Filters
  • Manufacturer
    • pSemi
    • Digi
    • Trenz Electronic
    • Micro Crystal
    • National Semiconductor
    • STMicroelectronics
    • Intel
    • Microchip
    • Xilinx
    • STC Micro
    • GigaDevice
    • Renesas
    • geehy
    • AMD
    • NXP
    • Nvidia
    • Holtek
    • Infineon
    • Aries Electronics
    • PUYA
    • Lantronix
    • Parallax
    • Analog Devices, Inc.
    • IXYS Zilog
    • Jiangsu Qin Heng
    • Rochester Electronics
    • Rockchip
    • Texas Instruments
    • Advantech
    • CW Industries
    • SONIX
    • Fremont Micro Devices
    • Cypress
    • FUDAN
    • IBM MICROELECTRONICS
    • Shenzhen SinOne
    • Toshiba
    • FTDI
    • Power Integrations
    • Megawin
    • Teledyne LeCroy
    • Atmel
    • Freescale
    • Littelfuse
    • NEC
    • Nuvoton
    • Phoenix Contact
    • Realtek
    • Samsung
    • Silicon Labs
    • HiSilicon
    • 3M
    • Honeywell
    • Nexperia
    • Olimex
    • RENERGY
    • ROHM Semiconductor
    • Shenzhen Fuman
    • Taiwan Semiconductor
    • Winbond
    • SMSC
    • Broadcom
    • Fastrax
    • Future Designs
    • GHI Electronics
    • IDT
    • IEI
    • M5Stack
    • Maxscend
    • Melexis
    • Microsemi Vitesse
    • OKI
    • Princeton
    • SGMICRO
    • Sierra Wireless
    • Skyworks
    • Techspray
    • Tontek
    • VIA Tech
    • WIZnet
  • RoHS
  • RAM Size
  • Max Operating Temperature
  • Min Operating Temperature
  • Frequency
  • Case/Package
  • Number of Pins
  • Data Bus Width
  • Max Frequency
  • Interface
  • Memory Size
  • Max Supply Voltage

Attribute column

Categories

Embedded - Microcontroller, Microprocessor, FPGA Modules

View Mode:
2817 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature (Max.)

Operating Temperature (Min.)

Operating Temperature

Packaging

Published

Series

Size / Dimension

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Connector Type

Terminal Finish

Terminal Position

Terminal Form

Supply Voltage

Terminal Pitch

JESD-30 Code

Qualification Status

Power Supplies

Temperature Grade

Speed

RAM Size

Core Processor

Density

Module/Board Type

Flash Size

Co-Processor

RoHS Status

Lead Free

In Stock

-

-

-

Module

-

-

-

-

-

-

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

-

In Stock

-

-

-

Module

-

-

-

-

-

-

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

-

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

-

-

Module

-

-

-

-

Bulk

-

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

Lead Free

In Stock

-

-

-

Module

-

-

-

-

Bulk

2012

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

Lead Free

In Stock

-

-

-

Module

-

-

-

-

Bulk

2006

-

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

Lead Free

TE0713-02-200-2C
TE0713-02-200-2C

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

0°C~70°C

-

-

TE0713

1.57 x 1.97 40mmx50mm

-

Active

Not Applicable

-

B2B

-

-

-

-

-

-

-

-

-

200MHz

1GB

Artix-7 XC7A200T-2FBG484C

-

FPGA Core

32MB

-

ROHS3 Compliant

-

TE0745-02-72I11-A
TE0745-02-72I11-A

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-40°C~85°C

-

-

TE0745

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

Samtec ST5

-

-

-

-

-

-

-

-

-

-

1GB

Xilinx Zynq XC7Z030-2FBG676I

-

MPU Core

64MB

-

ROHS3 Compliant

-

TE0745-02-91C11-A
TE0745-02-91C11-A

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

0°C~70°C

-

-

TE0745

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

Samtec ST5

-

-

-

-

-

-

-

-

-

-

1GB

Xilinx Zynq XC7Z045-1FBG676C

-

MPU Core

64MB

-

ROHS3 Compliant

-

TE0808-04-6BE21-L
TE0808-04-6BE21-L

Trenz Electronic GmbH

799

-

Datasheet

12 Weeks

-

-

-

-

0°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

B2B

-

-

-

-

-

-

-

-

-

-

4GB

Zynq UltraScale+ XCZU6EG-1FFVC900E

-

MPU Core

128MB

-

ROHS3 Compliant

-

TE0808-04-9BE21-A
TE0808-04-9BE21-A

Trenz Electronic GmbH

In Stock

-

Datasheet

14 Weeks

-

-

-

-

0°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

B2B

-

-

-

-

-

-

-

-

-

-

4GB

Zynq UltraScale+ XCZU9EG-1FFVC900E

-

MPU Core

128MB

-

ROHS3 Compliant

-

TE0745-02-93E11-A
TE0745-02-93E11-A

Trenz Electronic GmbH

In Stock

-

Datasheet

12 Weeks

-

-

-

-

0°C~85°C

-

-

TE0745

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

Samtec ST5

-

-

-

-

-

-

-

-

-

-

1GB

ARM® Cortex®-A9

-

MCU, FPGA

64MB

Zynq-7000 (Z-7045)

ROHS3 Compliant

-

FS-325
FS-325

Digi

In Stock

-

-

-

Module

NO

85°C

-20°C

-

-

2014

-

-

e0

Obsolete

1 (Unlimited)

24

-

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

5V

2.54mm

R-XDIP-T24

Not Qualified

5V

OTHER

-

-

-

122.1 Mb

-

-

-

RoHS Compliant

Lead Free

TE0820-03-3BE21FL
TE0820-03-3BE21FL

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

-

-

Active

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

TE0803-03-4DE21-L
TE0803-03-4DE21-L

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

-

-

Active

Not Applicable

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

TE0803-03-5DE11-A
TE0803-03-5DE11-A

Trenz Electronic GmbH

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

-

-

Active

Not Applicable

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

TE0808-04-9GI21-A
TE0808-04-9GI21-A

Trenz Electronic GmbH

18

-

Datasheet

14 Weeks

-

-

-

-

-40°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

B2B

-

-

-

-

-

-

-

-

-

-

4GB

Zynq UltraScale+ XCZU9EG-2FFVC900I

-

MPU Core

128MB

-

ROHS3 Compliant

-

TE0808-04-BBE21-A
TE0808-04-BBE21-A

Trenz Electronic GmbH

In Stock

-

Datasheet

14 Weeks

-

-

-

-

0°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

B2B

-

-

-

-

-

-

-

-

-

-

4GB

Zynq UltraScale+ XCZU15EG-1FFVC900E

-

MPU Core

128MB

-

ROHS3 Compliant

-

TE0808-04-6BE21-A
TE0808-04-6BE21-A

Trenz Electronic GmbH

In Stock

-

Datasheet

14 Weeks

-

-

-

-

0°C~85°C

-

-

TE0808

2.05 x 2.99 52mmx76mm

-

Active

1 (Unlimited)

-

B2B

-

-

-

-

-

-

-

-

-

-

4GB

Zynq UltraScale+ XCZU6EG-1FFVC900E

-

MPU Core

128MB

-

ROHS3 Compliant

-

TE0808-04-9BE21-L
TE0808-04-9BE21-L

Trenz Electronic GmbH

669

-

Datasheet

12 Weeks

-

-

-

-

-

-

-

TE0808

-

-

Active

1 (Unlimited)

-

B2B

-

-

-

-

-

-

-

-

-

-

4GB

-

-

MPU Core

128MB

-

ROHS3 Compliant

-