- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Packing Method | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
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![]() PALCE22V10H-15PC Vantis Corporation | In Stock | - | Datasheet | NO | 24 | 58.8 MHz | VANTIS CORP | - | 10 | 70 °C | - | PLASTIC/EPOXY | DIP | - | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | 5 V | e0 | - | - | TIN LEAD | - | - | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T24 | 10 | Not Qualified | COMMERCIAL | 15 ns | PAL-TYPE | 22 | 12 DEDICATED INPUTS, 10 I/O | - | EE PLD | MACROCELL | - | - | 12 | - | 132 | - | - | ||
![]() XH95432-7HQG304I AMD Xilinx | 880 | - | Datasheet | YES | 304 | - | XILINX INC | - | 232 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-304 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | - | - | - | 5 V | e3 | Yes | 3A991.D | MATTE TIN | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | compliant | - | 304 | S-PQFP-G304 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 232 I/O | 4.5 mm | MASK PLD | MACROCELL | - | - | - | - | - | 40 mm | 40 mm | ||
![]() PZ5128NS15BP AMD Xilinx | In Stock | - | Datasheet | YES | 100 | - | XILINX INC | 3 | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Obsolete | - | No | - | - | 5 V | - | - | - | - | YES | 8542.39.00.01 | - | QUAD | GULL WING | 240 | 0.5 mm | unknown | 30 | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | - | - | EE PLD | - | 128 | YES | - | YES | - | - | - | ||
![]() PZ5128NS15BP Philips Semiconductors | In Stock | - | Datasheet | YES | 100 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | - | - | EE PLD | - | 128 | YES | - | YES | - | - | - | ||
![]() PZ5128NS15BP NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 63 MHz | NXP SEMICONDUCTORS | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | 14 X 14 X 1 MM, PLASTIC, SOT-386-1, TQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() XC9536XV-4CS48C AMD Xilinx | 932 | - | Datasheet | YES | 48 | - | XILINX INC | 3 | 36 | 70 °C | - | PLASTIC/EPOXY | FBGA | PLASTIC, CSP-48 | BGA48,7X7,32 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | BGA | No | 2.62 V | 2.37 V | 2.5 V | e0 | - | - | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | 30 | 48 | S-PBGA-B48 | - | Not Qualified | COMMERCIAL | 4 ns | - | - | 0 DEDICATED INPUTS, 36 I/O | 1.8 mm | FLASH PLD | MACROCELL | 36 | YES | - | YES | - | 7 mm | 7 mm | ||
![]() XC95108F-20PQG100I AMD Xilinx | In Stock | - | Datasheet | YES | 100 | 50 MHz | XILINX INC | 3 | 81 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Obsolete | QFP | Yes | 5.5 V | 4.5 V | 5 V | e3 | - | - | MATTE TIN | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.65 mm | compliant | - | 100 | R-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 20 ns | - | - | 0 DEDICATED INPUTS, 81 I/O | 3.4 mm | FLASH PLD | MACROCELL | - | - | - | - | - | 20 mm | 14 mm | ||
![]() PALCE20V8Q-25PI/4 Lattice Semiconductor Corporation | In Stock | - | Datasheet | NO | 24 | 37 MHz | LATTICE SEMICONDUCTOR CORP | - | 8 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, SKINNY, PLASTIC, DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | Tin/Lead (Sn85Pb15) | USE GAL DEVICES FOR NEW DESIGNS | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | not_compliant | - | 24 | R-PDIP-T24 | 8 | Not Qualified | INDUSTRIAL | 25 ns | PAL-TYPE | 20 | 12 DEDICATED INPUTS, 8 I/O | 5.08 mm | EE PLD | MACROCELL | - | - | 12 | - | 64 | 30.734 mm | 7.62 mm | ||
![]() PALCE20V8Q-25PI/4 Vantis Corporation | In Stock | - | Datasheet | NO | 24 | 37 MHz | VANTIS CORP | - | 8 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, SKINNY, PLASTIC, DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Transferred | - | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; PROGRAMMABLE OUTPUT POLARITY | - | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T24 | 8 | Not Qualified | INDUSTRIAL | 25 ns | PAL-TYPE | 20 | 12 DEDICATED INPUTS, 8 I/O | - | EE PLD | MACROCELL | - | - | 12 | - | 64 | - | - | ||
![]() PZ3128AS12BE-T NXP Semiconductors | In Stock | - | Datasheet | YES | 128 | 63 MHz | NXP SEMICONDUCTORS | - | 96 | 70 °C | - | PLASTIC/EPOXY | LFQFP | LFQFP, | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | Transferred | - | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | R-PQFP-G128 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 96 I/O | 1.6 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
![]() PZ3128AS12BE-T AMD Xilinx | In Stock | - | Datasheet | YES | 128 | 63 MHz | XILINX INC | - | 96 | 70 °C | - | PLASTIC/EPOXY | LFQFP | LFQFP, | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | 128 | R-PQFP-G128 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 96 I/O | 1.6 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
Tiny WHSL | 466 | - | Datasheet | YES | 56 | 500 MHz | ADVANCED MICRO DEVICES INC | 3 | 33 | 70 °C | - | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | - | Yes | 1.9 V | 1.7 V | 1.8 V | e1 | - | - | TIN SILVER COPPER | - | - | - | BOTTOM | BALL | 260 | 0.5 mm | compliant | 30 | - | S-PBGA-B56 | - | Not Qualified | COMMERCIAL | 3 ns | - | - | 33 I/O | 1.35 mm | FLASH PLD | MACROCELL | - | - | - | - | - | 6 mm | 6 mm | ||
![]() XC2C32A-3CPG56C AMD Xilinx | 466 | - | Datasheet | YES | 56 | 500 MHz | XILINX INC | 3 | 33 | 70 °C | - | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Transferred | BGA | Yes | 1.9 V | 1.7 V | 1.8 V | e1 | Yes | - | TIN SILVER COPPER | - | 8542.39.00.01 | - | BOTTOM | BALL | - | 0.5 mm | compliant | - | 56 | S-PBGA-B56 | - | Not Qualified | COMMERCIAL | 3 ns | - | - | 33 I/O | 1.35 mm | FLASH PLD | MACROCELL | - | - | - | - | - | 6 mm | 6 mm | ||
![]() PZ5064-10BC-S AMD Xilinx | 242 | - | Datasheet | YES | 44 | 77 MHz | XILINX INC | 3 | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | - | - | - | - | 64 MACROCELLS | 8542.39.00.01 | TRAY | QUAD | GULL WING | 240 | 0.8 mm | unknown | 30 | 44 | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | 64 | NO | 2 | NO | - | 10 mm | 10 mm | ||
![]() PZ5064-10BC-S Philips Semiconductors | In Stock | - | Datasheet | YES | 44 | - | PHILIPS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | SQUARE | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | NO | 8542.39.00.01 | TRAY | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | - | - | EE PLD | - | 64 | NO | - | NO | - | - | - | ||
![]() PZ5064-10BC-S NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 77 MHz | NXP SEMICONDUCTORS | - | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Transferred | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
![]() XC95108F-20PQG160C AMD Xilinx | 343 | - | Datasheet | YES | 160 | 50 MHz | XILINX INC | 3 | 108 | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | QFP | Yes | 5.25 V | 4.75 V | 5 V | e3 | - | - | MATTE TIN | - | 8542.39.00.01 | - | QUAD | GULL WING | 245 | 0.65 mm | compliant | 30 | 160 | S-PQFP-G160 | - | Not Qualified | COMMERCIAL | 20 ns | - | - | 0 DEDICATED INPUTS, 108 I/O | 4.1 mm | FLASH PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
![]() EPM1270F100C5N Intel Corporation | In Stock | - | Datasheet | YES | 100 | - | INTEL CORP | - | - | 85 °C | - | PLASTIC/EPOXY | BGA | 11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100 | - | SQUARE | GRID ARRAY | Active | - | Yes | 2.625 V | 2.375 V | 2.5 V | e1 | - | - | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | - | BOTTOM | BALL | - | 0.5 mm | compliant | - | - | S-PBGA-B100 | - | Not Qualified | - | 10 ns | - | - | 0 DEDICATED INPUTS, 0 I/O | - | FLASH PLD | MACROCELL | 980 | - | - | - | - | 11 mm | 11 mm | ||
![]() P3Z22V10IBDH AMD Xilinx | In Stock | - | Datasheet | YES | 24 | 65 MHz | XILINX INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP24,.25 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | - | DUAL | GULL WING | - | 0.635 mm | unknown | - | - | R-PDSO-G24 | 10 | Not Qualified | INDUSTRIAL | 15 ns | PAL-TYPE | 22 | - | - | EE PLD | MACROCELL | - | - | - | - | 132 | - | - | ||
![]() P3Z22V10IBDH Philips Semiconductors | In Stock | - | Datasheet | YES | 24 | 65 MHz | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | - | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | - | DUAL | GULL WING | - | 0.635 mm | unknown | - | - | R-PDSO-G24 | 10 | Not Qualified | INDUSTRIAL | 15 ns | PAL-TYPE | 22 | - | - | EE PLD | MACROCELL | - | - | - | - | 132 | - | - |