Filters
  • Manufacturer
    • Aries Electronics
    • Preci-Dip
    • Samtec
    • 3M
    • Harwin
    • Omron
    • Adam Tech
    • Amphenol
    • Keystone Electronics Corp
    • ASSMANN WSW Components
    • CnC Tech
    • Molex
    • sullins corp
    • Grayhill
    • Adafruit
    • AMP
    • Apex Microtechnology
    • EDAC
    • Texas Instruments
  • Number of Contacts
  • Contact Finish Mating
  • Contact Materials
  • Manufacturer
  • ECCN Code
  • HTS Code
  • Housing Material
  • Device Socket Type
  • Device Type Used On
  • Ihs Manufacturer
  • Manufacturer Part Number
  • Part Life Cycle Code

Attribute column

Categories

Sockets for ICs, Transistors

View Mode:
10000 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Contact Plating

Mount

Mounting Type

Number of Pins

Housing Material

Number of Positions or Pins (Grid)

Contact Material - Mating

Contact Material - Post

Contact Finish Mating

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Termination

ECCN Code

Type

Number of Positions

Max Operating Temperature

Min Operating Temperature

Number of Rows

Additional Feature

Current Rating (Amps)

Current Rating

Pitch - Mating

Body Length or Diameter

Lead Pitch

Number of Contacts

Contact Finish - Post

PCB Contact Pattern

Body Breadth

Lead Length

Body Depth

Contact Style

Mating Contact Pitch

PCB Contact Row Spacing

Termination Post Length

Pitch - Post

Features

Contact Finish Thickness - Mating

Contact Finish Thickness - Post

Material Flammability Rating

RoHS Status

Flammability Rating

32-6513-10T
32-6513-10T

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

Polyamide (PA46), Nylon 4/6, Glass Filled

32 (2 x 16)

Beryllium Copper

Brass

Gold

-55°C~105°C

Bulk

2006

Lo-PRO®file, 513

-

yes

Active

1 (Unlimited)

Solder

EAR99

DIP, 0.6 (15.24mm) Row Spacing

32

-

-

2

LOW PROFILE; UL 94V-0

-

3A

0.100 2.54mm

-

2.54mm

32

Tin

RECTANGULAR

0.7 inch

3.175mm

0.165 inch

RND PIN-SKT

0.1 inch

0.6 mm

0.125 3.18mm

0.100 2.54mm

Closed Frame

10.0μin 0.25μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

22-0518-00
22-0518-00

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

Surface Mount

Surface Mount

22

Polyamide (PA46), Nylon 4/6, Glass Filled

22 (1 x 22)

Beryllium Copper

Brass

Gold

-

Bulk

2006

518

e3

-

Active

1 (Unlimited)

Solder

EAR99

SIP

-

-

-

1

STANDARD: UL 94V-0

-

3A

0.100 2.54mm

2.2 inch

2.54mm

22

Tin

RECTANGULAR

-

1.1684mm

-

RND PIN-SKT

-

-

0.046 1.17mm

0.100 2.54mm

Open Frame

10.0μin 0.25μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

06-1508-21
06-1508-21

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

6

Polyamide (PA46), Nylon 4/6

6 (2 x 3)

Beryllium Copper

Brass

Gold

-55°C~125°C

Bulk

2006

508

-

-

Active

1 (Unlimited)

Wire Wrap

EAR99

DIP, 0.2 (5.08mm) Row Spacing

-

-

-

1

STANDARD: UL 94V-0

-

3A

0.100 2.54mm

0.3 inch

2.54mm

6

-

RECTANGULAR

0.2 inch

9.144mm

-

RND PIN-SKT

-

-

0.360 9.14mm

0.100 2.54mm

Closed Frame

10.0μin 0.25μm

10.0μin 0.25μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

06-822-90C
06-822-90C

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

Horizontal, Through Hole

Through Hole, Right Angle, Horizontal

-

Polyamide (PA46), Nylon 4/6, Glass Filled

6 (2 x 3)

Beryllium Copper

Brass

Gold

-55°C~105°C

Bulk

2006

Vertisockets™ 800

e4

-

Active

1 (Unlimited)

Solder

EAR99

DIP, 0.3 (7.62mm) Row Spacing

6

-

-

-

STANDARD: UL 94V-0

-

3A

0.100 2.54mm

-

-

6

Tin

-

-

3.556mm

-

-

-

-

0.140 3.56mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

16-3518-102
16-3518-102

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

Polyamide (PA46), Nylon 4/6, Glass Filled

16 (2 x 8)

Beryllium Copper

Brass

Gold

-

Bulk

2012

518

e3

yes

Active

1 (Unlimited)

Solder

EAR99

DIP, 0.3 (7.62mm) Row Spacing

16

-

-

2

STANDARD: UL 94V-0

-

3A

0.100 2.54mm

0.8 inch

2.54mm

16

Tin

RECTANGULAR

0.4 inch

3.175mm

-

RND PIN-SKT

0.1 inch

0.3 mm

0.125 3.18mm

0.100 2.54mm

Open Frame

10.0μin 0.25μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

144-PGM12001-51
144-PGM12001-51

Aries Electronics

In Stock

-

Datasheet

6 Weeks

Gold

Through Hole

Through Hole

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

Gold

-55°C~125°C

Bulk

2009

PGM

-

-

Active

1 (Unlimited)

Solder

-

PGA

-

125°C

-55°C

-

-

3A

3A

0.100 2.54mm

-

-

-

Gold

-

-

4.191mm

-

-

-

-

0.165 4.19mm

0.100 2.54mm

-

10.0μin 0.25μm

10.0μin 0.25μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

180-PGM18007-41
180-PGM18007-41

Aries Electronics

In Stock

-

Datasheet

6 Weeks

Gold

Through Hole

Through Hole

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

Gold

-55°C~125°C

Bulk

2009

PGM

-

-

Active

1 (Unlimited)

Solder

-

PGA

-

125°C

-55°C

-

-

3A

3A

0.100 2.54mm

-

-

-

Gold

-

-

4.191mm

-

-

-

-

0.165 4.19mm

0.100 2.54mm

-

10.0μin 0.25μm

10.0μin 0.25μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

32-3554-16
32-3554-16

Aries Electronics

In Stock

-

Datasheet

6 Weeks

Nickel

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS), Glass Filled

32 (2 x 16)

Beryllium Copper

Beryllium Copper

Nickel Boron

-

Bulk

2005

55

-

yes

Active

1 (Unlimited)

Solder

EAR99

DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing

32

-

-

-

STANDARD: UL 94V-0

-

1A

0.100 2.54mm

-

-

32

Nickel Boron

-

-

2.794mm

-

-

-

-

0.110 2.78mm

0.100 2.54mm

Closed Frame

50.0μin 1.27μm

50.0μin 1.27μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

44-3571-16
44-3571-16

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Nickel

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS), Glass Filled

44 (2 x 22)

Beryllium Nickel

Beryllium Nickel

Nickel Boron

-

Bulk

2005

57

-

yes

Active

1 (Unlimited)

Solder

EAR99

DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing

44

-

-

-

STANDARD: UL 94V-0

-

1A

0.100 2.54mm

-

-

44

Nickel Boron

-

-

2.794mm

-

-

-

-

0.110 2.78mm

0.100 2.54mm

Closed Frame

50.0μin 1.27μm

50.0μin 1.27μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

179-PGM15011-10H
179-PGM15011-10H

Aries Electronics

In Stock

-

Datasheet

6 Weeks

Gold

Through Hole

Through Hole

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

Gold

-55°C~105°C

Bulk

2009

PGM

-

-

Active

1 (Unlimited)

Solder

-

PGA

-

105°C

-55°C

-

-

3A

3A

0.100 2.54mm

-

-

-

Tin

-

-

4.191mm

-

-

-

-

0.165 4.19mm

0.100 2.54mm

-

10.0μin 0.25μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

40-6556-41
40-6556-41

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS), Glass Filled

40 (2 x 20)

Beryllium Copper

Brass

Gold

-

Bulk

2007

6556

e4

yes

Active

1 (Unlimited)

Solder Cup

EAR99

DIP, 0.6 (15.24mm) Row Spacing

40

-

-

-

STANDARD: UL 94V-0

-

3A

0.100 2.54mm

-

-

40

-

-

-

4.572mm

-

-

-

-

0.180 4.57mm

0.100 2.54mm

Open Frame

30.0μin 0.76μm

10.0μin 0.25μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

169-PRS17012-12
169-PRS17012-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2016

PRS

-

-

Active

1 (Unlimited)

Solder

-

PGA, ZIF (ZIP)

-

125°C

-65°C

-

-

1A

1A

0.100 2.54mm

-

-

-

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

180-PLS18007-12
180-PLS18007-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2006

PLS

-

-

Active

1 (Unlimited)

Solder

-

PGA, ZIF (ZIP)

180

125°C

-65°C

-

-

1A

1A

0.100 2.54mm

-

-

-

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

169-PLS17012-12
169-PLS17012-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2016

PLS

-

-

Active

1 (Unlimited)

Solder

-

PGA, ZIF (ZIP)

-

125°C

-65°C

-

-

1A

1A

0.100 2.54mm

-

-

-

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

223-PLS18039-12
223-PLS18039-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2016

PLS

-

-

Active

1 (Unlimited)

Solder

-

PGA, ZIF (ZIP)

-

125°C

-65°C

-

-

1A

1A

0.100 2.54mm

-

-

-

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

223-PRS18017-12
223-PRS18017-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2006

PRS

-

-

Active

1 (Unlimited)

Solder

-

PGA, ZIF (ZIP)

223

125°C

-65°C

-

-

1A

1A

0.100 2.54mm

-

-

-

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

256-PRS20005-12
256-PRS20005-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2006

PRS

e3

yes

Active

1 (Unlimited)

Solder

EAR99

PGA, ZIF (ZIP)

256

-

-

-

-

-

1A

0.100 2.54mm

-

-

256

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

44-3575-18
44-3575-18

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS), Glass Filled

44 (2 x 22)

Beryllium Copper

Beryllium Copper

Tin

-

Bulk

2005

57

-

yes

Active

1 (Unlimited)

Solder

EAR99

DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing

44

-

-

-

UL 94V-0

-

1A

0.100 2.54mm

-

-

44

-

-

-

2.794mm

-

-

-

-

0.110 2.78mm

0.100 2.54mm

Closed Frame

200.0μin 5.08μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

400-PLS20001-12
400-PLS20001-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2016

PLS

e3

yes

Active

1 (Unlimited)

Solder

EAR99

PGA, ZIF (ZIP)

-

-

-

-

-

-

1A

0.100 2.54mm

-

-

400

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

18-PLS15071-12
18-PLS15071-12

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold

Through Hole

Through Hole

-

Polyphenylene Sulfide (PPS)

-

Beryllium Copper

Beryllium Copper

Gold

-65°C~125°C

Bulk

2016

PLS

-

-

Active

1 (Unlimited)

Solder

-

PGA, ZIF (ZIP)

-

125°C

-65°C

-

-

1A

1A

0.100 2.54mm

-

-

-

Tin

-

-

3.175mm

-

-

-

-

0.125 3.18mm

0.100 2.54mm

Closed Frame

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

ROHS3 Compliant

UL94 V-0