-

YES

metal

-

24

-

-

-

15 mA

2019-03-12

-

8.30

SILICON LABORATORIES INC

-

-

Ф10 mm

220 V

-

85 °C

-40 °C

-

UNSPECIFIED

HVQCCN

QFN-24

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Active

-

-

Yes

10000 hours

3.6 V

3 V

3.3 V

-

-

-

47*35*25/2500

-

e3

-

LED indicator in housing series L-616

-

MATTE TIN

green

-

8542.31.00.01

QUAD

NO LEAD

260

0.5 mm

34 mm

compliant

-

-

S-XQCC-N24

-

-

INDUSTRIAL

-

-

-

BUS CONTROLLER, UNIVERSAL SERIAL BUS

-

-

0.8 mm

-

-20…+55 °C

-

-

-

-

-

-

-

-

-

-

UART

1.5 MBps

-

-

-

-

-

2

-

RS232; RS485

-

Ф12 mm

-

4 mm

4 mm

-

YES

-

-

20

-

16.5 mm

-

-

-

at least: 1200 (AC) V

5.20

SILICON LABORATORIES INC

-

-

-

-

-

85 °C

-40 °C

70 ± 5 °C

UNSPECIFIED

HVQCCN

4 X 4 MM, MO-220VGGD-8, QFN-20

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

-

50 ± 10 °C

Yes

-

2.75 V

2.25 V

2.5 V

SPST NC - normally closed contact

-

-

28.5*21*19/1000

-25 …+300 °C

-

EAR99

-

-

-

-

ALSO OPERATES AT 3.3 V SUPPLY

8542.39.00.01

QUAD

NO LEAD

260

0.5 mm

on the holder -32.5; on the contacts -33.2 mm

compliant

40

-

S-XQCC-N20

-

≥100000 cycles

INDUSTRIAL

≥100 MΩ

-

-

CLOCK GENERATOR, PROCESSOR SPECIFIC

-

-

0.9 mm

-

-

10 A

27 MHz

-

-

-

160 MHz

-

-

-

-

-

-

-

-

-

-

-

2

250 V

-

-

-

11.5 mm

4 mm

4 mm

-

-

-

390 g

-

-

-

-

-

-

2500 (50 Hz / 1 min.) V

506.67

AME INC

~440 V

-

-

-

-30…+75 °C

-

-

-

-

-

,

-

-

-

Contact Manufacturer

-

-

-

-

-

-

-

-

-

-

43*24.5*18.5/30

-

-

-

Three-phase solid state relay series 3SSR

-

-

-

-

8542.31.00.01

-

-

-

-

105 mm

compliant

-

-

-

-

-

-

≥1000 (at Uins.dc=500 V) MOhm

5 (~100 V); 10 (~200 V) mA

-

-

-

R - with instantaneous (random) turn-on

-

-

-

-

-

-

-

-

-

-

120 A

-

-

-

-

≤40 mA

-

3...32 (DC) V

-

≤10 ms

-

-

-

-

-

33 mm

-

74 mm

-

YES

-

390 g

60

-

-

-

-

-

2500 (50 Hz / 1 min.) V

-

RAIO TECHNOLOGY INC

~440 V

-

-

-

-30…+75 °C

-

-

-

PLASTIC/EPOXY

QFP

LEAD FREE, QFP-60

-

RECTANGULAR

FLATPACK

Contact Manufacturer

QFP

-

-

-

5.5 V

2.7 V

3.5 V

-

-

-

-

-

-

-

Three-phase solid state relay series 3SSR

-

-

-

-

8542.31.00.01

QUAD

GULL WING

-

-

105 mm

unknown

-

60

R-PQFP-G60

Not Qualified

-

-

≥1000 (at Uispl.dc=500 V) MOm

5 (~100 V); 10 (~200 V) mA

-

DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER

-

R - with instantaneous (random) activation

-

16

-

-

-

-

-

8

-

-

25 A

-

-

8080; 6800

-

≤40 mA

-

90...240 (AC) V

-

≤10 ms

-

-

-

640 X 256 PIXELS

-

33 mm

-

74 mm

-

YES

-

-

44

-

-

-

-

-

-

-

SILICON LABORATORIES INC

-

-

-

-

-

85 °C

-40 °C

-

UNSPECIFIED

HVQCCN

7 X 7 MM, ROHS COMPLIANT, MO-220, QFN-44

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

-

-

Yes

-

1.89 V

1.71 V

1.8 V

-

-

-

-

-

-

EAR99

-

-

-

-

ALSO REQUIRES 3.3V SUPPLY

8542.39.00.01

QUAD

NO LEAD

260

0.5 mm

-

compliant

40

-

S-XQCC-N44

-

-

INDUSTRIAL

-

-

-

CLOCK GENERATOR, PROCESSOR SPECIFIC

-

-

0.9 mm

-

-

-

54 MHz

-

-

-

350 MHz

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

7 mm

7 mm

-

-

-

-

-

-

-

-

-

-

-

-

NEXPERIA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

unknown

-

-

-

-

-

-

-

-

-

PARALLEL IO PORT, GENERAL PURPOSE

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

5 %

-

-

-

-

-

4.68

SILICON LABORATORIES INC

-

-

-

-

-

-

-

-

-

-

TSSOP, TSSOP24,.25

-

-

-

Obsolete

-

-

No

-

-

-

-

-

for solderingmin

wire (d) Ф0.75min

34.5*31*22.5/5000

-

-

-

Power wire-wound ceramic-cement body resistor, RX27-1 series

2.2 Ohm

-

-

-

8542.39.00.01

-

-

-

-

(L) 22 ± 1 mm

unknown

-

-

-

-

-

-

≥1000 MOhm

-

PHASE LOCKED LOOP

-

-

-

-

-

-55…+155 (275 max.) °C

-

-

-

-

-

-

-

-

5 (SQP5) W

-

-

-

-

-

-

-

-

-

-

-

-

-

(H) 9 ± 1 mm

-

(W) 10 ± 1 mm

-

-

-

-

-

-

-

-

-

-

-

-

INTERPION SEMICONDUCTOR

-

-

-

-

-

-

-

-

-

-

,

-

-

-

Contact Manufacturer

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

-

-

-

-

unknown

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

-

-

1156

-

-

-

-

-

-

-

ADVANCED MICRO DEVICES INC

-

-

-

-

-

100 °C

-

-

PLASTIC/EPOXY

BGA

-

-

RECTANGULAR

GRID ARRAY

Active

-

-

Yes

-

0.876 V

0.825 V

0.85 V

-

-

-

-

-

e1

-

-

-

TIN SILVER COPPER

-

-

-

BOTTOM

BALL

245

-

-

compliant

30

-

R-PBGA-B1156

-

-

OTHER

-

-

-

RFSOC

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

4

-

-

-

-

-

-

-

-

YES

-

-

337

-

-

66 MHz

-

-

-

-

AVAGO TECHNOLOGIES INC

-

-

-

-

-

70 °C

-

-

PLASTIC/EPOXY

FBGA

FBGA,

-

SQUARE

GRID ARRAY, FINE PITCH

Obsolete

-

-

Yes

-

2.7 V

2.3 V

2.5 V

-

-

-

-

-

e1

3A991.A.2

-

-

TIN SILVER COPPER

-

-

8542.31.00.01

BOTTOM

BALL

260

0.5 mm

-

compliant

-

-

S-PBGA-B337

Not Qualified

-

COMMERCIAL

-

-

-

BUS CONTROLLER, PCI

-

-

2 mm

-

-

-

-

-

-

-

-

-

-

-

-

PCI

-

-

-

-

-

-

3

-

IEEE 1149.1

-

-

-

21 mm

21 mm

-

YES

-

-

24

-

-

48 MHz

-

-

-

-

SILICON LABORATORIES INC

-

-

-

-

-

85 °C

-40 °C

-

UNSPECIFIED

HVQCCN

QFN-24

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Obsolete

-

-

Yes

-

3.6 V

3 V

3.3 V

-

-

-

-

-

e3

3A991.A.2

-

-

MATTE TIN

-

-

8542.31.00.01

QUAD

NO LEAD

260

0.5 mm

-

compliant

40

-

S-XQCC-N24

-

-

-

-

-

-

BUS CONTROLLER, UNIVERSAL SERIAL BUS

16 mA

-

0.8 mm

-

-

-

-

-

-

-

-

-

-

-

-

I2C

1.5 MBps

-

-

-

-

-

1

-

USB

-

-

-

4 mm

4 mm

-

-

-

-

-

-

-

-

-

-

-

-

SEAWARD ELECTRONICS INC

-

-

-

-

-

-

-

-

-

-

,

-

-

-

Contact Manufacturer

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

-

-

-

-

unknown

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2017-10-29

-

-

INTEL CORP

-

-

-

-

-

-

-

-

-

-

,

-

-

-

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

-

-

-

-

compliant

-

-

-

-

-

-

-

-

-

RFSoC

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

-

-

784

-

-

-

-

-

-

-

ADVANCED MICRO DEVICES INC

-

4

-

-

-

100 °C

-

-

PLASTIC/EPOXY

FBGA

BGA-784

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

Active

-

-

Yes

-

0.876 V

0.825 V

0.85 V

-

-

-

-

-

e1

-

-

-

TIN SILVER COPPER

-

-

-

BOTTOM

BALL

250

0.8 mm

-

compliant

30

-

S-PBGA-B784

-

-

OTHER

-

-

-

PROGRAMMABLE SoC

-

-

3.32 mm

-

-

-

-

-

-

-

-

-

-

-

-

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

-

-

-

-

-

-

-

-

-

-

-

-

23 mm

23 mm

-

YES

-

-

784

-

-

-

-

-

-

-

XILINX INC

-

4

-

-

-

100 °C

-

-

PLASTIC/EPOXY

FBGA

FBGA, BGA78428X28,32

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

Transferred

-

-

Yes

-

0.876 V

0.825 V

0.85 V

-

-

-

-

-

-

-

-

-

TIN SILVER COPPER

-

-

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

-

unknown

30

-

S-PBGA-B784

-

-

OTHER

-

-

-

PROGRAMMABLE SoC

-

-

3.32 mm

-

-

-

-

-

-

-

-

-

-

-

-

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

-

-

-

-

-

-

-

-

-

-

-

-

23 mm

23 mm

-

NO

-

-

40

-

-

6.144 MHz

-

-

-

-

TOSHIBA CORP

-

-

-

-

-

85 °C

-40 °C

-

PLASTIC/EPOXY

DIP

DIP,

-

RECTANGULAR

IN-LINE

Obsolete

DIP

-

No

-

5.5 V

4.5 V

5 V

-

-

-

-

-

e0

-

-

-

TIN LEAD

-

-

8542.31.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

-

unknown

-

40

R-PDIP-T40

Not Qualified

-

INDUSTRIAL

-

-

-

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

10 mA

-

4.8 mm

1

-

-

-

NO

NO

8

-

0

-

-

2

Z80

0.09765625 MBps

-

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

-

NRZ

-

-

-

-

-

-

-

50.7 mm

15.24 mm

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

-

-

208

-

-

-

-

-

-

-

INTEL CORP

-

-

-

-

-

-

-

-

PLASTIC/EPOXY

QFP

-

QFP208,1.2SQ,20

SQUARE

FLATPACK

Obsolete

-

-

No

-

-

-

-

-

-

-

-

-

e0

-

-

-

Tin/Lead (Sn/Pb)

-

-

8542.31.00.01

QUAD

GULL WING

-

0.5 mm

-

compliant

-

-

S-PQFP-G208

Not Qualified

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

-

-

1156

-

-

-

-

-

-

-

ADVANCED MICRO DEVICES INC

-

4

-

-

-

100 °C

-40 °C

-

PLASTIC/EPOXY

BGA

FCBGA-1156

BGA1156,34X34,40

SQUARE

GRID ARRAY

Active

-

-

Yes

-

-

-

0.85 V

-

-

-

-

-

e1

-

-

-

TIN SILVER COPPER

-

-

-

BOTTOM

BALL

-

1 mm

-

compliant

-

-

S-PBGA-B1156

-

-

INDUSTRIAL

-

-

-

PROGRAMMABLE SoC

-

-

3.42 mm

-

-

-

-

-

-

-

-

-

-

-

-

CAN, I2C, SPI, UART

-

-

-

-

-

-

-

-

-

-

-

-

35 mm

35 mm

-

YES

-

-

484

-

-

-

-

-

-

-

ADVANCED MICRO DEVICES INC

-

4

-

-

-

100 °C

-

-

PLASTIC/EPOXY

FBGA

BGA-484

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Active

-

-

Yes

-

0.876 V

0.825 V

0.85 V

-

-

-

-

-

e1

-

-

-

TIN SILVER COPPER

-

-

-

BOTTOM

BALL

250

0.8 mm

-

compliant

30

-

S-PBGA-B484

-

-

OTHER

-

-

-

PROGRAMMABLE SoC

-

-

2.61 mm

-

-

-

-

-

-

-

-

-

-

-

-

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

-

-

-

-

-

-

-

-

-

-

-

-

19 mm

19 mm