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Embedded - Microcontrollers - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Number of Bits | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Host Data Transfer Rate-Max | Length | Width |
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 C6003BZ Cypress Semiconductor | In Stock | - | Datasheet | YES | 8 | - | - | CYPRESS SEMICONDUCTOR CORP | 1 | - | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.63 V | 2.97 V | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1.27 mm | unknown | - | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | - | CLOCK GENERATOR, OTHER | - | - | 1.75 mm | - | 24 MHz | - | - | - | - | 24 MHz | - | - | - | - | - | - | - | 4.9 mm | 3.9 mm | ||
FW82830M Intel Corporation | 35 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
WD8250CL-20 Western Digital Corp | In Stock | - | Datasheet | NO | 40 | - | - | WESTERN DIGITAL CORP | - | - | 70 °C | - | CERAMIC | DIP | - | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | 5 V | e0 | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-XDIP-T40 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M29313-12P MACOM | In Stock | - | Datasheet | - | - | - | - | M/A-COM TECHNOLOGY SOLUTIONS INC | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M29313-12P Mindspeed Technologies Inc | In Stock | - | Datasheet | - | - | - | - | MINDSPEED TECHNOLOGIES INC | - | - | - | - | - | - | , | - | - | - | Transferred | - | No | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
PSD403A2-C-15J Waferscale Integration Inc | In Stock | - | Datasheet | YES | 68 | - | - | WAFERSCALE INTEGRATION INC | - | 40 | 70 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LDCC-68 | - | SQUARE | CHIP CARRIER | Transferred | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | QUAD | J BEND | - | - | unknown | - | - | S-PQCC-J68 | Not Qualified | COMMERCIAL | 5 | PARALLEL IO PORT, GENERAL PURPOSE | - | - | 4.57 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24.18 mm | 24.2316 mm | ||
PSB82313M Intel Corporation | In Stock | - | Datasheet | - | - | - | 2017-10-29 | INTEL CORP | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | compliant | - | - | - | - | - | - | RFSoC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | - | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | OTHER | - | PROGRAMMABLE SoC | - | - | 3.32 mm | - | - | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | 23 mm | 23 mm | ||
XCZU9CG-2SFVC784E AMD Xilinx | In Stock | - | Datasheet | YES | 784 | - | - | XILINX INC | 4 | - | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | - | S-PBGA-B784 | - | OTHER | - | PROGRAMMABLE SoC | - | - | 3.32 mm | - | - | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | 23 mm | 23 mm | ||
 TMPZ84C42AP-6 Toshiba America Electronic Components | In Stock | - | Datasheet | NO | 40 | 6.144 MHz | - | TOSHIBA CORP | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 40 | R-PDIP-T40 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | 10 mA | 4.8 mm | 1 | - | NO | NO | - | 8 | - | 0 | 2 | Z80 | 0.09765625 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | NRZ | - | 50.7 mm | 15.24 mm | ||
TXC-06840AIOG Tri-Star Electronics International | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
S82434NXSZ928 Intel Corporation | In Stock | - | - | YES | 208 | - | - | INTEL CORP | - | - | - | - | PLASTIC/EPOXY | QFP | - | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Obsolete | - | No | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | - | S-PQFP-G208 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 1156 | - | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 3.42 mm | - | - | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | 35 mm | 35 mm | ||
 AM2951DMB AMD | In Stock | - | Datasheet | NO | 28 | - | - | ADVANCED MICRO DEVICES INC | - | 16 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 28 | R-CDIP-T28 | Not Qualified | MILITARY | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | - | 5.715 mm | - | - | - | - | MIL-STD-883 Class B (Modified) | - | - | - | - | - | - | - | - | - | 37.338 mm | 15.24 mm | ||
PT8A3293WE Pericom Technology Inc | In Stock | - | Datasheet | - | - | - | - | PERICOM TECHNOLOGY INC | - | - | - | - | - | - | , | - | - | - | Transferred | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
R65C21P1 Conexant Systems Inc | In Stock | - | Datasheet | NO | 40 | 1 MHz | - | CONEXANT SYSTEMS | - | 16 | 70 °C | - | PLASTIC/EPOXY | DIP | PLASTIC, DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | compliant | - | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | - | 1.9 mA | 5.08 mm | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | 52.07 mm | 15.24 mm | ||
PCA8514P NXP Semiconductors | In Stock | - | Datasheet | NO | 24 | - | - | NXP SEMICONDUCTORS | - | - | 70 °C | -20 °C | PLASTIC/EPOXY | SDIP | - | SDIP24,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | Active | - | - | - | - | 5 V | - | - | - | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 1.78 mm | compliant | - | - | R-PDIP-T24 | Not Qualified | COMMERCIAL | - | GRAPHICS PROCESSOR | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
PSB21553E Intel Corporation | In Stock | - | Datasheet | YES | 324 | - | - | INTEL CORP | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | compliant | - | - | S-PBGA-B324 | - | - | - | MICROPROCESSOR CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
SDIN8DE4-32G-I SanDisk Corporation | In Stock | - | Datasheet | YES | - | - | - | SANDISK CORP | - | - | 85 °C | -25 °C | UNSPECIFIED | DIE | DIE, | - | RECTANGULAR | UNCASED CHIP | Obsolete | - | - | 3.6 V | 2.7 V | 3.3 V | - | - | - | 8542.31.00.01 | UPPER | NO LEAD | - | - | unknown | - | - | R-XUUC-N | - | OTHER | - | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 120 MBps | - | - | ||
PT7A6525M Pericom Technology Inc | In Stock | - | Datasheet | YES | 44 | - | - | PERICOM TECHNOLOGY INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP44,.5SQ,32 | QFP44,.5SQ,32 | SQUARE | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | - | 8 mA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |