-

YES

20

30 MHz

NXP SEMICONDUCTORS

-

8

75 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC20,.4SQ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

Obsolete

LPCC

-

5.25 V

4.75 V

5 V

-

-

-

-

8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; REGISTER PRELOAD; POWER-UP RESET

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

20

S-PQCC-J20

8

Not Qualified

COMMERCIAL EXTENDED

25 ns

PAL-TYPE

18

8 DEDICATED INPUTS, 8 I/O

4.57 mm

OT PLD

MACROCELL

-

-

8

-

74

8.965 mm

8.965 mm

-

YES

44

-

XILINX INC

3

34

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Obsolete

LCC

No

2.6 V

2.4 V

2.5 V

e0

-

-

TIN LEAD

-

8542.39.00.01

QUAD

J BEND

-

1.27 mm

compliant

-

44

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

3.5 ns

-

-

0 DEDICATED INPUTS, 34 I/O

4.57 mm

FLASH PLD

REGISTERED

-

-

-

-

-

16.5862 mm

16.5862 mm

-

YES

160

-

ADVANCED MICRO DEVICES INC

3

133

-

-

PLASTIC/EPOXY

QFP

PLASTIC, QFP-160

QFP160,1.2SQ

SQUARE

FLATPACK

Obsolete

-

Yes

-

-

5 V

e3

-

-

MATTE TIN

-

-

QUAD

GULL WING

245

0.65 mm

compliant

30

-

S-PQFP-G160

-

Not Qualified

-

-

-

-

0 DEDICATED INPUTS, 133 I/O

3.94 mm

MASK PLD

MACROCELL

-

-

-

-

-

28 mm

28 mm

-

YES

304

-

XILINX INC

-

232

-

-

PLASTIC/EPOXY

HFQFP

HEAT SINK, QFP-304

-

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Transferred

QFP

-

-

-

5 V

e3

Yes

3A991.D

MATTE TIN

-

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

compliant

-

304

S-PQFP-G304

-

Not Qualified

-

-

-

-

0 DEDICATED INPUTS, 232 I/O

4.5 mm

MASK PLD

MACROCELL

-

-

-

-

-

40 mm

40 mm

-

YES

44

50 MHz

ALTERA CORP

-

28

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC44,.7SQ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Transferred

LCC

No

5.5 V

4.5 V

5 V

e0

-

-

TIN LEAD

NO

8542.39.00.01

QUAD

J BEND

220

1.27 mm

unknown

-

44

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

30 ns

-

-

7 DEDICATED INPUTS, 28 I/O

-

OT PLD

MACROCELL

64

NO

7

NO

-

-

-

-

YES

160

77 MHz

XILINX INC

3

96

70 °C

-

PLASTIC/EPOXY

QFP

PLASTIC, QFP-160

QFP160,1.2SQ

SQUARE

FLATPACK

Obsolete

QFP

No

3.63 V

2.97 V

3.3 V

e0

-

-

TIN LEAD

YES

8542.39.00.01

QUAD

GULL WING

225

0.65 mm

not_compliant

30

160

S-PQFP-G160

-

Not Qualified

COMMERCIAL

10 ns

-

-

2 DEDICATED INPUTS, 96 I/O

4.1 mm

EE PLD

MACROCELL

128

YES

2

YES

-

28 mm

28 mm

-

YES

432

-

XILINX INC

3

232

70 °C

-

PLASTIC/EPOXY

LBGA

LBGA,

BGA432,31X31,50

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

BGA

No

-

-

5 V

e0

-

3A991.D

TIN LEAD

-

8542.39.00.01

BOTTOM

BALL

-

1.27 mm

compliant

-

432

S-PBGA-B432

-

Not Qualified

COMMERCIAL

10 ns

-

-

232 I/O

1.7 mm

FLASH PLD

MACROCELL

-

-

-

-

-

40 mm

40 mm

-

YES

100

67 MHz

ADVANCED MICRO DEVICES INC

3

64

85 °C

-40 °C

PLASTIC/EPOXY

QFP

-

TQFP100,.63SQ

SQUARE

FLATPACK

Active

-

No

5.5 V

4.5 V

5 V

e0

-

-

TIN LEAD

YES

-

QUAD

GULL WING

240

0.5 mm

not_compliant

30

-

S-PQFP-G100

64

Not Qualified

INDUSTRIAL

14.5 ns

PAL/PLA-TYPE

68

2 DEDICATED INPUTS, 64 I/O

-

EE PLD

-

64

YES

2

YES

-

14 mm

14 mm

-

YES

44

76.9 MHz

XILINX INC

1

25

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

WQCCJ, LDCC44,.7SQ

LDCC44,.7SQ

SQUARE

CHIP CARRIER, WINDOW

Obsolete

LCC

No

5.5 V

4.5 V

5 V

e0

-

-

TIN LEAD

54 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 108 FLIP-FLOPS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

44

S-CQCC-J44

-

Not Qualified

INDUSTRIAL

22 ns

-

-

8 DEDICATED INPUTS, 25 I/O

4.826 mm

UV PLD

MACROCELL

54

NO

8

NO

-

16.51 mm

16.51 mm

-

YES

44

77 MHz

NXP SEMICONDUCTORS

-

32

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Obsolete

LCC

-

5.25 V

4.75 V

5 V

-

-

-

-

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

44

S-PQCC-J44

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

-

-

2

-

-

16.5862 mm

16.5862 mm

-

YES

44

-

PHILIPS SEMICONDUCTORS

-

-

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC44,.7SQ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Transferred

-

No

-

-

5 V

e0

-

-

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-PQCC-J44

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

-

-

EE PLD

-

64

YES

-

YES

-

-

-

-

YES

44

80 MHz

ADVANCED MICRO DEVICES INC

3

32

70 °C

-

PLASTIC/EPOXY

QCCJ

-

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Active

-

No

5.5 V

4.5 V

5 V

e0

-

-

TIN LEAD

YES

-

QUAD

J BEND

225

1.27 mm

not_compliant

30

-

S-PQCC-J44

32

Not Qualified

COMMERCIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

-

EE PLD

-

64

YES

2

YES

-

16.585 mm

16.585 mm

-

YES

100

59 MHz

XILINX INC

-

80

70 °C

-

PLASTIC/EPOXY

TFQFP

TFQFP,

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

-

3.63 V

2.97 V

3.3 V

-

-

-

-

128 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

100

S-PQFP-G100

-

Not Qualified

COMMERCIAL

17.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

-

-

2

-

-

14 mm

14 mm

-

YES

44

111 MHz

NXP SEMICONDUCTORS

-

32

70 °C

-

PLASTIC/EPOXY

QCCJ

-

-

SQUARE

CHIP CARRIER

Obsolete

-

-

3.6 V

3 V

3.3 V

-

-

-

-

-

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-PQCC-J44

-

Not Qualified

COMMERCIAL

9 ns

-

-

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

-

-

2

-

-

16.5862 mm

16.5862 mm

-

YES

44

-

XILINX INC

3

-

70 °C

-

PLASTIC/EPOXY

QCCJ

-

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

-

No

-

-

3.3 V

e0

-

-

TIN LEAD

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

-

S-PQCC-J44

-

Not Qualified

COMMERCIAL

9 ns

-

-

-

-

EE PLD

-

64

YES

-

YES

-

-

-

-

YES

48

222 MHz

XILINX INC

3

38

70 °C

-

PLASTIC/EPOXY

FBGA

FBGA, BGA48,7X7,32

BGA48,7X7,32

SQUARE

GRID ARRAY, FINE PITCH

Obsolete

BGA

Yes

2.62 V

2.37 V

2.5 V

e1

-

-

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

YES

8542.39.00.01

BOTTOM

BALL

260

0.8 mm

compliant

30

48

S-PBGA-B48

-

Not Qualified

COMMERCIAL

5 ns

-

-

0 DEDICATED INPUTS, 38 I/O

1.8 mm

FLASH PLD

MACROCELL

72

YES

-

YES

-

7 mm

7 mm

-

YES

128

63 MHz

XILINX INC

1

97

70 °C

-

PLASTIC/EPOXY

LFQFP

LFQFP, QFP128,.63X.87,20

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

5.25 V

4.75 V

5 V

-

-

-

-

YES

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

128

R-PQFP-G128

-

Not Qualified

COMMERCIAL

14.5 ns

-

-

2 DEDICATED INPUTS, 97 I/O

1.6 mm

EE PLD

MACROCELL

128

YES

2

YES

-

20 mm

14 mm

-

YES

225

45.5 MHz

XILINX INC

1

78

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WBGA

WBGA, BGA225,15X15

BGA225,15X15

SQUARE

GRID ARRAY, WINDOW

Obsolete

BGA

No

5.5 V

4.5 V

5 V

-

-

-

-

108 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS

8542.39.00.01

BOTTOM

BALL

-

1.5 mm

unknown

-

225

S-CBGA-B225

-

Not Qualified

INDUSTRIAL

36 ns

-

-

12 DEDICATED INPUTS, 78 I/O

-

UV PLD

MACROCELL

108

NO

12

NO

-

-

-

-

YES

100

-

PHILIPS SEMICONDUCTORS

-

-

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, TQFP100,.63SQ

TQFP100,.63SQ

SQUARE

FLATPACK

Transferred

-

No

-

-

-

e0

-

-

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

-

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

13.5 ns

-

-

-

-

EE PLD

-

64

YES

-

YES

-

-

-

-

YES

304

-

XILINX INC

-

192

-

-

PLASTIC/EPOXY

HFQFP

HEAT SINK, QFP-304

-

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Transferred

QFP

-

-

-

5 V

e3

Yes

-

MATTE TIN

-

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

compliant

-

304

S-PQFP-G304

-

Not Qualified

-

-

-

-

0 DEDICATED INPUTS, 192 I/O

4.5 mm

MASK PLD

MACROCELL

-

-

-

-

-

40 mm

40 mm