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  • RoHS
  • RAM Size
  • Max Operating Temperature
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Attribute column

Categories

Embedded - Microcontroller, Microprocessor, FPGA Modules

View Mode:
2817 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Size / Dimension

Part Status

Moisture Sensitivity Level (MSL)

Connector Type

Max Operating Temperature

Min Operating Temperature

Frequency

Speed

RAM Size

Core Processor

Density

Core Architecture

Module/Board Type

Flash Size

Length

Width

RoHS Status

Lead Free

In Stock

-

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

-

MPU Core

-

-

-

RoHS Compliant

-

TE0808-04-09EG-2IE
TE0808-04-09EG-2IE

Trenz Electronic GmbH

9

-

Datasheet

14 Weeks

-

-40°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

Obsolete

1 (Unlimited)

B2B

-

-

-

-

4GB

Zynq UltraScale+ XCZU9EG-1FFVC900E

-

-

MPU Core

128MB

-

-

-

-

TE0820-03-04CG-1EA
TE0820-03-04CG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

0°C~85°C

-

-

TE0820

1.57 x 1.97 40mmx50mm

Obsolete

Not Applicable

B2B

-

-

-

-

2GB

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

-

MPU Core

128MB

-

-

-

-

TE0820-03-02EG-1EA
TE0820-03-02EG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

0°C~85°C

-

-

TE0820

1.97 x 1.57 50mmx40mm

Obsolete

1 (Unlimited)

B2B

-

-

-

-

2GB

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

-

MPU Core

128MB

-

-

-

-

In Stock

-

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

800MHz

1GB

ARM® Cortex®-A8, i.MX53

-

-

MPU Core

512MB

-

-

RoHS Compliant

-

In Stock

-

Datasheet

-

-

-40°C~85°C

-

2011

ConnectCore® 9M

2.36 x 1.73 60mmx44mm

Obsolete

1 (Unlimited)

Board-to-Board (BTB) Socket - 240

-

-

533MHz

-

128MB

ARM920T, SC2443

-

ARM

MPU Core

512MB

-

-

RoHS Compliant

-

In Stock

-

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

-

MPU Core

-

-

-

RoHS Compliant

-

In Stock

-

-

-

Module

-40°C~85°C

-

-

ConnectCard™

2 x 1.38 51mmx35mm

Obsolete

1 (Unlimited)

Edge Connector - 52

-

-

-

454MHz

128MB

ARM926EJ-S i.mx287

-

-

MPU Core

128MB

-

-

RoHS Compliant

-

FS-333
FS-333

Digi

In Stock

-

-

-

Module

-

-

2014

-

-

Obsolete

1 (Unlimited)

-

-

-

40MHz

-

15.3MB

-

15.3 Mb

-

-

-

-

-

RoHS Compliant

Lead Free

FS-335
FS-335

Digi

In Stock

-

-

-

Module

0°C~70°C

-

2014

-

-

Obsolete

1 (Unlimited)

-

70°C

0°C

133MHz

133MHz

16MB

ElanSC520

15.3 Mb

-

MCU Core

2MB

91.5mm

58.4mm

RoHS Compliant

Lead Free

FS-385
FS-385

Digi

In Stock

-

-

-

Module

-

Bulk

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

Lead Free

In Stock

-

-

-

Module

-

-

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

-

In Stock

-

-

-

-

-40°C~85°C

-

2012

ConnectCore®

1.97 x 1.97 50mmx50mm

Obsolete

1 (Unlimited)

Board-to-Board (BTB) Socket - 160

85°C

-40°C

150MHz

150MHz

32MB

ARM926EJ-S, NS9215

-

ARM

MPU Core

8MB

-

-

RoHS Compliant

-

In Stock

-

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

800MHz

1GB

ARM® Cortex®-A8, i.MX53

-

-

MPU Core

512MB

-

-

RoHS Compliant

-

In Stock

-

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

-

MPU Core

-

-

-

RoHS Compliant

-

TE0808-04-09EG-1EE
TE0808-04-09EG-1EE

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

0°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

Obsolete

1 (Unlimited)

B2B

-

-

-

-

4GB

Zynq UltraScale+ XCZU9EG-1FFVC900E

-

-

MPU Core

128MB

-

-

ROHS3 Compliant

-

TE0890-01-25-1C
TE0890-01-25-1C

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

0°C~70°C

-

-

TE0890

1.06 x 2.05 27.0mmx52.0mm

Active

1 (Unlimited)

Dual-pinout DIP-40 or 50mil 80 pin connector

-

-

-

100MHz

-

Xilinx Spartan-7 XC7S25

-

-

FPGA Core

64Mbit

-

-

ROHS3 Compliant

-

In Stock

-

Datasheet

-

-

-40°C~85°C

-

-

ConnectCore® 9M

2.36 x 1.73 60mmx44mm

Obsolete

1 (Unlimited)

Board-to-Board (BTB) Socket - 240

-

-

533MHz

-

256MB

ARM920T, SC2443

-

ARM

MPU Core

512MB

-

-

RoHS Compliant

-

In Stock

-

-

-

-

-

-

2016

ConnectCore®

1.97 x 3.23 50mmx82mm

Active

1 (Unlimited)

Board-to-Board (BTB) Socket - 360

-

-

-

-

-

ARM® Cortex®-A8, i.MX53

-

-

MPU Core

-

-

-

RoHS Compliant

-

TE0808-04-15EG-1EE
TE0808-04-15EG-1EE

Trenz Electronic GmbH

In Stock

-

Datasheet

14 Weeks

-

0°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

Obsolete

Not Applicable

B2B

-

-

-

-

2GB

Zynq UltraScale+ XCZU15EG-1FFVC900E

-

-

MPU Core

128MB

-

-

-

-