Home /All Categories /Integrated Circuits (ICs) /Embedded - Microcontrollers - Application Specific /
Filters
  • Manufacturer
    • Infineon
    • Cypress
    • Microchip
    • NXP
    • Rochester Electronics
    • Texas Instruments
    • STMicroelectronics
    • AMD
    • Silicon Labs
    • Analog Devices, Inc.
    • IDT
    • pSemi
    • Intel
    • Micro Crystal
    • SMSC
    • Philips
    • Broadcom
    • Renesas
    • Xilinx
    • Freescale
    • Microsemi
    • SEIKO
    • Atmel
    • National Semiconductor
    • Intersil
    • Toshiba
    • Epson
    • CONEXANT
    • Power Integrations
    • IXYS Zilog
    • Maxim Integrated
    • MOTOROLA
    • Digi
    • Melexis
    • PLX Technology
    • Fairchild
    • Micrel
    • Nuvoton
    • Integrated Circuit Systems
    • ON Semiconductor
    • Pericom
    • NEC
    • Taiwan Semiconductor
    • International Rectifier
    • Exar Corporation
    • RICOH
    • Adesto
    • Cirrus Logic
    • HARRIS
    • NJR CORPORATION
    • Realtek
    • Qorvo
    • Silicon Storage Tech
    • Unitrode
    • DIGITAL
    • Skyworks
    • ABLIC
    • Qualcomm
    • Torex Semiconductor
    • Bridgetek
    • MAXIM Dallas
    • Silicon Laboratories Inc
    • Winbond
    • HITACHI
    • SanDisk
    • Sanyo
    • Siemens
    • Prolific
    • AVAGO
    • Yageo
    • ALLIANCE SEMICONDUCTOR
    • ALTERA
    • Fujitsu
    • Semtech
    • Silego
    • Cavium
    • FTDI
    • General Electric
    • Genesys
    • Mitsubishi
    • LAPIS
    • AMCC
    • IBM MICROELECTRONICS
    • Lantiq
    • Lattice Semiconductor
    • MARVELL
    • Nexperia
    • Rockwell
    • Dialog
    • Diodes
    • Holtek
    • Illinois Capacitor
    • Inphi
    • MaxLinear
    • OKI
    • Precision Electronics
    • MediaTek
    • RichWave
    • 4D Systems
    • Agere Systems
    • CHAMPION
    • Greenlee
    • Laird
    • Marktech Optoelectronics
    • Microsemi Vitesse
    • Mindspeed
    • Mitsumi
    • NIC Components
    • Nordic
    • SOLOMON
    • TOKO
    • Advanced
    • Chrontel
    • Conxall
    • CSR
    • Espressif Systems
    • Holt Integrated Circuits
    • MACOM
    • MegaChips
    • Molex
    • OmniVision
    • Panasonic
    • Richtek
    • Samsung
    • Silergy
    • Silicon Motion
    • Spectrum
    • TDK
    • TDK Micronas
    • Techspray
    • Teledyne LeCroy
    • Transcend
    • VIA Tech
    • TEMIC
    • Coolgear
    • Advantech
    • Allied Electronics
    • AME
    • AMI Semiconductor
    • AMS
    • Belden
    • Calogic
    • CEL
    • Cherry
    • CHERRY SEMICONDUCTOR CORP
    • Cinch Connectivity Solutions
    • CONNFLY
    • Cortina Systems
    • Desco
    • Diptronics
    • Displaytech
    • Eaton
    • Ericsson
    • Etron Technology
    • Eutech Microelectronics
    • Fortune
    • FUDAN
    • Hamlin
    • Hokuriku
    • ISSI
    • Kingston
    • KOA Speer
    • Linear Technology
    • Littelfuse
    • Micro Commercial Components
    • Micro Linear
    • Microsemi ZARLINK
    • Olimex
    • Parallax
    • PHASELINK
    • ROHM Semiconductor
    • Seaward
    • SHANGHAI BELLING
    • Shindengen
    • SIMTEK
    • SK HYNIX INC
    • Taitien
    • Taitron
    • TE Connectivity
    • Xicor
    • XP Power
    • Yamaha
    • Agilent
  • Applications
  • Interface
  • Moisture Sensitivity Level (MSL)
  • Mounting Type
  • Operating Temperature
  • Package / Case
  • Packaging
  • Part Status
  • Core Processor
  • RoHS Status
  • Factory Lead Time
  • Program Memory Type

Attribute column

Categories

Embedded - Microcontrollers - Application Specific

View Mode:
5057 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Surface Mount

Number of Terminals

Clock Frequency-Max

Date Of Intro

Ihs Manufacturer

Moisture Sensitivity Levels

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Temperature Grade

uPs/uCs/Peripheral ICs Type

Supply Current-Max

Seated Height-Max

Address Bus Width

Primary Clock/Crystal Frequency-Nom

Boundary Scan

Low Power Mode

External Data Bus Width

Output Clock Frequency-Max

RAM (words)

Number of Serial I/Os

Bus Compatibility

Data Transfer Rate-Max

Communication Protocol

Data Encoding/Decoding Method

Length

Width

AV9173-15CS08LF
AV9173-15CS08LF

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

8

-

-

INTEGRATED DEVICE TECHNOLOGY INC

-

70 °C

-

PLASTIC/EPOXY

SOP

SOIC-8

-

RECTANGULAR

SMALL OUTLINE

Transferred

SOIC

Yes

5.25 V

4.75 V

5 V

e3

Yes

EAR99

MATTE TIN

8542.39.00.01

DUAL

GULL WING

-

1.27 mm

compliant

-

8

R-PDSO-G8

Not Qualified

COMMERCIAL

CLOCK GENERATOR, VIDEO

-

-

-

1 MHz

-

-

-

37.5 MHz

-

-

-

-

-

-

4.9 mm

3.9 mm

XCZU9CG-1SBVA484I
XCZU9CG-1SBVA484I

AMD Xilinx

In Stock

-

Datasheet

YES

484

-

-

XILINX INC

-

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA484,22X22,32

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Transferred

-

Yes

0.876 V

0.825 V

0.85 V

-

-

-

-

8542.31.00.01

BOTTOM

BALL

-

0.8 mm

unknown

-

-

S-PBGA-B484

-

INDUSTRIAL

PROGRAMMABLE SoC

-

2.61 mm

-

-

-

-

-

-

-

-

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

-

-

-

19 mm

19 mm

R6551APE
R6551APE

Conexant Systems Inc

In Stock

-

Datasheet

NO

28

2 MHz

-

CONEXANT SYSTEMS

-

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP, DIP28,.6

DIP28,.6

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

e0

-

-

TIN LEAD

8542.31.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

compliant

-

28

R-PDIP-T28

Not Qualified

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

-

5.588 mm

2

-

NO

NO

8

-

0

1

R65C00; R6500

0.00234375 MBps

ASYNC, BIT

NRZ

36.957 mm

15.24 mm

MB88154PNF-G-103-JN-ERE1
MB88154PNF-G-103-JN-ERE1

FUJITSU Limited

In Stock

-

Datasheet

YES

8

-

-

FUJITSU LTD

-

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP, SOP8,.25

SOP8,.25

RECTANGULAR

SMALL OUTLINE

Obsolete

-

Yes

3.6 V

3 V

3.3 V

-

-

EAR99

-

8542.39.00.01

DUAL

GULL WING

NOT SPECIFIED

1.27 mm

compliant

NOT SPECIFIED

-

R-PDSO-G8

Not Qualified

INDUSTRIAL

CLOCK GENERATOR, OTHER

7 mA

1.75 mm

-

40 MHz

-

-

-

40 MHz

-

-

-

-

-

-

5.05 mm

3.9 mm

XCZU15EG-2LFFVC900E
XCZU15EG-2LFFVC900E

AMD

In Stock

-

Datasheet

YES

900

-

-

ADVANCED MICRO DEVICES INC

4

110 °C

-

PLASTIC/EPOXY

BGA

FCBGA-900

BGA900,30X30,40

SQUARE

GRID ARRAY

Active

-

Yes

-

-

0.85 V

e1

-

-

TIN SILVER COPPER

-

BOTTOM

BALL

-

1 mm

compliant

-

-

S-PBGA-B900

-

OTHER

PROGRAMMABLE SoC

-

3.42 mm

-

-

-

-

-

-

-

-

CAN, I2C, SPI, UART

-

-

-

31 mm

31 mm

PSD68/18
PSD68/18

POWER SEMICONDUCTORS INC

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SAF82526N
SAF82526N

Siemens

In Stock

-

Datasheet

YES

44

-

-

SIEMENS A G

-

85 °C

-40 °C

PLASTIC/EPOXY

-

,

-

SQUARE

CHIP CARRIER

Obsolete

-

-

5.25 V

4.75 V

5 V

-

-

-

-

-

QUAD

J BEND

-

-

unknown

-

-

S-PQCC-J44

Not Qualified

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

-

-

8

-

NO

NO

8

-

-

2

8051; 80188; 80186

0.5 MBps

SYNC, HDLC; SYNC, SDLC; LAPB; LAPD

-

-

-

SAF82526N
SAF82526N

Lantiq

In Stock

-

Datasheet

YES

44

19.3 MHz

-

LANTIQ

-

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

PLASTIC, LCC-44

-

SQUARE

CHIP CARRIER

Transferred

LCC

No

5.25 V

4.75 V

5 V

e0

No

-

TIN LEAD

8542.31.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

44

S-PQCC-J44

Not Qualified

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

-

4.57 mm

7

-

NO

YES

8

-

-

2

8051; 80188; 80186

0.5 MBps

SYNC, HDLC; SYNC, SDLC; X.25

NRZ; NRZI

16.6 mm

16.6 mm

29F68AQC
29F68AQC

Texas Instruments

In Stock

-

Datasheet

YES

52

-

-

NATIONAL SEMICONDUCTOR CORP

-

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC52,.8SQ

LDCC52,.8SQ

SQUARE

CHIP CARRIER

Obsolete

-

No

-

-

5 V

e0

-

-

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-PQCC-J52

Not Qualified

COMMERCIAL

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SH1202-FG
SH1202-FG

Semtech Corporation

In Stock

-

Datasheet

YES

32

-

-

SEMTECH CORP

-

85 °C

-20 °C

PLASTIC/EPOXY

LQFP

LQFP, QFP32,.35SQ,32

QFP32,.35SQ,32

SQUARE

FLATPACK, LOW PROFILE

Obsolete

QFP

No

5.5 V

4 V

5 V

e0

-

-

TIN LEAD

8542.31.00.01

QUAD

GULL WING

-

0.8 mm

unknown

-

32

S-PQFP-G32

Not Qualified

OTHER

MICROPROCESSOR CIRCUIT

6.5 mA

1.55 mm

-

-

-

-

-

-

-

-

-

-

-

-

7 mm

7 mm

PSD411A1-C-20L
PSD411A1-C-20L

Waferscale Integration Inc

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

XCZU5EG-2LFBVB900E
XCZU5EG-2LFBVB900E

AMD

In Stock

-

Datasheet

YES

900

-

-

ADVANCED MICRO DEVICES INC

4

110 °C

-

PLASTIC/EPOXY

BGA

FCBGA-900

BGA900,30X30,40

SQUARE

GRID ARRAY

Active

-

Yes

-

-

0.85 V

e1

-

-

TIN SILVER COPPER

-

BOTTOM

BALL

245

1 mm

compliant

30

-

S-PBGA-B900

-

OTHER

PROGRAMMABLE SoC

-

2.88 mm

-

-

-

-

-

-

-

-

CAN, I2C, SPI, UART

-

-

-

31 mm

31 mm

SM3257EN
SM3257EN

Silicon Motion Technology Corp

In Stock

-

Datasheet

-

-

-

-

SILICON MOTION TECHNOLOGY CORP

-

-

-

-

-

-

-

-

-

Contact Manufacturer

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

-

-

-

unknown

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

9SQ445NDGI
9SQ445NDGI

Renesas Electronics Corporation

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

9250CF-08
9250CF-08

Integrated Device Technology Inc

In Stock

-

Datasheet

-

-

-

-

INTEGRATED DEVICE TECHNOLOGY INC

1

-

-

-

-

,

-

-

-

Obsolete

-

No

-

-

-

e0

-

EAR99

TIN LEAD

8542.39.00.01

-

-

225

-

not_compliant

20

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

XCZU6CG-1SFVC784E
XCZU6CG-1SFVC784E

AMD Xilinx

In Stock

-

Datasheet

YES

784

-

-

XILINX INC

4

100 °C

-

PLASTIC/EPOXY

FBGA

FBGA, BGA78428X28,32

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

Transferred

-

Yes

0.876 V

0.825 V

0.85 V

-

-

-

TIN SILVER COPPER

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

-

S-PBGA-B784

-

OTHER

PROGRAMMABLE SoC

-

3.32 mm

-

-

-

-

-

-

-

-

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

-

-

-

23 mm

23 mm

XCZU6CG-1SFVC784E
XCZU6CG-1SFVC784E

AMD

In Stock

-

Datasheet

YES

784

-

-

ADVANCED MICRO DEVICES INC

4

100 °C

-

PLASTIC/EPOXY

FBGA

BGA-784

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

Active

-

Yes

0.876 V

0.825 V

0.85 V

e1

-

-

TIN SILVER COPPER

-

BOTTOM

BALL

250

0.8 mm

compliant

30

-

S-PBGA-B784

-

OTHER

PROGRAMMABLE SoC

-

3.32 mm

-

-

-

-

-

-

-

-

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

-

-

-

23 mm

23 mm

NAS8304-7
NAS8304-7

Heartland Precision Fasteners Inc

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

CY28404OXCT
CY28404OXCT

Silicon Laboratories Inc

In Stock

-

Datasheet

YES

48

-

-

SPECTRALINEAR INC

1

70 °C

-

PLASTIC/EPOXY

SSOP

SSOP,

-

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Obsolete

SSOP

Yes

3.465 V

3.135 V

3.3 V

-

Yes

EAR99

-

8542.39.00.01

DUAL

GULL WING

-

0.635 mm

unknown

-

48

R-PDSO-G48

Not Qualified

COMMERCIAL

CLOCK GENERATOR, PROCESSOR SPECIFIC

-

2.794 mm

-

14.318 MHz

-

-

-

200.9 MHz

-

-

-

-

-

-

15.875 mm

7.5057 mm

XCZU7EV-3FBVB900I
XCZU7EV-3FBVB900I

AMD Xilinx

In Stock

-

Datasheet

YES

900

-

2017-02-15

XILINX INC

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Transferred

-

Yes

-

-

0.9 V

e1

-

-

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.31.00.01

BOTTOM

BALL

245

1 mm

compliant

30

-

S-PBGA-B900

-

INDUSTRIAL

PROGRAMMABLE SoC

-

2.97 mm

-

-

-

-

-

-

-

-

-

-

-

-

31 mm

31 mm

Account Center (0 Items)

It is empty.