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Categories

Embedded - Microcontroller, Microprocessor, FPGA Modules

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2817 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Package / Case

Operating Temperature

Published

Series

Size / Dimension

Part Status

Moisture Sensitivity Level (MSL)

Connector Type

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Speed

RAM Size

Core Processor

Core Architecture

Module/Board Type

Flash Size

RoHS Status

Lead Free

CC-9C-V237-Z1
CC-9C-V237-Z1

Digi

In Stock

-

-

-

Module

-40°C~85°C

-

ConnectCore®

3.59 x 2.06 91.2mmx52.2mm

Obsolete

1 (Unlimited)

SO-DIMM-144

85°C

-40°C

155MHz

-

155MHz

64MB

ARM926EJ-S, NS9360

ARM

MPU Core

128MB

RoHS Compliant

-

CC-9P-V247-Z1
CC-9P-V247-Z1

Digi

In Stock

-

-

-

-

-40°C~85°C

-

ConnectCore®

1.97 x 1.97 50mmx50mm

Obsolete

1 (Unlimited)

Board-to-Board (BTB) Socket - 160

-

-

-

-

150MHz

-

ARM926EJ-S, NS9215

-

MPU Core

-

RoHS Compliant

-

CC-9P-V225-Z1-B
CC-9P-V225-Z1-B

Digi

In Stock

-

-

-

Module

-

-

ConnectCore®

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

-

EZ80F917150MODG
EZ80F917150MODG

Zilog

In Stock

-

-

13 Weeks

Module

0°C~70°C

2013

eZ80® AcclaimPlus!™

2.5 x 3.1 63.5mmx78.7mm

Obsolete

1 (Unlimited)

Header 2x30

-

-

50MHz

-

-

8KB Internal 512KB External

eZ80F91

-

MCU, Ethernet Core

256KB Internal 8MB External

ROHS3 Compliant

Lead Free

XRM57D843ZWTT
XRM57D843ZWTT

Texas Instruments

In Stock

-

-

-

Module

-

-

-

-

Obsolete

3 (168 Hours)

-

-

-

-

57D843

-

-

-

-

-

-

ROHS3 Compliant

-

TE0713-01-200-2C
TE0713-01-200-2C

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

0°C~70°C

-

TE0713

1.97 x 1.57 50mmx40mm

Obsolete

Not Applicable

Samtec LSHM

-

-

-

-

200MHz

1GB

Artix-7 A200T

-

FPGA Core

32MB

-

-

TE0714-03-35-2I
TE0714-03-35-2I

Trenz Electronic GmbH

In Stock

-

-

12 Weeks

-

-40°C~85°C

-

TE0714

-

Active

Not Applicable

-

-

-

-

-

-

-

Artix-7 A35T

-

FPGA Core

-

ROHS3 Compliant

-

TE0820-03-04EV-1EA
TE0820-03-04EV-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

14 Weeks

-

0°C~85°C

-

TE0820

1.57 x 1.97 40mmx50mm

Obsolete

Not Applicable

B2B

-

-

-

-

-

2GB

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

MPU Core

128MB

-

-

CC-WMX-LC47-VM-B
CC-WMX-LC47-VM-B

Digi

In Stock

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Discontinued

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

MPU Core

-

RoHS Compliant

-

CC-MX-MB69-ZK
CC-MX-MB69-ZK

Digi

In Stock

-

-

-

Module

-

-

ConnectCore®

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

-

CC-MX-LB69-GMD
CC-MX-LB69-GMD

Digi

In Stock

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

MPU Core

-

RoHS Compliant

-

CC-WMX-LC47-VM
CC-WMX-LC47-VM

Digi

In Stock

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

MPU Core

-

RoHS Compliant

-

TE0820-03-02CG-1EA
TE0820-03-02CG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

0°C~85°C

-

TE0820

1.97 x 1.57 50mmx40mm

Obsolete

Not Applicable

B2B

-

-

-

-

-

2GB

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

MPU Core

128MB

-

-

CC-WMX-LB69-CV
CC-WMX-LB69-CV

Digi

In Stock

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

MPU Core

-

RoHS Compliant

-

TE0820-03-03EG-1EA
TE0820-03-03EG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

0°C~80°C

-

TE0820

1.57 x 1.97 40mmx50mm

Obsolete

Not Applicable

B2B

-

-

-

-

-

2GB

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

MPU Core

128MB

-

-

TE0820-03-03CG-1EA
TE0820-03-03CG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

0°C~85°C

-

TE0820

1.97 x 1.57 50mmx40mm

Obsolete

Not Applicable

B2B

-

-

-

-

-

2GB

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

MPU Core

128MB

-

-

FS-334
FS-334

Digi

In Stock

-

-

-

Module

0°C~70°C

2014

-

-

Obsolete

1 (Unlimited)

-

-

-

133MHz

-

-

-

ElanSC520

-

MCU Core

16MB

RoHS Compliant

Lead Free

TE0803-02-04CG-1EB
TE0803-02-04CG-1EB

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

0°C~85°C

-

TE0803

2.05 x 2.99 52mmx76mm

Active

Not Applicable

B2B

-

-

-

-

-

2GB

Zynq UltraScale+ XCZU4CG-1SFVC784E

-

MPU Core

256MB

-

-

CC-MX-LB69-GMD-1
CC-MX-LB69-GMD-1

Digi

In Stock

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

MPU Core

-

RoHS Compliant

-

CC-WMX-LD79-QTC
CC-WMX-LD79-QTC

Digi

In Stock

-

Datasheet

-

-

-

2016

ConnectCore® i.MX53

-

Obsolete

1 (Unlimited)

-

-

-

-

-

800MHz

-

i.MX53

-

MPU Core

-

RoHS Compliant

-

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