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  • RoHS
  • RAM Size
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Attribute column

Categories

Embedded - Microcontroller, Microprocessor, FPGA Modules

View Mode:
2817 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Operating Temperature

Published

Series

Size / Dimension

Part Status

Moisture Sensitivity Level (MSL)

Connector Type

Frequency

Speed

RAM Size

Core Processor

Core Architecture

Module/Board Type

Flash Size

Co-Processor

RoHS Status

In Stock

-

Datasheet

-

-40°C~80°C

2012

Digi Connect ME®

1.45 x 0.75 36.7mmx19.1mm

Obsolete

1 (Unlimited)

RJ45

75MHz

-

8MB

ARM926EJ-S, NS9210

ARM

MPU Core

16MB

-

RoHS Compliant

TE0803-03-3BE11-A
TE0803-03-3BE11-A

Trenz Electronic GmbH

In Stock

-

-

12 Weeks

0°C~85°C

-

TE0803

2.05 x 2.99 52mmx76mm

Active

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

MPU Core

128MB

-

-

TE0745-02-45-2IA
TE0745-02-45-2IA

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-40°C~85°C

2018

TE0745

2.05 x 2.99 52mmx76mm

Obsolete

1 (Unlimited)

Samtec UFPS

-

-

1GB

ARM® Cortex®-A9

-

MCU, FPGA

32MB

Zynq-7000 (Z-7045)

ROHS3 Compliant

TE0745-02-35-1CA
TE0745-02-35-1CA

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

0°C~70°C

2018

TE0745

2.05 x 2.99 52mmx76mm

Obsolete

1 (Unlimited)

Samtec UFPS

-

-

1GB

ARM® Cortex®-A9

-

MCU, FPGA

32MB

Zynq-7000 (Z-7035)

-

TE0841-02-040-1I
TE0841-02-040-1I

Trenz Electronic GmbH

In Stock

-

Datasheet

14 Weeks

-40°C~85°C

-

TE0841

1.97 x 1.57 50mmx40mm

Obsolete

1 (Unlimited)

B2B

-

-

512MB

Kintex UltraScale KU40

-

FPGA Core

32MB

-

-

TE0820-03-03CG-1ED
TE0820-03-03CG-1ED

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0820

1.57 x 1.97 40mmx50mm

Obsolete

Not Applicable

B2B

-

-

1GB

Zynq UltraScale+ XCZU3CG-1SFVC784E

-

MPU Core

128MB

-

-

TE0803-02-04EG-1EA
TE0803-02-04EG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0803

2.05 x 2.99 52mmx76mm

Obsolete

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU4EG-1SFVC784E

-

MPU Core

128MB

-

-

TE0820-03-04CG-1ED
TE0820-03-04CG-1ED

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0820

1.57 x 1.97 40mmx50mm

Obsolete

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU4CG-1SFVC784E

-

MPU Core

128MB

-

-

TE0841-02-035-2I
TE0841-02-035-2I

Trenz Electronic GmbH

In Stock

-

Datasheet

14 Weeks

-40°C~85°C

-

TE0841

1.97 x 1.57 50mmx40mm

Obsolete

1 (Unlimited)

B2B

-

-

2GB

Kintex UltraScale KU035

-

FPGA Core

64MB

-

-

TE0803-03-4BE11-A
TE0803-03-4BE11-A

Trenz Electronic GmbH

In Stock

-

-

12 Weeks

0°C~85°C

-

TE0803

2.05 x 2.99 52mmx76mm

Active

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU4EG-1SFVC784E

-

MPU Core

128MB

-

-

TE0714-03-50-2I
TE0714-03-50-2I

Trenz Electronic GmbH

2380

-

-

12 Weeks

-40°C~85°C

-

TE0714

1.18 x 1.57 30mmx40mm

Active

Not Applicable

Samtec LSHM

-

-

-

Artix-7 A50T

-

FPGA Core

16MB

-

ROHS3 Compliant

TE0745-02-30-1IA
TE0745-02-30-1IA

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-40°C~85°C

2018

TE0745

2.05 x 2.99 52mmx76mm

Obsolete

1 (Unlimited)

Samtec UFPS

-

-

1GB

ARM® Cortex®-A9

-

MCU, FPGA

32MB

Zynq-7000 (Z-7030)

-

TE0820-02-03CG-1EA
TE0820-02-03CG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0820

1.97 x 1.57 50mmx40mm

Discontinued

-

B2B

-

-

1GB

Zynq UltraScale+ XCZU3CG-1SFVC784E

-

MPU Core

128MB

-

-

TE0803-02-02CG-1EA
TE0803-02-02CG-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0803

2.05 x 2.99 52mmx76mm

Obsolete

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

MPU Core

128MB

-

-

TE0803-02-04EV-1EA
TE0803-02-04EV-1EA

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0803

2.05 x 2.99 52mmx76mm

Obsolete

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

MPU Core

128MB

-

-

TE0820-03-02EG-1ED
TE0820-03-02EG-1ED

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0820

1.57 x 1.97 40mmx50mm

Obsolete

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU2EG-1SFVC784E

-

MPU Core

128MB

-

-

TE0820-03-02CG-1ED
TE0820-03-02CG-1ED

Trenz Electronic GmbH

In Stock

-

Datasheet

-

0°C~85°C

-

TE0820

1.57 x 1.97 40mmx50mm

Obsolete

Not Applicable

B2B

-

-

2GB

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

MPU Core

128MB

-

-

TE0841-02-32I21-A
TE0841-02-32I21-A

Trenz Electronic GmbH

905

-

Datasheet

12 Weeks

-40°C~85°C

-

TE0841

1.97 x 1.57 50mmx40mm

Active

1 (Unlimited)

B2B

-

-

2GB

Kintex UltraScale KU035

-

MCU, FPGA

64MB

-

ROHS3 Compliant

TE0808-04-BBE21-AK
TE0808-04-BBE21-AK

Trenz Electronic GmbH

862

-

Datasheet

12 Weeks

0°C~85°C

-

TE0808

2.05 x 2.99 52mmx76mm

Active

1 (Unlimited)

B2B

-

-

4GB

Zynq UltraScale+ XCZU15EG-1FFVC900E

-

MPU Core

128MB

-

ROHS3 Compliant

In Stock

-

Datasheet

-

-40°C~70°C

2007

RabbitCore®

2 x 3.5 51mmx89mm

Obsolete

1 (Unlimited)

2 IDC Headers 2x20

-

22.1MHz

-

Rabbit 2000

-

MPU Core

512KB

-

Non-RoHS Compliant