- Manufacturer
- RoHS Status
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Part Status
- RAM Size
- Package / Case
- Packaging
- Peripherals
- Core Size
- Mounting Type
- Number of Terminations
- Operating Temperature
Attribute column
Categories
Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Data Converters | Memory Types | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Density | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Max Frequency | Boundary Scan | Low Power Mode | Screening Level | Number of A/D Converters | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Number of UART Channels | Number of ADC Channels | Max Junction Temperature (Tj) | Number of External Interrupts | Number of PWM Channels | Number of I2C Channels | Barrel Shifter | Internal Bus Architecture | On Chip Data RAM Width | Ambient Temperature Range High | Number of DMA Channels | UV Erasable | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 ST7FLIT19BF1M3 STMicroelectronics | 10000 | - | Datasheet | 14 Weeks | - | - | Surface Mount | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | - | 20 | - | - | A/D 7x10b | - | 17 | - | - | - | Yes | -40°C~125°C TA | Tube | - | ST7 | e3 | yes | Active | 3 (168 Hours) | 20 | - | - | Tin (Sn) | - | - | - | - | 300mW | DUAL | GULL WING | - | 5V | 1.27mm | 8MHz | - | ST7FL | 20 | - | - | - | 5.5V | 3/5V | 3.3V | - | - | - | 4kB | Internal | - | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 4KB 4K x 8 | SPI | 9mA | 8 | - | YES | NO | 8b | YES | NO | 4 | - | - | - | 128 x 8 | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 12.8mm | - | - | No | - | ROHS3 Compliant | - | ||
 MK20FN1M0VMD12 NXP USA Inc. | 1 | - | Datasheet | 13 Weeks | - | - | - | Surface Mount | 144-LBGA | YES | - | - | - | A/D 58x16b; D/A 2x12b | - | 100 | - | 1048576 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 144 | - | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 3.3V | 1mm | - | 40 | MK20FN1M0 | - | S-PBGA-B144 | Not Qualified | - | 3.6V | 1.8/3.32.5/3.3V | 1.71V | - | - | - | - | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | - | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | - | YES | YES | - | YES | YES | - | - | - | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | - | - | - | ROHS3 Compliant | - | ||
 CY8C3865AXI-019 Cypress Semiconductor Corp | 5 | - | Datasheet | 16 Weeks | - | Gold | - | Surface Mount | 100-LQFP | YES | 100 | - | - | A/D 16x20b; D/A 4x8b | - | 62 | - | - | - | Yes | -40°C~85°C TA | Tray | 2011 | PSOC® 3 CY8C38xx | e4 | yes | Active | 3 (168 Hours) | 100 | - | 3A991.A.3 | - | - | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 67MHz | 30 | CY8C3865 | 100 | - | - | - | 5.5V | 2/5V | 1.71V | EBI/EMI, I2C, LIN, SPI, UART, USART, USB | - | - | 32kB | Internal | - | 4K x 8 | 1.71V~5.5V | - | - | 8051 | CapSense, DMA, LCD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | EBI/EMI, I2C, LINbus, SPI, UART/USART, USB | - | - | - | - | - | 8b | - | - | 4 | - | - | - | 1K x 8 | - | - | - | YES | - | - | - | - | 72 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | 1.6mm | - | - | - | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 S9S08SG16E1MTJ NXP USA Inc. | 320 | - | Datasheet | 12 Weeks | - | - | - | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | - | - | - | A/D 12x10b | - | 16 | - | - | - | - | -40°C~125°C TA | Tube | 1999 | S08 | - | - | Active | 3 (168 Hours) | 20 | - | 3A991.A.2 | - | - | - | - | 8542.31.00.01 | - | DUAL | GULL WING | 260 | 3V | 0.65mm | - | NOT SPECIFIED | S9S08SG16 | - | - | - | - | 5.5V | - | 2.7V | - | - | - | - | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | - | YES | NO | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 6.5mm | 4.4mm | - | - | - | ROHS3 Compliant | - | ||
 EFM8BB10F2G-A-QFN20 Silicon Labs | 241 | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | 20-UFQFN Exposed Pad | - | 20 | - | - | A/D 15x12b | - | 16 | 256 | - | Automotive grade | Yes | -40°C~85°C TA | Tube | 2014 | Automotive, AEC-Q100, Busy Bee | - | - | Active | 2 (1 Year) | 20 | - | - | - | - | - | - | - | - | QUAD | NO LEAD | - | 3V | 0.5mm | 25MHz | - | - | - | - | - | - | - | - | 2.2V | I2C, SMBus, SPI, UART | - | - | 2kB | Internal | - | 256 x 8 | 2.2V~3.6V | MICROCONTROLLER | - | CIP-51 8051 | Brown-out Detect/Reset, POR, PWM, WDT | - | FLASH | 8-Bit | 2KB 2K x 8 | I2C, SMBus, SPI, UART/USART | - | 8 | - | YES | NO | 12b | - | - | 4 | - | - | 8051 | - | - | - | - | - | - | - | 1 | - | - | - | - | - | - | 15 | 105°C | - | 3 | - | - | - | - | 85°C | - | - | 800μm | - | 3mm | 3mm | - | - | Unknown | RoHS Compliant | - | ||
 PIC32MM0064GPL028-I/SS Microchip Technology | 100 | - | Datasheet | 5 Weeks | - | - | - | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | YES | 28 | - | - | A/D 12x10/12b; D/A 1x5b | - | 22 | - | - | Automotive grade | - | -40°C~85°C TA | Tube | 2016 | PIC® 32MM | - | yes | Active | 1 (Unlimited) | 28 | - | - | - | - | - | ADC ALSO AVAILABLE WITH 10-BIT | - | - | DUAL | GULL WING | - | 3.3V | 0.65mm | 25MHz | - | PIC32MM0064GPL | - | - | - | - | 3.6V | - | 2V | - | - | - | 64kB | Internal | - | 8K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | - | MIPS32® microAptiv™ | Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | IrDA, LINbus, SPI, UART/USART | - | 32 | - | YES | NO | - | YES | YES | - | - | - | - | - | 8 | - | - | - | - | TS 16949 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2mm | 10.2mm | 5.3mm | - | - | No SVHC | ROHS3 Compliant | Lead Free | ||
 MSP430F5132IDAR Texas Instruments | 50 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | - | - | Surface Mount | 38-TSSOP (0.240, 6.10mm Width) | YES | 38 | - | - | A/D 10x10b | - | 29 | - | - | - | Yes | -40°C~85°C TA | Cut Tape (CT) | - | MSP430F5xx | e4 | yes | Active | 2 (1 Year) | 38 | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | - | - | DUAL | GULL WING | 260 | 3V | 0.65mm | 25MHz | - | MSP430 | 38 | - | - | - | 3.6V | - | 2.4V | I2C, IrDA, SCI, SPI, UART, USART | - | - | 8kB | Internal | - | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | - | CPUXV2 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 8KB 8K x 8 | I2C, IrDA, SCI, SPI, UART/USART | - | 16 | - | YES | YES | 16b | YES | NO | 9 | - | - | - | - | - | - | - | YES | YES | - | 8 | - | 27 | - | NO | - | 1 | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | - | 12.5mm | 6.2mm | 1.15mm | No | - | ROHS3 Compliant | Lead Free | ||
 AT32UC3L0256-D3HT Microchip Technology | 6 |
| Datasheet | 16 Weeks | - | - | Surface Mount | Surface Mount | 48-UFLGA Exposed Pad | - | 48 | - | - | A/D 8x12b | - | 36 | - | - | - | Yes | -40°C~85°C TA | Tray | 2009 | AVR®32 UC3 L | - | yes | Active | 3 (168 Hours) | 48 | - | - | - | - | - | - | - | - | BOTTOM | BUTT | - | 1.8V | 0.4mm | 50MHz | - | AT32UC3L0256 | - | - | Not Qualified | 1.8V | 1.98V | 1.81.8/3.3V | - | I2C, SPI, UART, USART | - | - | 256kB | Internal | - | 32K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | - | AVR | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | - | 32 | - | YES | YES | 32b | YES | NO | 6 | - | - | - | - | - | - | - | - | - | - | - | - | 36 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.5mm | - | - | - | No SVHC | ROHS3 Compliant | - | ||
 MK20DX32VLH5 NXP USA Inc. | 10086 | - | Datasheet | 13 Weeks | - | - | - | Surface Mount | 64-LQFP | YES | - | - | - | A/D 13x16b | - | 40 | - | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 64 | - | 3A991.A.2 | Matte Tin (Sn) | - | - | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK20DX32 | - | S-PQFP-G64 | - | - | 3.6V | - | 1.71V | - | - | - | - | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | - | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | - | YES | YES | - | YES | YES | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM7SE32-CU Microchip Technology | In Stock | - | Datasheet | - | - | - | Surface Mount | Surface Mount | 144-LFBGA | - | 144 | 144-BGA (13x13) | - | A/D 8x10b | FLASH | 88 | - | - | - | Yes | -40°C~85°C TA | Tray | 1997 | SAM7SE | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | 85°C | -40°C | - | - | - | - | - | - | - | - | 55MHz | - | AT91SAM7SE32 | - | - | - | - | - | - | - | EBI/EMI, I2C, SPI, UART, USART, USB | 3.6V | 3V | 32kB | Internal | 55MHz | 8K x 8 | 1.65V~1.95V | - | - | ARM7® | Brown-out Detect/Reset, POR, PWM, WDT | - | FLASH | 16/32-Bit | 32KB 32K x 8 | EBI/EMI, I2C, SPI, SSC, UART/USART, USB | - | - | - | - | - | 32b | - | - | 3 | - | - | ARM | - | - | - | 55MHz | - | - | - | - | - | 88 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | - | - | No | - | ROHS3 Compliant | - | ||
 ATSAMS70Q20B-ANT Microchip Technology | 17 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 144-LQFP | YES | - | - | - | A/D 24x12b; D/A 2x12b | - | 114 | - | - | Automotive grade | - | -40°C~105°C TA | Cut Tape (CT) | 2018 | SAM S70 | - | - | Active | 3 (168 Hours) | 144 | - | - | - | - | - | - | - | - | QUAD | GULL WING | - | 1.2V | 0.5mm | - | - | ATSAMS70Q | - | S-PQFP-G144 | - | - | 1.32V | - | 1.08V | - | - | - | - | Internal | 300MHz | 384K x 8 | 1.08V~3.6V | MICROCONTROLLER, RISC | - | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 1MB 1M x 8 | EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB | - | 32 | - | YES | YES | - | YES | YES | - | 24 | - | - | - | 8 | - | - | - | - | TS 16949 | - | 16 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | - | - | - | ROHS3 Compliant | - | ||
 PIC10F222-I/MC Microchip Technology | 161 | - | Datasheet | 6 Weeks | - | - | Surface Mount | Surface Mount | 8-VFDFN Exposed Pad | - | 8 | - | - | A/D 2x8b | - | 4 | - | 512 | - | - | -40°C~85°C TA | Tube | 2006 | PIC® 10F | e3 | yes | Active | 1 (Unlimited) | 8 | - | - | Matte Tin (Sn) | - | - | - | - | 800mW | DUAL | - | 260 | 3V | 0.5mm | 8MHz | 40 | PIC10F222 | 8 | - | - | - | 5.5V | 2.5/5V | 2.5V | USB | - | - | 768B | Internal | - | 23 x 8 | 2V~5.5V | MICROCONTROLLER, RISC | - | PIC | POR, WDT | - | FLASH | 8-Bit | 768B 512 x 12 | - | - | 8 | 8 μs | YES | NO | 8b | NO | NO | 1 | - | - | - | - | - | PIC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3mm | - | - | No | - | ROHS3 Compliant | Lead Free | ||
 MC56F8157VPYE NXP USA Inc. | 33 | - | - | 10 Weeks | - | - | - | Surface Mount | 160-LQFP | YES | - | - | - | A/D 16x12b | - | 76 | - | 262144 | - | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 160 | - | 3A991.A.2 | Matte Tin (Sn) | - | - | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 40 | MC56F8157 | - | S-PQFP-G160 | Not Qualified | - | 2.75V | 2.53.3V | 2.25V | - | - | - | - | External | 40MHz | 8K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | - | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 256KB 128K x 16 | EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | - | - | - | 24 | - | - | - | - | - | - | YES | YES | - | - | 16 | - | FIXED POINT | - | - | - | - | - | - | - | - | YES | MULTIPLE | - | - | - | - | - | 1.6mm | 24mm | 24mm | - | - | - | ROHS3 Compliant | - | ||
 STM32F072C8U6TR STMicroelectronics | 12500 | - | Datasheet | 10 Weeks | ACTIVE (Last Updated: 7 months ago) | - | - | Surface Mount | 48-UFQFN Exposed Pad | YES | - | - | - | A/D 10x12b; D/A 2x12b | - | 37 | - | 65536 | - | - | -40°C~85°C TA | Tape & Reel (TR) | - | STM32F0 | - | - | Active | 3 (168 Hours) | 48 | - | 3A991.A.2 | - | - | - | - | - | - | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | 48MHz | NOT SPECIFIED | STM32F07 | - | S-XQCC-N48 | - | - | 3.6V | - | 2V | CAN, HDMI, I2C, IrDA, LIN, SPI, UART, USART, USB | - | - | 64kB | Internal | - | 16K x 8 | 1.65V~3.6V | MICROCONTROLLER, RISC | - | ARM® Cortex®-M0 | DMA, I2S, POR, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, HDMI-CEC, I2C, IrDA, LINbus, SPI, UART/USART, USB | - | 32 | - | YES | YES | - | YES | YES | - | - | - | ARM | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.6mm | 7mm | 7mm | - | - | - | ROHS3 Compliant | - | ||
 PIC24FJ128GA110-E/PT Microchip Technology | 411 |
| Datasheet | 14 Weeks | - | - | Surface Mount | Surface Mount | 100-TQFP | - | 100 | - | - | A/D 16x10b | - | 85 | - | 131072 | - | Yes | -40°C~125°C TA | Tray | - | PIC® 24F | e3 | - | Active | 3 (168 Hours) | 100 | - | - | Matte Tin (Sn) - annealed | - | - | - | - | - | QUAD | GULL WING | - | - | 0.4mm | 32MHz | - | PIC24FJ128GA110 | 100 | - | - | - | - | - | - | I2C, SPI, UART, USART | - | - | 128kB | Internal | - | 16K x 8 | 2V~3.6V | MICROCONTROLLER | - | PIC | Brown-out Detect/Reset, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 43K x 24 | I2C, PMP, SPI, UART/USART | 24mA | 16 | - | YES | NO | 16b | YES | - | 5 | 24 | - | - | - | - | PIC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 12mm | - | - | No | - | ROHS3 Compliant | - | ||
 MC9S08DN32AMLC NXP USA Inc. | 21 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 32-LQFP | - | - | 32-LQFP (7x7) | - | A/D 10x12b | - | 25 | - | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MC9S08DN32 | - | - | - | - | - | - | - | - | - | - | - | External | 40MHz | 1.5K x 8 | 2.7V~5.5V | - | - | S08 | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
PIC16LF1906-I/SS Microchip Technology | 2032 | - | Datasheet | 9 Weeks | - | - | - | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | YES | 28 | - | - | A/D 11x10b | - | 25 | - | - | - | Yes | -40°C~85°C TA | Tube | 2010 | PIC® XLP™ 16F | e3 | - | Active | 1 (Unlimited) | 28 | - | EAR99 | Matte Tin (Sn) - annealed | - | - | - | - | 800mW | DUAL | GULL WING | 260 | 2.5V | 0.65mm | 20MHz | 40 | PIC16LF1906 | 28 | - | - | - | 3.6V | - | - | LIN, UART, USART | - | - | 14kB | Internal | - | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | 8 | PIC | Brown-out Detect/Reset, LCD, POR, PWM, WDT | - | FLASH | 8-Bit | 14KB 8K x 14 | LINbus, UART/USART | - | 8 | - | YES | YES | 8b | NO | - | 2 | - | - | - | - | - | PIC | - | - | - | - | 1 | - | - | - | - | - | - | 11 | - | - | - | - | - | - | - | - | - | - | 1.85mm | - | 10.5mm | 5.6mm | - | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 SPC5642AF2MLU1 NXP USA Inc. | 52 | - | Datasheet | 12 Weeks | - | - | - | Surface Mount | 176-LQFP | YES | - | - | - | A/D 40x12b | - | 84 | 131072 | 2097152 | Automotive grade | - | -40°C~125°C TA | Tray | 2004 | MPC56xx Qorivva | e3 | - | Active | 3 (168 Hours) | 176 | - | 3A991.A.2 | Matte Tin (Sn) | - | - | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 1.2V | 0.5mm | - | 40 | - | - | S-PQFP-G176 | Not Qualified | - | 1.32V | 1.2V | 1.14V | - | - | - | - | Internal | 150MHz | 128K x 8 | 1.14V~5.25V | MICROCONTROLLER, RISC | - | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI | 400mA | 32 | - | YES | YES | - | YES | - | - | - | - | - | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24mm | 24mm | - | - | - | ROHS3 Compliant | - | ||
 PIC32MX570F512L-I/PF Microchip Technology | 100 | - | Datasheet | 13 Weeks | - | - | - | Surface Mount | 100-TQFP | YES | 100 | - | 657.000198mg | A/D 48x10b | - | 81 | - | 131072 | - | Yes | -40°C~85°C TA | Tray | 2011 | PIC® 32MX | e3 | - | Active | 3 (168 Hours) | 100 | - | - | Matte Tin (Sn) - annealed | - | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | - | 40MHz | 40 | PIC32MX570F512L | - | - | - | - | 3.6V | - | 2.3V | CAN, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | - | - | 512kB | Internal | - | 64K x 8 | 2.3V~3.6V | MICROCONTROLLER, RISC | - | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | - | 32 | - | YES | YES | 32b | YES | NO | 5 | 16 | - | PIC | - | 32 | PIC | - | - | YES | - | - | - | - | - | NO | 16384 | - | - | - | 5 | - | - | - | - | 32 | - | 4 | - | - | 1.2mm | 16mm | - | - | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 PIC24FJ64GB002-I/SP Microchip Technology | 140 | - | Datasheet | 17 Weeks | - | - | Through Hole | Through Hole | 28-DIP (0.300, 7.62mm) | - | 28 | - | - | A/D 9x10b | - | 19 | - | - | - | Yes | -40°C~85°C TA | Tube | 2008 | PIC® XLP™ 24F | e3 | yes | Active | 1 (Unlimited) | 28 | Through Hole | - | Matte Tin (Sn) | - | - | - | - | - | DUAL | - | - | - | - | 32MHz | - | PIC24FJ64GB002 | 28 | - | - | - | - | - | - | I2C, IrDA, LIN, SPI, UART, USART, USB | - | - | 64kB | Internal | - | 8K x 8 | 2V~3.6V | MICROCONTROLLER | - | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 22K x 24 | I2C, IrDA, SPI, UART/USART, USB OTG | - | 16 | - | - | - | 16b | - | - | - | - | 512 kb | - | - | - | PIC | - | - | - | - | - | - | - | - | - | - | - | 9 | - | - | 5 | 2 | - | - | - | - | - | - | 3.81mm | - | 35.56mm | 7.493mm | - | No | No SVHC | ROHS3 Compliant | Lead Free |