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Embedded - Microcontrollers - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Information Access Method | Data Encoding/Decoding Method | Host Data Transfer Rate-Max | Drive Interface Standard | Host Interface Standard | Length | Width |
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 AU6366 Alcor Micro Corp | In Stock | - | Datasheet | - | - | - | ALCOR MICRO CORP | - | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 PSD854F2-70JI STMicroelectronics | In Stock | - | Datasheet | YES | 52 | 40 MHz | STMICROELECTRONICS | - | 27 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-52 | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 5.5 V | 4.5 V | 5 V | e3 | - | EAR99 | MATTE TIN | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | compliant | - | 52 | S-PQCC-J52 | Not Qualified | - | INDUSTRIAL | 4 | PARALLEL IO PORT, GENERAL PURPOSE | - | 4.57 mm | - | - | - | 16 | - | - | - | - | - | - | - | - | - | - | 19.1 mm | 19.1 mm | ||
 TC8250P Toshiba America Electronic Components | In Stock | - | Datasheet | NO | 16 | - | TOSHIBA CORP | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 16 | R-PDIP-T16 | Not Qualified | - | INDUSTRIAL | - | TIMER, REAL TIME CLOCK | 1 mA | 5 mm | - | - | - | 4 | 0.002048 MHz | - | - | - | - | PARALLEL, MUXED BUS | - | - | - | - | 19.9 mm | 7.62 mm | ||
TMS320DM320SNA Texas Instruments | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
ICS9159M-05 Integrated Device Technology Inc | In Stock | - | Datasheet | YES | 28 | - | INTEGRATED CIRCUIT SYSTEMS INC | 3 | - | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.7 V | 3 V | 3.3 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1.27 mm | unknown | - | 28 | R-PDSO-G28 | Not Qualified | - | COMMERCIAL | - | CLOCK GENERATOR, PROCESSOR SPECIFIC | - | 2.8194 mm | 20 MHz | - | - | - | 66.6 MHz | - | - | - | - | - | - | - | - | - | 17.8816 mm | 7.5184 mm | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | - | 110 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | - | OTHER | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | - | - | 23 mm | 23 mm | ||
PSD68/12 POWER SEMICONDUCTORS INC | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
SST55LC100M-45-C-BWE Microchip Technology Inc | In Stock | - | Datasheet | YES | 84 | - | MICROCHIP TECHNOLOGY INC | - | - | 70 °C | - | PLASTIC/EPOXY | TFBGA | 9 X 9 MM, ROHS COMPLIANT, TFBGA-84 | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | BGA | Yes | 3.465 V | 3.135 V | 3.3 V | e1 | Yes | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | compliant | - | 84 | S-PBGA-B84 | Not Qualified | - | COMMERCIAL | - | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | - | 1.2 mm | - | - | - | 16 | - | - | - | - | - | - | - | 10 MBps | IDE | ATA | 9 mm | 9 mm | ||
 ICS1892Y-14LF Integrated Device Technology Inc | In Stock | - | Datasheet | YES | 64 | 25 MHz | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 70 °C | - | PLASTIC/EPOXY | LQFP | 14 X 14 MM, LQFP-64 | - | SQUARE | FLATPACK, LOW PROFILE | Transferred | QFP | Yes | 5.25 V | 4.75 V | 5 V | e3 | - | - | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | - | 0.8 mm | compliant | - | 64 | S-PQFP-G64 | Not Qualified | - | COMMERCIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | 1.6 mm | - | NO | YES | - | - | 1 | - | - | - | - | NRZ; NRZI | - | - | - | 14 mm | 14 mm | ||
 SM566BZ Cypress Semiconductor | In Stock | - | Datasheet | YES | 16 | - | CYPRESS SEMICONDUCTOR CORP | 1 | - | 70 °C | - | PLASTIC/EPOXY | SOP | 0.150 INCH, SOIC-16 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.63 V | 2.97 V | 3.3 V | e0 | - | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1.27 mm | compliant | - | 16 | R-PDSO-G16 | Not Qualified | - | COMMERCIAL | - | CLOCK GENERATOR, OTHER | 58 mA | 1.75 mm | 200 MHz | - | - | - | 200 MHz | - | - | - | - | - | - | - | - | - | 9.9 mm | 3.9 mm | ||
MC68B45S Freescale Semiconductor | In Stock | - | Datasheet | NO | 40 | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | 70 °C | - | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-XDIP-T40 | Not Qualified | 5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
FS6322-04 onsemi | In Stock | - | Datasheet | YES | 16 | - | ON SEMICONDUCTOR | - | - | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 3.6 V | 3 V | 3.3 V | - | - | EAR99 | - | 8542.39.00.01 | DUAL | GULL WING | - | 1.27 mm | unknown | - | 16 | R-PDSO-G16 | Not Qualified | - | COMMERCIAL | - | CLOCK GENERATOR, OTHER | - | 1.75 mm | 30 MHz | - | - | - | 48.00026 MHz | - | - | - | - | - | - | - | - | - | 9.9 mm | 3.9 mm | ||
XCZU9CG-2SFVA625E AMD Xilinx | In Stock | - | Datasheet | YES | 625 | - | XILINX INC | - | - | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA625,25X25,32 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | - | S-PBGA-B625 | - | - | OTHER | - | PROGRAMMABLE SoC | - | 3.43 mm | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | - | - | - | 21 mm | 21 mm | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 625 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | - | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B625 | - | - | OTHER | - | PROGRAMMABLE SoC | - | 3.43 mm | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | - | - | - | 21 mm | 21 mm | ||
 CP2120 Silicon Laboratories Inc | In Stock | - | Datasheet | YES | 20 | 25 MHz | SILICON LABORATORIES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | QFN-20 | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.6 V | 3 V | 3.3 V | - | No | - | - | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 0.5 mm | unknown | NOT SPECIFIED | 20 | S-XQCC-N20 | Not Qualified | - | INDUSTRIAL | - | BUS CONTROLLER, I2C | - | 1 mm | - | - | - | - | - | - | - | 0.125 MBps | - | - | - | - | - | - | 4 mm | 4 mm | ||
MB86950BPF-G FUJITSU Limited | In Stock | - | Datasheet | YES | 80 | - | FUJITSU LTD | - | - | 70 °C | - | PLASTIC/EPOXY | QFF | QFF, QFL80,.55X.8,32 | QFL80,.55X.8,32 | RECTANGULAR | FLATPACK | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | FLAT | - | 0.8 mm | unknown | - | - | R-PQFP-F80 | Not Qualified | - | COMMERCIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 40 mA | - | - | NO | - | - | - | - | - | - | ASYNC, BIT | - | - | - | - | - | - | - | ||
BCM58201A0KFBG05 Broadcom Limited | 3012 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 STP2202ABGA Sun Microsystems Inc | In Stock | - | Datasheet | YES | 320 | - | SUN MICROSYSTEMS INC | - | - | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA320,20X20 | BGA320,20X20 | SQUARE | GRID ARRAY | Obsolete | BGA | - | 3.465 V | 3.135 V | 3.3 V | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.5 mm | unknown | - | 320 | S-PBGA-B320 | Not Qualified | - | - | - | MICROPROCESSOR CIRCUIT | 758 mA | 2.68 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 35 mm | 35 mm | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | - | - | 23 mm | 23 mm | ||
 TDA8002G/5/C2 NXP Semiconductors | In Stock | - | Datasheet | YES | 32 | - | NXP SEMICONDUCTORS | - | - | 85 °C | -25 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | - | 6.5 V | 4.5 V | 5 V | - | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 32 | S-PQFP-G32 | Not Qualified | - | OTHER | - | MICROPROCESSOR CIRCUIT | - | 1.6 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5 mm | 5 mm |