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Sockets for ICs, Transistors

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10000 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Contact Plating

Alias #

Base/Housing Material

Body Orientation

Card & Socket Accessory Typeu2009

Centerline (Pitch)u2009(in)

Centerline (Pitch)u2009(mm)

Compatible With IC Socket Typeu2009

Connector Profileu2009

Connector Systemu2009

Contact Fabricationu2009

Contact Materials

Contact Mating Area Plating Material Thicknessu2009(µin)

Device Typeu2009

DRAM Typeu2009

Fin Styleu2009

IC Socket Typeu2009

Leg Styleu2009

Module Orientationu2009

Mounting

Number of Finsu2009

Number of Positionsu2009

Operating Temperature Rangeu2009

Operating Temperature Rangeu2009(°C)

PCB Hole Diameteru2009

PCB Mounting Styleu2009

Power Ratingu2009(W)

Row-to-Row Spacingu2009

Socket Lengthu2009

Socket Sleeve Styleu2009

Stack Heightu2009

TE Internal #

TE Internal Description

Termination Method

Wire Sizeu2009(AWG)

Wire Sizeu2009(mm²)

Operating Temperature

Gender

Pitch

Housing Color

Product Length

2-2199154-1
2-2199154-1

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Board-to-Board

-

-

-

-

Double Data Rate (DDR) 4

-

-

-

Vertical

-

-

288

-

-

-

Through Hole - Solder

-

-

-

-

-

2-2199154-1

DDR4 DIMM 288 Pin TH type

-

-

-

-

-

-

-

-

6-2308107-5
6-2308107-5

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Board-to-Bus Bar

-

-

-

-

Double Data Rate (DDR) 4

-

-

-

Vertical

-

-

288

-

-

-

Through Hole - Solder

-

-

-

-

-

6-2308107-5

DDR4 DIMM 288 PIN TH TYPE

-

-

-

-

-

-

-

-

5-2308107-8
5-2308107-8

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Board-to-Bus Bar

-

-

-

-

Double Data Rate (DDR) 4

-

-

-

Vertical

-

-

288

-

-

-

Through Hole - Solder

-

-

-

-

-

5-2308107-8

DDR4 DIMM 288 PIN TH TYPE

-

-

-

-

-

-

-

-

5645980-1
5645980-1

TE Connectivity

50
-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.59u2009mmu2009[u2009.102u2009inu2009]

-

-

-

7.82u2009mmu2009[u2009.308u2009inu2009]

Bullet Nose

-

5645980-1

MSS LOOSE PIECE 5.5 TIN TIN

-

18 – 17

.823 – 1.04

-

-

-

-

-

5050864-8
5050864-8

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.57u2009mmu2009[u2009.062u2009inu2009]

-

-

-

6.53u2009mmu2009[u2009.257u2009inu2009]

Open Bottom

-

5050864-8

SKT,MIN-SPR W/OPEN BOT SN SER3

-

22 – 20

.326 – .518

-

-

-

-

-

2-2330551-1
2-2330551-1

TE Connectivity

3360

-

-

-

-

-

-

Backplate

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-25 – 100

-

-

-

-

-

-

-

2-2330551-1

SOCKET P4/P5 BACKPLATE ASSY,STUD 6.02MM

-

-

-

-

-

-

-

-

6-390376-1
6-390376-1

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Cable-to-Board

-

-

-

-

Small Outline (SO)

-

-

-

Right Angle

-

-

144

-

-

-

-

-

-

-

-

5.2u2009mmu2009[u2009.205u2009inu2009]

6-390376-1

SKT,SODIMM,144P,SDRAM3.3V,STD,T&R

-

-

-

-

-

-

-

-

3-2330550-2
3-2330550-2

TE Connectivity

In Stock

-

-

-

-

-

-

Bolster Assembly

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-25 – 100

-

-

-

-

-

-

-

3-2330550-2

SOCKET P5 BOLSTER PLATE ASSY, W/ COVER

-

-

-

-

-

-

-

-

1565918-4
1565918-4

TE Connectivity

10
-

-

-

-

-

-

-

-

-

-

Cable-to-Board

-

-

-

-

Double Data Rate (DDR) 2

-

-

-

Right Angle

-

-

200

-

-

-

-

-

-

-

-

5.2u2009mmu2009[u2009.205u2009inu2009]

1565918-4

EMBOSS ASSY DDR2 SODIMM SOCKET 200P 5.2H

-

-

-

-

-

-

-

-

1-2199298-5
1-2199298-5

TE Connectivity

In Stock
-

-

S421

-

-

-

-

-

-

Low

-

Stamped & Formed

-

-

-

-

-

-

Straight

-

-

-

18

-

-

-

-

-

7.62u2009mmu2009[u2009.3u2009inu2009]

-

-

-

1-2199298-5

18P,DIP SKT,300 CL,LDR,PB FREE

-

-

-

-

-

-

-

-

2199154-7
2199154-7

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Board-to-Board

-

-

-

-

Double Data Rate (DDR) 4

-

-

-

Vertical

-

-

288

-

-

-

Through Hole - Solder

-

-

-

-

-

2199154-7

DDR4 DIMM 288 PIN TH TYPE

-

-

-

-

-

-

-

-

1-2199154-1
1-2199154-1

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Board-to-Board

-

-

-

-

Double Data Rate (DDR) 4

-

-

-

Vertical

-

-

288

-

-

-

Through Hole - Solder

-

-

-

-

-

1-2199154-1

DDR4 DIMM 288 Pin TH type

-

-

-

-

-

-

-

-

1-2199154-4
1-2199154-4

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

Board-to-Board

-

-

-

-

Double Data Rate (DDR) 4

-

-

-

Vertical

-

-

288

-

-

-

Through Hole - Solder

-

-

-

-

-

1-2199154-4

DDR4 DIMM 288 Pin TH type

-

-

-

-

-

-

-

-

1542993-2
1542993-2

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SFP

-

Pin Fin

-

-

-

-

50

-

-

-

-

-

5, 10, 15

-

-

-

-

1542993-2

SFP HEATSINK 13.5MM TALL

-

-

-

-

-

-

-

-

50865
50865

TE Connectivity

20
-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.83u2009mmu2009[u2009.072u2009inu2009]

-

-

-

6.6u2009mmu2009[u2009.26u2009inu2009]

Closed Bottom

-

50865

SOCKET,MIN-SPR AU SER-4

-

20 – 18

.518 – .823

-

-

-

-

-

50871-4
50871-4

TE Connectivity

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.56u2009mmu2009[u2009.101u2009inu2009]

-

-

-

7.32u2009mmu2009[u2009.288u2009inu2009]

Closed Bottom

-

50871-4

SOCKET,MIN-SPR AU SER-5

-

18 – 17

.823 – 1.04

-

-

-

-

-

2-2822979-4
2-2822979-4

TE Connectivity

In Stock

-

-

-

-

-

-

-

.034, .039

.86, .99

-

-

Board-to-Board

-

-

30

-

-

-

LGA 3647

-

-

-

-

3647

-

-

-

-

-

-

-

-

-

2-2822979-4

LGA3647-1 SOCKET-P1 KIT FOR ODM (30U AU)

-

-

-

-

-

-

-

-

1489948-2
1489948-2

TE Connectivity

30
-

-

-

-

-

-

-

-

-

-

-

-

-

-

XFP

-

-

-

-

-

-

-

-

-

-

-

-

5, 10, 15

-

-

-

-

1489948-2

XFP HEAT SINK CLIP, PLATED

-

-

-

-

-

-

-

-

1-2324271-4
1-2324271-4

TE Connectivity

168

-

-

-

-

-

-

-

-

-

-

-

Board-to-Board

-

-

15

-

-

-

LGA 4189

-

-

-

-

2097

-

-

-

Surface Mount Solder Ball

-

-

-

-

-

1-2324271-4

LEFT SEGMENT LGA4189-4 SOCKET-P4 FOR ODM

-

-

-

-

-

-

-

-

2-2330552-2
2-2330552-2

TE Connectivity

3840

-

-

Gold Over Nickel

-

PPS (Polyphenylene Sulfide)

Right Angle

Carrier

-

-

Metric PQFP

-

-

-

Phosphor Bronze

-

-

-

-

-

-

-

Through Hole

-

-

-25 – 100u2009°Cu2009[u2009-13 – 212u2009°Fu2009]

-

-

-

-

-

-

-

-

2-2330552-2

ICX POINT PHM CARRIER ASSY, P4

Solder

-

-

-65 to 125 °C

RCP

2.5400 mm

Natural

150.88 mm

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