-

YES

100

63 MHz

NXP SEMICONDUCTORS

-

80

85 °C

-40 °C

PLASTIC/EPOXY

QFP

14 X 20 X 2.80 MM, PLASTIC, SOT-382-1, QFP-100

-

RECTANGULAR

FLATPACK

Obsolete

QFP

-

5.5 V

4.5 V

5 V

-

-

-

8542.39.00.01

QUAD

GULL WING

-

0.65 mm

unknown

-

100

R-PQFP-G100

-

Not Qualified

INDUSTRIAL

17.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

-

-

2

-

-

20 mm

14 mm

-

YES

100

59 MHz

XILINX INC

-

80

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP,

-

RECTANGULAR

FLATPACK

Obsolete

QFP

-

3.63 V

2.97 V

3.3 V

-

-

128 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.65 mm

unknown

-

100

R-PQFP-G100

-

Not Qualified

INDUSTRIAL

17.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

-

-

2

-

-

20 mm

14 mm

-

YES

100

59 MHz

NXP SEMICONDUCTORS

-

80

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP,

-

RECTANGULAR

FLATPACK

Transferred

-

-

3.6 V

3 V

3.3 V

-

-

-

8542.39.00.01

QUAD

GULL WING

-

0.65 mm

unknown

-

-

R-PQFP-G100

-

Not Qualified

INDUSTRIAL

17.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

-

-

2

-

-

20 mm

14 mm

-

-

-

-

XILINX INC

3

-

-

-

-

-

,

-

-

-

Transferred

-

Yes

-

-

-

e3

MATTE TIN

-

8542.39.00.01

-

-

260

-

compliant

30

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NO

192

-

ALTERA CORP

-

148

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

PGA,

-

SQUARE

GRID ARRAY

Obsolete

PGA

-

5.5 V

4.5 V

5 V

-

-

820 FLIP FLOPS; 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V

8542.39.00.01

PERPENDICULAR

PIN/PEG

-

2.54 mm

unknown

-

192

S-CPGA-P192

-

Not Qualified

INDUSTRIAL

-

-

-

4 DEDICATED INPUTS, 148 I/O

5.43 mm

LOADABLE PLD

REGISTERED

-

-

4

-

-

45.15 mm

45.15 mm

-

YES

44

40 MHz

XILINX INC

3

30

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

PLASTIC, MO-047AC, LCC-44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LPCC

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

44

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

32 ns

-

-

2 DEDICATED INPUTS, 30 I/O

4.57 mm

OT PLD

MACROCELL

36

NO

2

NO

-

16.5862 mm

16.5862 mm

-

YES

44

59 MHz

NXP SEMICONDUCTORS

-

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

TQFP,

-

SQUARE

FLATPACK, THIN PROFILE

Transferred

-

-

3.63 V

2.97 V

3.3 V

-

-

32 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.8 mm

unknown

-

-

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

12.5 ns

-

-

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

-

-

2

-

-

10 mm

10 mm

-

YES

44

56 MHz

XILINX INC

3

34

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ,

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

Yes

5.25 V

4.75 V

5 V

e3

Matte Tin (Sn)

-

8542.39.00.01

QUAD

J BEND

245

1.27 mm

compliant

30

44

S-PQCC-J44

-

Not Qualified

COMMERCIAL

15 ns

-

-

0 DEDICATED INPUTS, 34 I/O

4.572 mm

FLASH PLD

MACROCELL

-

-

-

-

-

16.5862 mm

16.5862 mm

-

YES

20

100 MHz

INTEL CORP

-

8

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC20,.4SQ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

Obsolete

QLCC

No

5.25 V

4.75 V

5 V

e0

TIN LEAD

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

QUAD

J BEND

-

1.27 mm

compliant

-

20

S-PQCC-J20

8

Not Qualified

COMMERCIAL

9 ns

PAL-TYPE

18

9 DEDICATED INPUTS, 8 I/O

4.57 mm

OT PLD

MACROCELL

-

-

9

-

72

8.9662 mm

8.9662 mm

-

YES

44

77 MHz

XILINX INC

3

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC44,.7SQ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

44

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

10 ns

-

-

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

64

YES

2

YES

-

16.5862 mm

16.5862 mm

-

YES

44

-

XILINX INC

3

-

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

-

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

-

No

-

-

5 V

e0

TIN LEAD

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

-

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

9.5 ns

-

-

-

-

EE PLD

-

32

YES

-

YES

-

-

-

-

YES

44

91 MHz

NXP SEMICONDUCTORS

-

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

-

-

SQUARE

CHIP CARRIER

Obsolete

-

-

5.5 V

4.5 V

5 V

-

-

32 MACROCELLS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

9.5 ns

-

-

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

-

-

2

-

-

16.5862 mm

16.5862 mm

-

YES

84

50 MHz

XILINX INC

3

69

70 °C

-

PLASTIC/EPOXY

QCCJ

PLASTIC, LCC-84

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5.25 V

4.75 V

5 V

e0

Tin/Lead (Sn85Pb15)

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

84

S-PQCC-J84

-

Not Qualified

COMMERCIAL

20 ns

-

-

0 DEDICATED INPUTS, 69 I/O

5.08 mm

FLASH PLD

MACROCELL

108

YES

-

NO

-

29.3116 mm

29.3116 mm

-

YES

100

-

ALTERA CORP

-

-

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, TQFP100,.63SQ

TQFP100,.63SQ

SQUARE

FLATPACK

Transferred

-

Yes

-

-

-

e3

Matte Tin (Sn)

YES

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

compliant

-

-

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

6 ns

-

-

-

-

EE PLD

-

64

NO

-

YES

-

-

-

-

YES

128

66 MHz

NXP SEMICONDUCTORS

-

96

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

Transferred

-

-

5.5 V

4.5 V

5 V

-

-

-

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

-

R-PQFP-G128

-

Not Qualified

INDUSTRIAL

15 ns

-

-

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

-

-

2

-

-

20 mm

14 mm

-

YES

24

83 MHz

NXP SEMICONDUCTORS

-

10

70 °C

-

PLASTIC/EPOXY

SOP

SOP,

SOP24,.4

RECTANGULAR

SMALL OUTLINE

Transferred

-

-

3.6 V

3 V

3.3 V

-

-

-

8542.39.00.01

DUAL

GULL WING

-

1.27 mm

unknown

-

-

R-PDSO-G24

-

Not Qualified

COMMERCIAL

10 ns

-

-

11 DEDICATED INPUTS, 10 I/O

2.65 mm

EE PLD

MACROCELL

-

-

11

-

-

15.4 mm

7.5 mm

-

YES

84

80 MHz

NXP SEMICONDUCTORS

-

64

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Transferred

-

-

3.63 V

2.97 V

3.3 V

-

-

-

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-PQCC-J84

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

-

-

2

-

-

29.3116 mm

29.3116 mm

-

YES

84

80 MHz

XILINX INC

-

64

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Obsolete

LCC

-

3.63 V

2.97 V

3.3 V

-

-

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

84

S-PQCC-J84

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

-

-

2

-

-

29.3116 mm

29.3116 mm

-

NO

20

18.1 MHz

PHILIPS SEMICONDUCTORS

-

-

70 °C

-

PLASTIC/EPOXY

DIP

-

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

-

No

-

-

5 V

e0

Tin/Lead (Sn/Pb)

-

8542.39.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

-

R-PDIP-T20

8

Not Qualified

COMMERCIAL

35 ns

PAL-TYPE

18

-

-

-

MACROCELL

-

-

-

-

72

-

-

-

YES

84

95.2 MHz

XILINX INC

1

37

70 °C

-

CERAMIC, METAL-SEALED COFIRED

WQCCJ

WQCCJ, LDCC84,1.2SQ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER, WINDOW

Obsolete

LCC

No

5.25 V

4.75 V

5 V

-

-

72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

84

S-CQCC-J84

-

Not Qualified

COMMERCIAL

18.5 ns

-

-

12 DEDICATED INPUTS, 37 I/O

4.826 mm

UV PLD

MACROCELL

72

NO

12

NO

-

29.21 mm

29.21 mm