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  • RoHS
  • RAM Size
  • Max Operating Temperature
  • Min Operating Temperature
  • Frequency
  • Case/Package
  • Number of Pins
  • Data Bus Width
  • Max Frequency
  • Interface
  • Memory Size
  • Max Supply Voltage

Attribute column

Categories

Embedded - Microcontroller, Microprocessor, FPGA Modules

View Mode:
2817 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Mount

Package / Case

Number of Pins

Weight

Memory Types

Operating Temperature

Packaging

Published

Series

Size / Dimension

Part Status

Moisture Sensitivity Level (MSL)

Connector Type

Max Operating Temperature

Min Operating Temperature

Frequency

Max Output Current

Operating Supply Voltage

Interface

Memory Size

Operating Supply Current

Number of Ports

Nominal Supply Current

Speed

RAM Size

Core Processor

Data Rate

Data Bus Width

Density

Core Architecture

Power Consumption

Number of UART Channels

Number of I2C Channels

Module/Board Type

Flash Size

Co-Processor

Height

Length

Width

Radiation Hardening

RoHS Status

Lead Free

In Stock

-

-

2 Weeks

-

Module

-

-

-

0°C~70°C

-

2004

RabbitCore®

1.85 x 2.73 47mmx69mm

Not For New Designs

1 (Unlimited)

2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card

-

-

44.2MHz

250mA

3.45V

Serial

-

-

-

-

-

1MB

Rabbit 3000

-

-

-

-

-

-

-

MPU Core

512KB Internal 32MB External

-

-

-

-

-

RoHS Compliant

Lead Free

TE0722-02I
TE0722-02I

Trenz Electronic GmbH

18

-

Datasheet

12 Weeks

-

-

-

-

-

-40°C~85°C

-

2016

TE0722

0.71 x 2.01 18mmx51mm

Active

Not Applicable

40 Pin

-

-

-

-

-

-

-

-

-

-

33MHz

-

ARM Cortex-A9

-

-

-

-

-

-

-

MCU, FPGA

16MB

Zynq-7000 (Z-7010)

-

-

-

-

ROHS3 Compliant

-

TE0715-04-30-1I
TE0715-04-30-1I

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

-40°C~85°C

-

2016

TE0715

1.97 x 1.57 50mmx40mm

Active

Not Applicable

Samtec LSHM

-

-

-

-

-

-

-

-

-

-

125MHz

1GB

ARM Cortex-A9

-

-

-

-

-

-

-

MCU, FPGA

32MB

Zynq-7000 (Z-7030)

-

-

-

-

ROHS3 Compliant

-

TE0741-03-410-2CF
TE0741-03-410-2CF

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

0°C~70°C

-

2010

TE0741

1.97 x 1.57 50mmx40mm

Active

Not Applicable

Samtec LSHM

-

-

-

-

-

-

-

-

-

-

200MHz

-

Kintex-7 410T

-

-

-

-

-

-

-

FPGA Core

32MB

-

-

-

-

-

ROHS3 Compliant

-

TE0722-02
TE0722-02

Trenz Electronic GmbH

16

-

Datasheet

12 Weeks

-

-

-

-

-

0°C~70°C

-

2016

TE0722

0.71 x 2.01 18mmx51mm

Active

Not Applicable

40 Pin

-

-

-

-

-

-

-

-

-

-

33MHz

-

ARM Cortex-A9

-

-

-

-

-

-

-

MCU, FPGA

16MB

Zynq-7000 (Z-7010)

-

-

-

-

ROHS3 Compliant

-

104222

-

Datasheet

2 Weeks

-

Module

-

-

-

-40°C~70°C

-

2000

RabbitCore RCM3700

1.2 x 2.95 30mmx75mm

Not For New Designs

1 (Unlimited)

IDC Header 2x20

-

-

22.1MHz

-

5.25V

Serial

-

-

-

-

-

128KB

Rabbit 3000

-

-

-

-

-

-

-

MPU Core

256KB Internal 1MB External

-

-

-

-

No

RoHS Compliant

Lead Free

XP1002000-05R
XP1002000-05R

Lantronix, Inc.

In Stock

-

Datasheet

6 Weeks

-

Module

-

-

-

-40°C~85°C

-

2013

XPort®

0.57 x 0.72 14.5mmx18.3mm

Active

Not Applicable

RJ45

85°C

-40°C

-

-

3.3V

Ethernet, Serial

-

119mA

1

-

25MHz

256KB

DSTni-EX

921.6 kbps

-

-

-

-

-

-

MPU Core

512KB

XPort AR

13.5mm

33.9mm

16.25mm

-

ROHS3 Compliant

-

TE0714-02-35-2I
TE0714-02-35-2I

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

-40°C~85°C

-

2012

TE0714

1.57 x 1.18 40mmx30mm

Obsolete

1 (Unlimited)

Samtec LSHM

-

-

-

-

-

-

-

-

-

-

-

-

Artix-7 A35T

-

-

-

-

-

-

-

FPGA Core

16MB

-

-

-

-

-

Non-RoHS Compliant

-

2739

-

Datasheet

21 Weeks

-

Module

-

-

-

0°C~70°C

-

2003

eZ80® Acclaim!®

-

Active

1 (Unlimited)

Header 2x25

-

-

48MHz

-

-

-

-

-

-

-

-

512KB

eZ80L92

-

-

-

-

-

-

-

MCU Core

8MB

-

-

-

-

-

ROHS3 Compliant

Lead Free

In Stock

-

Datasheet

1 Weeks

-

-

-

-

FLASH, RAM

-40°C~85°C

-

2008

Digi Connect SP

3.88 x 1.68 98.5mmx42.7mm

Discontinued

1 (Unlimited)

RJ45

85°C

-40°C

55MHz

-

30V

Ethernet, RS-232

-

370mA

-

370mA

55MHz

16MB

ARM7TDMI, NS7520

230.4 kbps

-

30.5 Mb

ARM

-

-

-

MPU Core

4MB

-

25.4mm

98.5mm

42.7mm

-

RoHS Compliant

Lead Free

TE0741-03-070-2IF
TE0741-03-070-2IF

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

-40°C~85°C

-

2010

TE0741

1.97 x 1.57 50mmx40mm

Active

Not Applicable

Samtec LSHM

-

-

-

-

-

-

-

-

-

-

200MHz

-

Kintex-7 70T

-

-

-

-

-

-

-

FPGA Core

32MB

-

-

-

-

-

ROHS3 Compliant

-

In Stock

-

Datasheet

5 Weeks

-

Module

-

-

-

-20°C~85°C

-

2000

RabbitCore RCM4300

1.84 x 2.85 47mmx72mm

Not For New Designs

1 (Unlimited)

IDC Header 2x25, 2x5, 1xmicroSD Card

-

-

58.98MHz

350mA

3.6V

Serial

-

-

-

-

-

1MB

Rabbit 4000

-

-

-

-

-

-

-

MPU Core

1MB Internal microSD Slot External

-

-

-

-

-

RoHS Compliant

Lead Free

In Stock

-

-

1 Weeks

-

-

-

-

-

-40°C~85°C

-

-

Digi Connect SP

3.88 x 1.68 98.5mmx42.7mm

Discontinued

1 (Unlimited)

RJ45

-

-

55MHz

-

-

-

-

-

-

-

-

16MB

ARM7TDMI, NS7520

-

-

-

ARM

-

-

-

MPU Core

4MB

-

-

-

-

-

RoHS Compliant

-

In Stock

-

-

11 Weeks

-

Module

-

-

-

-40°C~80°C

-

2015

Digi Connect ME®

1.45 x 0.75 36.7mmx19.1mm

Obsolete

1 (Unlimited)

RJ45

80°C

-40°C

75MHz

-

-

-

-

-

-

-

75MHz

8MB

ARM926EJ-S, NS9210

-

-

-

ARM

-

-

-

MPU Core

4MB

-

-

-

-

-

RoHS Compliant

-

XPP1002000-02R
XPP1002000-02R

Lantronix, Inc.

In Stock

-

Datasheet

6 Weeks

-

-

-

-

FLASH, SDRAM

-40°C~85°C

Bulk

2012

XPort® Pro

0.63 x 1.33 16mmx33.9mm

Active

Not Applicable

RJ45

85°C

-40°C

125MHz

-

3.3V

Ethernet, Serial

-

-

-

-

-

16MB

IPv6

300 bps

-

-

-

-

-

-

MPU Core

16MB

XPort® Pro

-

-

-

-

ROHS3 Compliant

-

TE0729-02-2IF-K
TE0729-02-2IF-K

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

-40°C~85°C

-

2017

TE0729

2.05 x 2.99 52mmx76mm

Active

1 (Unlimited)

Samtec BTE

-

-

-

-

-

-

-

-

-

-

-

512MB

ARM Cortex-A9

-

-

-

-

-

-

-

MCU, FPGA

32MB

Zynq-7000 (Z-7020)

-

-

-

-

ROHS3 Compliant

-

XPP100300S-04R
XPP100300S-04R

Lantronix, Inc.

In Stock

-

Datasheet

4 Weeks

-

-

-

-

-

-40°C~85°C

-

2016

XPort® Pro

0.63 x 1.33 16mmx33.9mm

Active

Not Applicable

RJ45

-

-

-

-

-

-

-

-

-

-

-

-

IPv6

-

-

-

-

-

-

-

MPU Core

16MB

XPort® Pro

-

-

-

-

ROHS3 Compliant

-

XP1001000M-05R
XP1001000M-05R

Lantronix, Inc.

In Stock

-

Datasheet

6 Weeks

-

Module

-

-

-

-40°C~85°C

Bulk

2011

XPort®

0.57 x 0.72 14.5mmx18.3mm

Active

Not Applicable

RJ45

85°C

-40°C

-

-

3.3V

Ethernet

-

-

-

-

25MHz

256KB

DSTni-EX

921.6 kbps

-

-

-

-

-

-

MPU Core

512KB

XPort AR

13.5mm

33.9mm

16.25mm

-

ROHS3 Compliant

-

SS1-IC
SS1-IC

Parallax Inc.

In Stock

-

Datasheet

-

Through Hole

PDIP

24

9.070005g

RAM, ROM

-

-

2007

Propeller™

1.2 x 0.63 31mmx16mm

Obsolete

1 (Unlimited)

24-DIP

70°C

0°C

10MHz

-

12V

Serial

32kB

-

-

-

10MHz

32KB

Propeller, P8X32A-M44

-

32b

-

-

2W

1

1

MPU Core

32KB ROM

-

3.81mm

30mm

16mm

-

RoHS Compliant

-

XPD1001000-01
XPD1001000-01

Lantronix, Inc.

In Stock

-

Datasheet

6 Weeks

Through Hole

Module

24

-

-

-40°C~85°C

Bulk

2008

XPort® Direct+™

1.25 x 1.7 31.8mmx43.3mm

Active

Not Applicable

RJ45

85°C

-40°C

-

-

3.3V

Ethernet, Serial

-

200mA

-

-

25MHz

256KB

DSTni-EX

921 kbps

-

-

-

-

-

-

MPU Core

512KB

XPort Direct+

-

-

-

No

ROHS3 Compliant

-