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Embedded - Microcontrollers - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Number of Bits | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Number of Timers | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Information Access Method | Data Encoding/Decoding Method | Display Configuration | Length | Width |
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![]() XCZU6CG-2SBVA484I AMD Xilinx | In Stock | - | Datasheet | YES | 484 | - | XILINX INC | - | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | - | S-PBGA-B484 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 2.61 mm | - | - | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | - | 19 mm | 19 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 484 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 2.61 mm | - | - | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | - | 19 mm | 19 mm | ||
![]() XCZU9CG-1SFVC784I AMD Xilinx | In Stock | - | Datasheet | YES | 784 | - | XILINX INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 3.32 mm | - | - | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | - | 23 mm | 23 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 3.32 mm | - | - | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | - | 23 mm | 23 mm | ||
![]() PSD813F2-12JI Waferscale Integration Inc | In Stock | - | Datasheet | YES | 52 | 26.3 MHz | WAFERSCALE INTEGRATION INC | - | 27 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LDCC-52 | - | SQUARE | CHIP CARRIER | Obsolete | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | QUAD | J BEND | - | - | unknown | - | - | S-PQCC-J52 | Not Qualified | INDUSTRIAL | 4 | PARALLEL IO PORT, GENERAL PURPOSE | - | - | 4.57 mm | - | - | - | - | 16 | - | - | - | - | - | - | - | - | - | - | 19.1 mm | 19.1 mm | ||
![]() SCC66470AAB NXP Semiconductors | In Stock | - | Datasheet | YES | 120 | - | NXP SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP120,1.2SQ,32 | QFP120,1.2SQ,32 | SQUARE | FLATPACK | Obsolete | - | - | - | - | 5 V | - | - | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G120 | Not Qualified | INDUSTRIAL | - | - | - | 100 mA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() SCC66470AAB Philips Semiconductors | In Stock | - | Datasheet | YES | 120 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP120,1.2SQ,32 | QFP120,1.2SQ,32 | SQUARE | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G120 | Not Qualified | INDUSTRIAL | - | - | - | 100 mA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() S1100 Desco Industries Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() UPD65881GB-P01-3BS-A NEC Electronics Group | In Stock | - | Datasheet | YES | 44 | - | NEC ELECTRONICS CORP | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | QFP | Yes | 5.5 V | 4.5 V | 5 V | e6 | Yes | EAR99 | TIN BISMUTH | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | compliant | - | 44 | S-PQFP-G44 | Not Qualified | INDUSTRIAL | - | TIMER, PROGRAMMABLE | 16 | - | 2.8 mm | - | - | - | - | 8 | - | - | - | 3 | - | - | - | PARALLEL, DIRECT ADDRESS | - | - | 10 mm | 10 mm | ||
![]() SC26C198A1A NXP Semiconductors | In Stock | - | Datasheet | YES | 84 | 8 MHz | NXP SEMICONDUCTORS | - | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | 8542.31.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 84 | S-PQCC-J84 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | 200 mA | 4.57 mm | 8 | - | NO | YES | 8 | - | 0 | 8 | - | - | 0.06103515625 MBps | ASYNC, BIT | - | NRZ | - | 29.3116 mm | 29.3116 mm | ||
![]() TMS9928ANL Texas Instruments | In Stock | - | Datasheet | NO | 40 | - | TEXAS INSTRUMENTS INC | - | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | - | - | - | - | - | - | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | not_compliant | - | - | R-PDIP-T40 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 68 | - | ADVANCED MICRO DEVICES INC | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J68 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() THGBM5G6A2JBAIRYFJ Toshiba America Electronic Components | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() SC1004A Micro Electronics Corporation | In Stock | - | Datasheet | NO | 16 | - | MICRO ELECTRONICS LTD | - | - | - | - | UNSPECIFIED | - | , | - | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Contact Manufacturer | MODULE | - | 5.5 V | 2.7 V | 5 V | - | - | - | - | - | 8542.31.00.01 | DUAL | PIN/PEG | - | - | unknown | - | 16 | R-XDMA-P16 | Not Qualified | - | - | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | 5 X 7 DOTS | - | - | ||
![]() P2010AF-08TR onsemi | In Stock | - | Datasheet | YES | 8 | - | ON SEMICONDUCTOR | - | - | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | SOIC | Yes | 5.5 V | 2.7 V | 3.3 V | e3 | Yes | EAR99 | TIN | - | 8542.39.00.01 | DUAL | GULL WING | - | 0.65 mm | compliant | - | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | - | CLOCK GENERATOR, OTHER | - | 8 mA | 1.1 mm | - | 35 MHz | - | - | - | 35 MHz | - | - | - | - | - | - | - | - | - | 4.4 mm | 3 mm | ||
![]() SCN2661CA1F28 Philips Semiconductors | In Stock | - | Datasheet | NO | 28 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-XDIP-T28 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() SCN2661CA1F28 YAGEO Corporation | In Stock | - | Datasheet | NO | 28 | 5.07 MHz | PHILIPS COMPONENTS | - | - | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | - | , | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | - | unknown | - | - | R-CDIP-T28 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | - | - | 2 | - | NO | NO | 8 | - | - | 1 | - | - | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | - | NRZ | - | - | - | ||
![]() SCN2661CA1F28 NXP Semiconductors | In Stock | - | Datasheet | NO | 28 | 5.07 MHz | NXP SEMICONDUCTORS | - | - | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 28 | R-GDIP-T28 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | 150 mA | 5.72 mm | 2 | - | NO | NO | 8 | - | 0 | 1 | - | - | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | - | NRZ | - | 37.15 mm | 15.24 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 625 | - | ADVANCED MICRO DEVICES INC | 4 | - | 110 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B625 | - | OTHER | - | PROGRAMMABLE SoC | - | - | 3.43 mm | - | - | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 21 mm | 21 mm | ||
![]() SED1341FOC Seiko Epson Corporation | In Stock | - | Datasheet | YES | 80 | - | SEIKO EPSON CORP | - | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Obsolete | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | R-PQFP-G80 | Not Qualified | COMMERCIAL | - | DISPLAY CONTROLLER, DOT MATRIX LCD DISPLAY | - | - | 3.4 mm | 3 | - | - | - | 4 | - | - | - | - | - | - | - | - | - | 640 X 480 DOTS | 20 mm | 14 mm |