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  • Applications
  • Interface
  • Moisture Sensitivity Level (MSL)
  • Mounting Type
  • Operating Temperature
  • Package / Case
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  • RoHS Status
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  • Program Memory Type

Attribute column

Categories

Embedded - Microcontrollers - Application Specific

View Mode:
5057 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Body Material

Number of Terminals

Base Product Number

Clock Frequency-Max

Ihs Manufacturer

Mfr

Moisture Sensitivity Levels

Number of I/O Lines

Number of I/Os

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Product Status

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Wire Size

Operating Temperature

Series

JESD-609 Code

Pbfree Code

ECCN Code

Type

Terminal Finish

Applications

Additional Feature

HTS Code

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Temperature Grade

Interface

Plating

Number of Ports

RAM Size

uPs/uCs/Peripheral ICs Type

Number of Bits

Core Processor

Program Memory Type

Supply Current-Max

Seated Height-Max

Address Bus Width

Primary Clock/Crystal Frequency-Nom

Boundary Scan

Low Power Mode

External Data Bus Width

Output Clock Frequency-Max

RAM (words)

Number of Serial I/Os

Bus Compatibility

Stud Size

Data Transfer Rate-Max

Communication Protocol

Data Encoding/Decoding Method

Controller Series

Host Data Transfer Rate-Max

Host Interface Standard

Product Length

Length

Width

G65SC51PE-3
G65SC51PE-3

California Micro Devices

In Stock

-

Datasheet

-

-

-

YES

-

-

28

-

3 MHz

CALIFORNIA MICRO DEVICES CORP

-

-

-

-

70 °C

-

-

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC28,.5SQ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

Obsolete

QLCC

-

No

5.25 V

4.75 V

5 V

-

-

-

e0

-

-

-

TIN LEAD

-

-

8542.31.00.01

-

QUAD

J BEND

-

1.27 mm

unknown

-

28

S-PQCC-J28

Not Qualified

COMMERCIAL

-

-

-

-

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

-

-

-

6 mA

4.57 mm

2

-

NO

NO

8

-

0

1

6500; 6800

-

0.002288818359375 MBps

ASYNC, BIT

NRZ

-

-

-

-

11.5062 mm

11.5062 mm

P1819F-08SR
P1819F-08SR

Pulsecore Semiconductor

In Stock

-

Datasheet

-

-

-

YES

-

-

8

-

-

PULSECORE SEMICONDUCTOR

-

-

-

-

70 °C

-

-

PLASTIC/EPOXY

SOP

SOIC-8

-

RECTANGULAR

SMALL OUTLINE

Obsolete

-

-

Yes

3.6 V

3 V

3.3 V

-

-

-

-

-

-

-

-

-

-

-

-

DUAL

GULL WING

NOT SPECIFIED

1.27 mm

unknown

NOT SPECIFIED

-

R-PDSO-G8

Not Qualified

COMMERCIAL

-

-

-

-

Spread Spectrum EMI Reduction Clock

-

-

-

-

1.8 mm

-

40 MHz

-

-

-

40 MHz

-

-

-

-

-

-

-

-

-

-

-

4.92 mm

3.95 mm

P1819F-08SR
P1819F-08SR

Alliance Semiconductor Corporation

In Stock

-

Datasheet

-

-

-

YES

-

-

8

-

-

ALLIANCE SEMICONDUCTOR CORP

-

-

-

-

70 °C

-

-

PLASTIC/EPOXY

SOP

SOP, SOP8,.25

SOP8,.25

RECTANGULAR

SMALL OUTLINE

Transferred

SOIC

-

Yes

-

-

3.3 V

-

-

-

e3/e6

-

EAR99

-

MATTE TIN/TIN BISMUTH

-

-

8542.39.00.01

-

DUAL

GULL WING

260

1.27 mm

unknown

40

8

R-PDSO-G8

Not Qualified

COMMERCIAL

-

-

-

-

CLOCK GENERATOR, OTHER

-

-

-

-

1.8 mm

-

40 MHz

-

-

-

40 MHz

-

-

-

-

-

-

-

-

-

-

-

4.92 mm

3.95 mm

In Stock

-

Datasheet

-

-

-

YES

-

-

484

-

-

XILINX INC

-

-

-

-

100 °C

-

-

PLASTIC/EPOXY

FBGA

FBGA, BGA484,22X22,32

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Transferred

-

-

Yes

0.876 V

0.825 V

0.85 V

-

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

BOTTOM

BALL

-

0.8 mm

unknown

-

-

S-PBGA-B484

-

OTHER

-

-

-

-

PROGRAMMABLE SoC

-

-

-

-

2.61 mm

-

-

-

-

-

-

-

-

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

-

-

-

-

-

-

-

-

19 mm

19 mm

BCM5671
BCM5671

Broadcom Limited

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

BROADCOM CORP

-

-

-

-

-

-

-

-

-

,

-

-

-

Transferred

-

-

No

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

-

-

-

-

compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MD3331-D64-V3-X-P
MD3331-D64-V3-X-P

SanDisk Corporation

In Stock

-

Datasheet

-

-

-

YES

-

-

69

-

-

SANDISK CORP

-

-

-

-

85 °C

-40 °C

-

PLASTIC/EPOXY

LFBGA

LFBGA,

-

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

-

-

3.6 V

2.7 V

3.3 V

-

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

BOTTOM

BALL

-

0.8 mm

unknown

-

69

R-PBGA-B69

-

INDUSTRIAL

-

-

-

-

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

-

-

-

-

1.5 mm

-

-

-

-

16

-

-

-

-

-

-

-

-

-

20 MBps

ISA

-

12 mm

9 mm

PSD313-70J
PSD313-70J

Waferscale Integration Inc

In Stock

-

Datasheet

-

-

-

YES

-

-

44

-

-

WAFERSCALE INTEGRATION INC

-

-

19

-

70 °C

-

-

PLASTIC/EPOXY

QCCJ

-

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

-

-

No

5.5 V

4.5 V

5 V

-

-

-

e0

-

-

-

TIN LEAD

-

-

-

-

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-PQCC-J44

Not Qualified

COMMERCIAL

-

-

3

-

PARALLEL IO PORT, GENERAL PURPOSE

-

-

-

95 mA

4.57 mm

-

-

-

-

16

-

-

-

-

-

-

-

-

-

-

-

-

16.56 mm

16.56 mm

MPC8247CVRTIE
MPC8247CVRTIE

Freescale Semiconductor

125

-

Datasheet

-

-

-

YES

-

-

516

-

-

FREESCALE SEMICONDUCTOR INC

-

-

-

-

-

-

-

PLASTIC/EPOXY

BGA

BGA, BGA516,26X26,40

BGA516,26X26,40

SQUARE

GRID ARRAY

Transferred

-

-

Yes

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.31.00.01

-

BOTTOM

BALL

-

1 mm

unknown

-

-

S-PBGA-B516

Not Qualified

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

Datasheet

-

-

-

YES

-

-

900

-

-

ADVANCED MICRO DEVICES INC

-

-

-

-

100 °C

-40 °C

-

PLASTIC/EPOXY

BGA

FCBGA-900

BGA900,30X30,40

SQUARE

GRID ARRAY

Active

-

-

Yes

-

-

0.85 V

-

-

-

-

-

-

-

-

-

-

-

-

BOTTOM

BALL

-

1 mm

compliant

-

-

S-PBGA-B900

-

INDUSTRIAL

-

-

-

-

PROGRAMMABLE SoC

-

-

-

-

3.42 mm

-

-

-

-

-

-

-

-

CAN, I2C, SPI, UART

-

-

-

-

-

-

-

-

31 mm

31 mm

CS22220
CS22220

Cirrus Logic

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

W83195BG-912
W83195BG-912

Winbond Electronics Corp

In Stock

-

Datasheet

-

-

-

YES

-

-

56

-

-

WINBOND ELECTRONICS CORP

-

3

-

-

70 °C

-

-

PLASTIC/EPOXY

SSOP

SSOP, SSOP56,.4

SSOP56,.4

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Transferred

SSOP

-

Yes

3.465 V

3.135 V

3.3 V

-

-

-

e3

-

EAR99

-

Matte Tin (Sn)

-

-

8542.39.00.01

-

DUAL

GULL WING

260

0.65 mm

unknown

40

56

R-PDSO-G56

Not Qualified

COMMERCIAL

-

-

-

-

CLOCK GENERATOR, PROCESSOR SPECIFIC

-

-

-

350 mA

2.79 mm

-

14.318 MHz

-

-

-

266.6 MHz

-

-

-

-

-

-

-

-

-

-

-

18.42 mm

7.52 mm

ZPSD-70
ZPSD-70

Diptronics Manufacturing Inc

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

Datasheet

-

Surface Mount

24-UFQFN Exposed Pad

-

24-QFN (4x4)

Copper

-

CY8CTST200

-

-

Infineon Technologies

-

-

20

-

-

Tape & Reel (TR)

-

-

-

-

-

-

-

-

Obsolete

-

-

-

-

22 to 16, 22 AWG

-40°C ~ 85°C

TrueTouchâ„¢

-

-

-

Spade Tongue Terminal

-

Touchscreen Controller

-

-

1.8V

-

-

-

-

-

-

-

-

-

-

I²C, SPI, UART/USART, USB

Tin

-

2K x 8

-

-

M8C

FLASH (32kB)

-

-

-

-

-

-

-

-

-

-

-

4.16 mm

-

-

-

CY8CT

-

-

23.06 mm

-

-

PCA9557PW
PCA9557PW

Philips Semiconductors

6

-

Datasheet

-

-

-

YES

-

-

16

-

-

PHILIPS SEMICONDUCTORS

-

-

-

-

85 °C

-40 °C

-

PLASTIC/EPOXY

TSSOP

-

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Transferred

-

-

Yes

-

-

-

-

-

-

-

-

EAR99

-

-

-

-

8542.39.00.01

-

DUAL

GULL WING

260

0.635 mm

unknown

-

-

R-PDSO-G16

Not Qualified

INDUSTRIAL

-

-

-

-

-

8

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SC28L202A1DGG
SC28L202A1DGG

NXP Semiconductors

In Stock

-

Datasheet

-

-

-

YES

-

-

56

-

50 MHz

NXP SEMICONDUCTORS

-

1

-

-

85 °C

-40 °C

-

PLASTIC/EPOXY

TSSOP

TSSOP, TSSOP56,.3,20

TSSOP56,.3,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Active

TSSOP

-

Yes

5.5 V

4.5 V

5 V

-

-

-

e4

Yes

-

-

Nickel/Palladium/Gold (Ni/Pd/Au)

-

ALSO OPERATES AT 3.3V SUPPLY

8542.31.00.01

-

DUAL

GULL WING

260

0.5 mm

compliant

30

56

R-PDSO-G56

Not Qualified

INDUSTRIAL

-

-

-

-

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

-

-

-

-

1.2 mm

7

-

NO

YES

8

-

-

2

68XXX; 80XXX

-

0.375 MBps

ASYNC, BIT

NRZ

-

-

-

-

14 mm

6.1 mm

In Stock

-

Datasheet

-

-

-

YES

-

-

784

-

-

ADVANCED MICRO DEVICES INC

-

4

-

-

100 °C

-40 °C

-

PLASTIC/EPOXY

FBGA

FCBGA-784

-

SQUARE

GRID ARRAY, FINE PITCH

Active

-

-

Yes

-

-

0.9 V

-

-

-

e1

-

-

-

TIN SILVER COPPER

-

-

-

-

BOTTOM

BALL

250

0.8 mm

compliant

30

-

S-PBGA-B784

-

INDUSTRIAL

-

-

-

-

PROGRAMMABLE SoC

-

-

-

-

3.32 mm

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

23 mm

23 mm

SC16C2552IA44
SC16C2552IA44

NXP Semiconductors

In Stock

-

-

-

-

-

YES

-

-

44

-

80 MHz

NXP SEMICONDUCTORS

-

3

-

-

85 °C

-40 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC44,.7SQ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LPCC

-

Yes

3.63 V

2.97 V

3.3 V

-

-

-

e3

-

-

-

MATTE TIN

-

ALSO OPERATES AT 2.5 V SUPPLY

8542.31.00.01

-

QUAD

J BEND

245

1.27 mm

unknown

-

44

S-PQCC-J44

Not Qualified

INDUSTRIAL

-

-

-

-

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

-

-

-

-

4.57 mm

3

-

NO

YES

8

-

-

2

-

-

0.625 MBps

ASYNC, BIT

-

-

-

-

-

16.585 mm

16.585 mm

PCF8574P
PCF8574P

NXP Semiconductors

In Stock

-

Datasheet

-

-

-

NO

-

-

16

-

0.1 MHz

NXP SEMICONDUCTORS

-

-

8

-

85 °C

-40 °C

-

PLASTIC/EPOXY

DIP

0.300 INCH, PLASTIC, SOT-38-4, DIP-16

DIP16,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

-

Yes

6 V

2.5 V

5 V

-

-

-

e4

Yes

EAR99

-

NICKEL PALLADIUM GOLD

-

-

8542.39.00.01

-

DUAL

THROUGH-HOLE

245

2.54 mm

unknown

-

16

R-PDIP-T16

Not Qualified

INDUSTRIAL

-

-

1

-

PARALLEL IO PORT, GENERAL PURPOSE

8

-

-

0.1 mA

4.7 mm

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

21.6 mm

7.62 mm

SC18IS602BIPW/S8HP
SC18IS602BIPW/S8HP

NXP Semiconductors

In Stock

-

Datasheet

4 Weeks

-

-

YES

-

-

16

-

-

NXP SEMICONDUCTORS

-

1

-

-

85 °C

-40 °C

-

PLASTIC/EPOXY

TSSOP

TSSOP-16

-

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Obsolete

-

-

Yes

3.6 V

2.4 V

3 V

-

-

-

e4

-

-

-

Nickel/Palladium/Gold (Ni/Pd/Au)

-

-

8542.31.00.01

-

DUAL

GULL WING

260

0.65 mm

compliant

30

-

R-PDSO-G16

-

INDUSTRIAL

-

-

-

-

BUS CONTROLLER, I2C

-

-

-

-

1.1 mm

-

-

-

-

-

-

-

-

I2C

-

0.225 MBps

-

-

-

-

-

-

5 mm

4.4 mm

PCA9675PW
PCA9675PW

NXP Semiconductors

In Stock

-

Datasheet

-

-

-

YES

-

-

24

-

1 MHz

NXP SEMICONDUCTORS

-

1

18

-

85 °C

-40 °C

-

PLASTIC/EPOXY

TSSOP

TSSOP, TSSOP24,.25

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Active

TSSOP

-

Yes

5.5 V

2.3 V

3 V

-

-

-

e4

-

EAR99

-

Nickel/Palladium/Gold (Ni/Pd/Au)

-

-

8542.39.00.01

-

DUAL

GULL WING

260

0.65 mm

compliant

30

24

R-PDSO-G24

Not Qualified

INDUSTRIAL

-

-

1

-

PARALLEL IO PORT, GENERAL PURPOSE

16

-

-

-

1.1 mm

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

7.8 mm

4.4 mm