- Manufacturer
- RoHS
- RAM Size
- Max Operating Temperature
- Min Operating Temperature
- Frequency
- Case/Package
- Number of Pins
- Data Bus Width
- Max Frequency
- Interface
- Memory Size
- Max Supply Voltage
Attribute column
Categories
Embedded - Microcontroller, Microprocessor, FPGA Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Operating Temperature | Published | Series | Size / Dimension | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Speed | RAM Size | Core Processor | Module/Board Type | Flash Size | Co-Processor | RoHS Status |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() TE0745-02-30-1IA-K Trenz Electronic GmbH | In Stock | - | Datasheet | - | -40°C~85°C | - | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | Samtec ST5 | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
![]() TE0808-04-09EG-1EL Trenz Electronic GmbH | In Stock | - | Datasheet | - | 0°C~85°C | - | TE0808 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | B2B | - | 4GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | MPU Core | 128MB | - | ROHS3 Compliant | ||
![]() TE0808-04-09EG-1EK Trenz Electronic GmbH | In Stock | - | Datasheet | - | 0°C~85°C | - | TE0808 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | B2B | - | 2GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | MPU Core | 128MB | - | ROHS3 Compliant | ||
![]() TE0803-03-4AE11-A Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4CG-1SFVC784E | MPU Core | 128MB | - | - | ||
![]() TE0725LP-01-72C-1 Trenz Electronic GmbH | In Stock | - | Datasheet | 12 Weeks | 0°C~70°C | - | TE0725 | 2.87 x 1.38 73mmx35mm | Active | 1 (Unlimited) | 50 Pin | 25MHz | - | Artix-7 A100T | FPGA Core | 64MB | - | - | ||
![]() TE0803-03-2AE11-A Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | 128MB | - | - | ||
![]() TE0803-03-2BE11-A Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | MPU Core | 128MB | - | - | ||
![]() 101-0508 Digi | In Stock | - | Datasheet | - | -40°C~70°C | - | RabbitCore® | 1.85 x 2.73 47mmx69mm | Obsolete | 1 (Unlimited) | 2 IDC Headers 2x17 | 30MHz | 128KB | Rabbit 3000 | MPU Core | 256KB | - | Non-RoHS Compliant | ||
![]() TE0803-03-4DE11-A Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | MPU Core | 128MB | - | - | ||
![]() TE0803-03-3AE11-A Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | 128MB | - | - | ||
![]() 101-0507 Digi | In Stock | - | Datasheet | - | -40°C~70°C | 2007 | RabbitCore® | 1.85 x 2.73 47mmx69mm | Obsolete | 1 (Unlimited) | 2 IDC Headers 2x17 | 30MHz | 128KB | Rabbit 3000 | MPU Core | 256KB | - | Non-RoHS Compliant | ||
![]() DC-ME-01T-TR Digi | In Stock | - | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | ||
![]() CC-WMX-LB69-EYK Digi | In Stock | - | - | - | - | 2016 | ConnectCore® | 1.97 x 3.23 50mmx82mm | Obsolete | 1 (Unlimited) | Board-to-Board (BTB) Socket - 360 | - | - | ARM® Cortex®-A8, i.MX53 | MPU Core | - | - | - | ||
![]() CC-WMX-KD47-VM Digi | In Stock | - | - | - | - | 2016 | ConnectCore® | 1.97 x 3.23 50mmx82mm | Obsolete | 1 (Unlimited) | Board-to-Board (BTB) Socket - 360 | - | - | ARM® Cortex®-A8, i.MX53 | MPU Core | - | - | - | ||
![]() CC-MX-KD47-ZM-B Digi | In Stock | - | - | - | - | 2016 | ConnectCore® | 1.97 x 3.23 50mmx82mm | Obsolete | 1 (Unlimited) | Board-to-Board (BTB) Socket - 360 | 1GHz | - | ARM® Cortex®-A8, i.MX53 | MPU Core | 512MB | - | - | ||
![]() TE0745-02-30-2IA Trenz Electronic GmbH | In Stock | - | Datasheet | 14 Weeks | -40°C~85°C | - | TE0745 | 2.99 x 2.05 76mmx52mm | Obsolete | 1 (Unlimited) | - | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
![]() TE0745-02-45-1CA Trenz Electronic GmbH | In Stock | - | Datasheet | 14 Weeks | 0°C~70°C | - | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | Samtec UFPS | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 32MB | Zynq-7000 (Z-7045) | ROHS3 Compliant | ||
![]() TE0808-04-15EG-1EK Trenz Electronic GmbH | In Stock | - | Datasheet | - | 0°C~85°C | - | TE0808 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | B2B | - | 4GB | Zynq UltraScale+ XCZU15EG-1FFVC900E | MPU Core | 128MB | - | ROHS3 Compliant | ||
![]() DC-ME-01T-MB Digi | In Stock | - | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | ||
![]() CC-9C-V223-ZA Digi | In Stock | - | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - |