- Manufacturer
- Applications
- Interface
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Core Processor
- RoHS Status
- Factory Lead Time
- Program Memory Type
Attribute column
Categories
Embedded - Microcontrollers - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Display Configuration | Length | Width |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() SAF82526N Intel Corporation | In Stock | - | Datasheet | YES | 44 | 19.3 MHz | INTEL CORP | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | - | SQUARE | CHIP CARRIER | Contact Manufacturer | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | 8542.31.00.01 | QUAD | J BEND | - | 1.27 mm | compliant | - | - | S-PQCC-J44 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | - | 4.57 mm | 7 | - | NO | YES | 8 | - | 2 | 8051; 80188; 80186 | 0.5 MBps | SYNC, HDLC; SYNC, SDLC; X.25 | NRZ; NRZI | - | 16.6 mm | 16.6 mm | ||
![]() SAF82526N Infineon Technologies AG | In Stock | - | Datasheet | YES | 44 | 19.3 MHz | INFINEON TECHNOLOGIES AG | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Transferred | LCC | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | 8542.31.00.01 | QUAD | J BEND | - | 1.27 mm | compliant | - | 44 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | 8.2 mA | 4.57 mm | 7 | - | NO | YES | 8 | - | 2 | 8051; 80188; 80186 | 0.5 MBps | SYNC, HDLC; SYNC, SDLC; X.25 | NRZ; NRZI | - | 16.6 mm | 16.6 mm | ||
![]() 29F68AQC National Semiconductor Corporation | In Stock | - | Datasheet | YES | 52 | - | NATIONAL SEMICONDUCTOR CORP | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC52,.8SQ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J52 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() 29F68AQC Fairchild Semiconductor Corporation | In Stock | - | Datasheet | YES | 52 | - | FAIRCHILD SEMICONDUCTOR CORP | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | - | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | - | 1.27 mm | compliant | - | - | S-PQCC-J52 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() PSB82/08 POWER SEMICONDUCTORS INC | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() SI5341A-D15105-GM Skyworks Solutions Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MK1417S Integrated Device Technology Inc | In Stock | - | Datasheet | YES | 8 | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5.5 V | 3 V | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1.27 mm | compliant | - | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | - | CLOCK GENERATOR, PROCESSOR SPECIFIC | - | 1.75 mm | - | 14.31818 MHz | - | - | - | 27 MHz | - | - | - | - | - | - | 4.9 mm | 3.9 mm | ||
![]() HD66732A00TB0L Renesas Electronics Corporation | In Stock | - | - | YES | 221 | 0.1 MHz | RENESAS TECHNOLOGY CORP | - | - | 85 °C | -40 °C | UNSPECIFIED | DIE | DIE, | - | RECTANGULAR | UNCASED CHIP | Transferred | DIE | - | 5.5 V | 2.4 V | 3 V | - | - | - | - | 8542.31.00.01 | UPPER | NO LEAD | - | - | unknown | - | 221 | R-XUUC-N | Not Qualified | INDUSTRIAL | - | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | - | - | 1 | - | - | - | 8 | - | - | I2C; 80XX; 68XX | - | - | - | 52 X 120 DOTS | - | - | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 1760 | - | ADVANCED MICRO DEVICES INC | 4 | - | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1760 | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1760 | - | OTHER | - | PROGRAMMABLE SoC | - | 3.71 mm | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | 42.5 mm | 42.5 mm | ||
![]() PCI6150-BA66PC PLX Technology | In Stock | - | Datasheet | YES | 208 | - | PLX TECHNOLOGY INC | - | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Transferred | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G208 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() UPD71055G Renesas Electronics Corporation | In Stock | - | Datasheet | YES | 44 | - | RENESAS ELECTRONICS CORP | - | 24 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | - | QFP44,.5SQ,32 | SQUARE | FLATPACK | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | Not Qualified | INDUSTRIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 15 mA | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | ||
![]() NJU6331HC New Japan Radio Co Ltd | In Stock | - | Datasheet | YES | 6 | - | NEW JAPAN RADIO CO LTD | 2 | - | 75 °C | -30 °C | UNSPECIFIED | DIE | 1.29 X 0.80 MM, DIE-6 | - | RECTANGULAR | UNCASED CHIP | Obsolete | DIE | No | 6 V | 4 V | 5 V | - | - | EAR99 | - | 8542.39.00.01 | UPPER | NO LEAD | 260 | - | compliant | - | 6 | R-XUUC-N6 | Not Qualified | COMMERCIAL EXTENDED | - | CLOCK GENERATOR, OTHER | 25 mA | - | - | 50 MHz | - | - | - | 50 MHz | - | - | - | - | - | - | - | - | ||
![]() PSD411A2-C-15U Waferscale Integration Inc | In Stock | - | Datasheet | YES | 80 | - | WAFERSCALE INTEGRATION INC | - | 40 | 70 °C | - | PLASTIC/EPOXY | TQFP | PLASTIC, TQFP-80 | - | SQUARE | FLATPACK, THIN PROFILE | Transferred | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | QUAD | GULL WING | - | - | unknown | - | - | S-PQFP-G80 | Not Qualified | COMMERCIAL | 5 | PARALLEL IO PORT, GENERAL PURPOSE | - | 1.6 mm | - | - | - | - | - | - | - | - | - | - | - | - | 14 mm | 14 mm | ||
![]() 78M6610 ART/CA9T Silergy Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() SYM53C895 Symbios Semiconductors | In Stock | - | Datasheet | YES | 208 | - | SYMBIOS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Transferred | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G208 | Not Qualified | COMMERCIAL | - | - | 130 mA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() XCZU3EG-3SBVA484E AMD Xilinx | In Stock | - | Datasheet | YES | 484 | - | XILINX INC | 4 | - | 100 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | - | Yes | - | - | 0.9 V | e1 | - | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | - | compliant | 30 | - | S-PBGA-B484 | - | OTHER | - | PROGRAMMABLE SoC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() OTI95C71/30 Qualcomm | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 484 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 2.61 mm | - | - | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | - | - | 19 mm | 19 mm | ||
![]() ZPSD813F2-15J Waferscale Integration Inc | In Stock | - | Datasheet | YES | 52 | 25 MHz | WAFERSCALE INTEGRATION INC | - | 27 | 70 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LDCC-52 | - | SQUARE | CHIP CARRIER | Obsolete | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | QUAD | J BEND | - | - | unknown | - | - | S-PQCC-J52 | Not Qualified | COMMERCIAL | 4 | PARALLEL IO PORT, GENERAL PURPOSE | - | 4.57 mm | - | - | - | - | 16 | - | - | - | - | - | - | - | 19.1 mm | 19.1 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | 23 mm | 23 mm |