- Manufacturer
- RoHS
- RAM Size
- Max Operating Temperature
- Min Operating Temperature
- Frequency
- Case/Package
- Number of Pins
- Data Bus Width
- Max Frequency
- Interface
- Memory Size
- Max Supply Voltage
Attribute column
Categories
Embedded - Microcontroller, Microprocessor, FPGA Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Operating Temperature | Published | Series | Size / Dimension | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Speed | RAM Size | Core Processor | Module/Board Type | Flash Size | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 DC-ME-Y402-AGC-1 Digi | In Stock | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | ||
CC-9C-V223-ZA-B Digi | In Stock | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | ||
DC-ME-01T-INT Digi | In Stock | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | ||
101-1006 Digi | In Stock | - | Datasheet | -40°C~70°C | 2007 | - | 2.35 x 4 60mmx102mm | Obsolete | 1 (Unlimited) | IDC Header 2x25, 2x5, 1x3mm | 51.6MHz | 1MB | Rabbit 3000 | MPU Core | 512KB Internal 1MB External | Non-RoHS Compliant | ||
101-1007 Digi | In Stock | - | Datasheet | -40°C~70°C | - | - | 2.35 x 4 60mmx102mm | Obsolete | 1 (Unlimited) | IDC Header 2x25, 2x5, 1x3mm | 25.8MHz | 256KB | Rabbit 3000 | MPU Core | 512KB | Non-RoHS Compliant | ||
101-0961 Digi | In Stock | - | Datasheet | -40°C~70°C | 2008 | RabbitCore® | 1.2 x 2.95 30mmx75mm | Obsolete | 1 (Unlimited) | IDC Header 2x20 | 22.1MHz | 256KB | Rabbit 3000 | MPU Core | 512KB Internal 1MB External | Non-RoHS Compliant | ||
101-0955 Digi | In Stock | - | Datasheet | -40°C~70°C | 2009 | RabbitCore® | 1.6 x 2.3 41mmx58mm | Obsolete | 1 (Unlimited) | 2 IDC Headers 2x13 | 22.1MHz | - | Rabbit 2000 | MPU Core | 512KB | Non-RoHS Compliant | ||
DC-ME4-01T-VTY Digi | In Stock | - | - | -40°C~85°C | - | Digi Connect ME® | 1.45 x 0.75 36.7mmx19.1mm | Obsolete | 1 (Unlimited) | RJ45 | 55MHz | 8MB | ARM7TDMI, NS7520 | MPU Core | 4MB | - | ||
DC-ME-Y402-TSB-1 Digi | In Stock | - | - | -40°C~85°C | - | Digi Connect ME® | 0.75 x 1.44 19.1mmx36.7mm | Obsolete | 1 (Unlimited) | RJ45 | 75MHz | 8MB | ARM926EJ-S, NS9210 | MPU Core | 4MB | - | ||
DC-ME4-01T-VTY-1 Digi | In Stock | - | - | -40°C~85°C | - | Digi Connect ME® | 1.45 x 0.75 36.7mmx19.1mm | Obsolete | 1 (Unlimited) | RJ45 | 55MHz | 8MB | ARM7TDMI, NS7520 | MPU Core | 4MB | - | ||
DC-ME4-01T-CC Digi | In Stock | - | - | -40°C~85°C | - | Digi Connect ME® | 1.45 x 0.75 36.7mmx19.1mm | Obsolete | Not Applicable | RJ45 | 55MHz | 8MB | ARM7TDMI, NS7520 | MPU Core | 4MB | - | ||
TE0803-02-03-1EA-S Trenz Electronic GmbH | In Stock | - | - | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | FPGA Core | 128MB | - | ||
TEC0850-03-15EG1EA Trenz Electronic GmbH | In Stock | - | - | - | - | TEC0850 | - | Obsolete | Not Applicable | CompactPCI Serial Backplane | - | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | ROHS3 Compliant | ||
TE0841-02-41I21-L Trenz Electronic GmbH | In Stock | - | Datasheet | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | ROHS3 Compliant | ||
 M5475BFE NXP USA Inc. | In Stock | - | - | 0°C~70°C | - | ColdFire® | 3.7 x 4.5 93.4mmx114.3mm | Obsolete | 1 (Unlimited) | - | 266MHz | 64MB | ColdFire V4e, MCF5475 | MPU Core | 16MB | Non-RoHS Compliant | ||
M5475DFE NXP USA Inc. | In Stock | - | - | 0°C~70°C | - | ColdFire® | 3.7 x 4.5 93.4mmx114.3mm | Obsolete | 1 (Unlimited) | - | 266MHz | 64MB | ColdFire V4e, MCF5475 | MPU Core | 2MB Boot | Non-RoHS Compliant | ||
M5485AFE NXP USA Inc. | In Stock | - | - | -40°C~85°C | - | ColdFire® | 3.7 x 4.5 93.4mmx114.3mm | Obsolete | 1 (Unlimited) | - | 200MHz | 64MB | ColdFire V4e, MCF5485 | MPU Core | 2MB Boot | ROHS3 Compliant | ||
TE0803-02-04CG-1EA Trenz Electronic GmbH | In Stock | - | - | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4CG-1SFVC784E | MPU Core | 128MB | - | ||
TE0803-02-03EG-1EA Trenz Electronic GmbH | In Stock | - | - | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | MPU Core | 128MB | - | ||
TEC0850-03-015EG1E Trenz Electronic GmbH | In Stock | - | - | - | - | TEC0850 | - | Obsolete | Not Applicable | CompactPCI Serial Backplane | - | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | ROHS3 Compliant |