Polyamide (PA46), Nylon 4/6

48 (2 x 24)

Phosphor Bronze

Phosphor Bronze

Gold

-

-

-

-

--

Bulk

Vertisockets™ 800

Active

Solder

DIP, 0.6 (15.24mm) Row Spacing

-

1.5A

0.100 (2.54mm)

-

Gold

-

--

0.145 (3.68mm)

0.100 (2.54mm)

Closed Frame

10.0µin (0.25µm)

10.0µin (0.25µm)

UL94 V-0

DIV44G17-35SNC001
DIV44G17-35SNC001

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

48 (2 x 24)

Beryllium Copper

Beryllium Copper

Gold

-

-

-

-

--

Bulk

57

Active

Solder

DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing

-

1A

0.100 (2.54mm)

-

Gold

-

--

0.110 (2.78mm)

0.100 (2.54mm)

Closed Frame

10.0µin (0.25µm)

10.0µin (0.25µm)

UL94 V-0

DIV46G25-35PBC001
DIV46G25-35PBC001

TE Connectivity

In Stock

-

-

Through Hole, Right Angle, Horizontal

Polyamide (PA46), Nylon 4/6, Glass Filled

48 (2 x 24)

Beryllium Copper

Brass

Gold

-

-

-

-

-55°C ~ 105°C

Bulk

Vertisockets™ 800

Active

Solder

DIP, 0.6 (15.24mm) Row Spacing

-

3A

0.100 (2.54mm)

-

Tin

-

--

0.140 (3.56mm)

0.100 (2.54mm)

Closed Frame

30.0µin (0.76µm)

200.0µin (5.08µm)

UL94 V-0

DIV44E15-35PNC003
DIV44E15-35PNC003

TE Connectivity

In Stock

-

-

Through Hole

Polyamide (PA46), Nylon 4/6, Glass Filled

40 (2 x 20)

Beryllium Copper

Beryllium Copper

Gold

-

-

-

-

-55°C ~ 125°C

Bulk

Lo-PRO®file, 526

Active

Solder

DIP, ZIF (ZIP)

-

3A

0.100 (2.54mm)

-

Gold

-

--

0.105 (2.67mm)

0.100 (2.54mm)

Closed Frame

10.0µin (0.25µm)

10.0µin (0.25µm)

UL94 V-0

DIV44E19-35SDC003
DIV44E19-35SDC003

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

48 (2 x 24)

Beryllium Copper

Brass

Gold

-

-

-

-

--

Bulk

6556

Active

Solder

DIP, 0.6 (15.24mm) Row Spacing

-

3A

0.100 (2.54mm)

-

Gold

-

--

0.130 (3.30mm)

0.100 (2.54mm)

Open Frame

30.0µin (0.76µm)

10.0µin (0.25µm)

UL94 V-0

DIV44E15-05PCC003
DIV44E15-05PCC003

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

42 (2 x 21)

Beryllium Copper

Beryllium Copper

Tin

-

-

-

-

--

Bulk

57

Active

Solder

DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing

-

1A

0.100 (2.54mm)

-

Tin

-

--

0.110 (2.78mm)

0.100 (2.54mm)

Closed Frame

200.0µin (5.08µm)

200.0µin (5.08µm)

UL94 V-0

DIV43G25-29PCC001
DIV43G25-29PCC001

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

42 (2 x 21)

Beryllium Copper

Beryllium Copper

Tin

-

-

-

-

--

Bulk

57

Active

Solder

DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing

-

1A

0.100 (2.54mm)

-

Tin

-

--

0.110 (2.78mm)

0.100 (2.54mm)

Closed Frame

200.0µin (5.08µm)

200.0µin (5.08µm)

UL94 V-0

DIV44E19-32SCC001
DIV44E19-32SCC001

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

40 (2 x 20)

Beryllium Copper

Beryllium Copper

Gold

-

-

-

-

--

Bulk

55

Active

Solder

DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing

-

1A

0.100 (2.54mm)

-

Gold

-

--

0.110 (2.78mm)

0.100 (2.54mm)

Closed Frame

--

--

UL94 V-0

DIV44E11-05PNC003
DIV44E11-05PNC003

TE Connectivity

In Stock

-

-

Through Hole

Polyamide (PA46), Nylon 4/6, Glass Filled

40 (2 x 20)

Beryllium Copper

Brass

Gold

-

-

-

-

-55°C ~ 105°C

Bulk

8

Active

Solder

DIP, 0.6 (15.24mm) Row Spacing

-

3A

0.100 (2.54mm)

-

Gold

-

--

0.140 (3.56mm)

0.100 (2.54mm)

Closed Frame, Elevated

30.0µin (0.76µm)

10.0µin (0.25µm)

UL94 V-0

DIV43G17-08SNC001
DIV43G17-08SNC001

TE Connectivity

In Stock

-

-

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

40 (2 x 20)

Beryllium Copper

Beryllium Copper

Gold

-

-

-

-

--

Bulk

55

Active

Solder

DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing

-

1A

0.100 (2.54mm)

-

Gold

-

--

0.110 (2.78mm)

0.100 (2.54mm)

Closed Frame

--

--

UL94 V-0

DIV43G11-99SCC001
DIV43G11-99SCC001

TE Connectivity

In Stock

-

-

Through Hole

Polyamide (PA46), Nylon 4/6, Glass Filled

40 (2 x 20)

Beryllium Copper

Brass

Gold

-

-

-

-

-55°C ~ 105°C

Bulk

8

Active

Solder

DIP, 0.3 (7.62mm) Row Spacing

-

3A

0.100 (2.54mm)

-

Gold

-

--

0.140 (3.56mm)

0.100 (2.54mm)

Closed Frame, Elevated

30.0µin (0.76µm)

10.0µin (0.25µm)

UL94 V-0