- Manufacturer
- Applications
- Interface
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Core Processor
- RoHS Status
- Factory Lead Time
- Program Memory Type
Attribute column
Categories
Embedded - Microcontrollers - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Drive Interface Standard | Display Configuration | Length | Width |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() KM68LC302PU20VCT Freescale Semiconductor | In Stock | - | Datasheet | YES | 100 | 20 MHz | - | FREESCALE SEMICONDUCTOR INC | 3 | - | - | PLASTIC/EPOXY | LFQFP | 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASITC, LQFP-100 | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | QUAD | GULL WING | 220 | 0.5 mm | not_compliant | 30 | 100 | S-PQFP-G100 | Not Qualified | - | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 1.7 mm | 24 | - | YES | NO | 16 | - | 4 | 68000 | 1.25 MBps | MIL STD 1553A; MIL STD 1553B | - | - | 14 mm | 14 mm | ||
![]() SPC8106F0C Seiko Epson Corporation | In Stock | - | Datasheet | YES | 144 | - | - | SEIKO EPSON CORP | - | 70 °C | - | PLASTIC/EPOXY | FQFP | FQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | No | - | - | 5 V | e0 | - | - | TIN LEAD | - | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G144 | Not Qualified | COMMERCIAL | DISPLAY CONTROLLER, CRT OR FLAT PANEL GRAPHICS DISPLAY | 3 mm | - | - | - | - | - | - | - | ISA | - | - | - | 1024 X 768 DOTS | 20 mm | 20 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 1156 | - | - | ADVANCED MICRO DEVICES INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | - | - | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | 35 mm | 35 mm | ||
![]() MB8877 FUJITSU Limited | In Stock | - | Datasheet | - | - | - | - | FUJITSU LTD | - | - | - | - | - | , | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() CY2412SC-3 Rochester Electronics LLC | In Stock | - | Datasheet | YES | 8 | - | - | ROCHESTER ELECTRONICS LLC | - | 70 °C | - | PLASTIC/EPOXY | SOP | 0.150 INCH, MS-012, SOIC-8 | - | RECTANGULAR | SMALL OUTLINE | Active | SOIC | No | 3.47 V | 3.14 V | 3.3 V | e0 | No | - | TIN LEAD | - | - | DUAL | GULL WING | NOT SPECIFIED | 1.27 mm | unknown | NOT SPECIFIED | 8 | R-PDSO-G8 | COMMERCIAL | COMMERCIAL | CLOCK GENERATOR, VIDEO | 1.727 mm | - | 13.5 MHz | - | - | - | 54 MHz | - | - | - | - | - | - | 4.889 mm | 3.8985 mm | ||
![]() ICS950224AFT Integrated Circuit Systems Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() XCZU6CG-2SFVC784I AMD Xilinx | In Stock | - | Datasheet | YES | 784 | - | - | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | 23 mm | 23 mm | ||
![]() RTL8111FR-CG Realtek Semiconductor | In Stock | - | Datasheet | YES | 128 | 25 MHz | - | REALTEK SEMICONDUCTOR CORP | - | 70 °C | - | PLASTIC/EPOXY | FQFP | FQFP, | - | RECTANGULAR | FLATPACK, FINE PITCH | Active | QFP | - | 1.89 V | 1.71 V | 1.8 V | - | - | - | - | ALSO REQUIRES 3.3 V AND 2 .1 V TYP SUPPLY | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 128 | R-PQFP-G128 | - | COMMERCIAL | BUS CONTROLLER, PCI | 3.4 mm | - | - | - | - | - | - | - | - | 12.5 MBps | - | IEEE 802.3; IEEE 802.3A; IEEE | - | 20 mm | 14 mm | ||
![]() AO100/4G/SMA AAMP Global | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 625 | - | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B625 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | 21 mm | 21 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 1760 | - | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1760 | - | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.9 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B1760 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | - | - | - | - | - | - | - | - | - | - | - | - | 42.5 mm | 42.5 mm | ||
![]() XCZU19EG-3FFVC1760I AMD Xilinx | In Stock | - | Datasheet | YES | 1760 | - | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | - | Yes | - | - | 0.9 V | e1 | - | - | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1760 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | - | - | - | - | - | - | - | - | - | - | - | - | 42.5 mm | 42.5 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 900 | - | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | 0.742 V | 0.698 V | 0.72 V | e1 | - | - | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | 31 mm | 31 mm | ||
![]() UPD800477F1-412-EAM-A Renesas Electronics Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MK3754SLFTR Integrated Device Technology Inc | In Stock | - | Datasheet | YES | 8 | - | - | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | Yes | 3.45 V | 3.15 V | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) - annealed | - | 8542.39.00.01 | DUAL | GULL WING | 260 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.75 mm | - | 13.5 MHz | - | - | - | 54 MHz | - | - | - | - | - | - | 4.9 mm | 3.9 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 625 | - | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B625 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | 21 mm | 21 mm | ||
![]() S82379AB Intel Corporation | In Stock | - | Datasheet | YES | 208 | 33 MHz | - | INTEL CORP | - | - | - | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | - | - | - | 5 V | - | - | 3A991.A.2 | - | INTERRUPT CONTROLLER | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | Not Qualified | - | BUS CONTROLLER, ISA | 3.86 mm | 32 | - | - | - | 32 | - | - | PCI | - | - | - | - | 28 mm | 28 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | 23 mm | 23 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | - | ADVANCED MICRO DEVICES INC | 4 | 110 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | OTHER | PROGRAMMABLE SoC | 3.32 mm | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | 23 mm | 23 mm | ||
![]() CH9203CL-NC Chrontel Inc | In Stock | - | Datasheet | NO | 20 | - | - | CHRONTEL INC | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T20 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | - | - | 14.318 MHz | - | - | - | 80 MHz | - | - | - | - | - | - | - | - |