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  • Moisture Sensitivity Level (MSL)
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  • Max Supply Voltage
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Attribute column

Categories

Embedded - PLDs (Programmable Logic Device)

View Mode:
2797 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Surface Mount

Number of Terminals

Clock Frequency-Max

Ihs Manufacturer

Moisture Sensitivity Levels

Number of I/O Lines

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Packing Method

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Number of Outputs

Qualification Status

Temperature Grade

Propagation Delay

Architecture

Number of Inputs

Organization

Seated Height-Max

Programmable Logic Type

Screening Level

Output Function

Number of Macro Cells

JTAG BST

Number of Dedicated Inputs

In-System Programmable

Number of Product Terms

Length

Width

In Stock

-

Datasheet

NO

20

18 MHz

ADVANCED MICRO DEVICES INC

-

-

75 °C

-

CERAMIC, GLASS-SEALED

DIP

DIP, DIP20,.3

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

e0

-

-

TIN LEAD

-

8542.39.00.01

-

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

20

R-GDIP-T20

8

Not Qualified

COMMERCIAL EXTENDED

25 ns

PAL-TYPE

8

8 DEDICATED INPUTS, 0 I/O

-

OT PLD

-

REGISTERED

-

-

8

-

64

-

-

XCR3032-8PC44C
XCR3032-8PC44C

AMD Xilinx

In Stock

-

Datasheet

YES

44

74 MHz

XILINX INC

-

33

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Obsolete

LCC

-

3.6 V

3 V

3.3 V

-

-

-

-

-

8542.39.00.01

-

QUAD

J BEND

-

1.27 mm

unknown

-

44

S-PQCC-J44

-

Not Qualified

COMMERCIAL

10.5 ns

-

-

2 DEDICATED INPUTS, 33 I/O

4.57 mm

EE PLD

-

MACROCELL

-

-

2

-

-

16.5862 mm

16.5862 mm

In Stock

-

Datasheet

YES

44

80 MHz

ADVANCED MICRO DEVICES INC

-

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC44,.7SQ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5.5 V

4.5 V

5 V

e0

-

-

TIN LEAD

4 PAL BLOCKS; BURIED MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK

8542.39.00.01

-

QUAD

J BEND

-

1.27 mm

unknown

-

44

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

14 ns

-

-

0 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

-

MACROCELL

64

NO

-

YES

-

16.5862 mm

16.5862 mm

MACH211SP-10JI
MACH211SP-10JI

Vantis Corporation

In Stock

-

Datasheet

YES

44

74 MHz

VANTIS CORP

-

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

-

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Transferred

-

No

5.5 V

4.5 V

5 V

e0

-

-

Tin/Lead (Sn/Pb)

PAL BLOCKS INTERCONNECTED BY PIA

-

-

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

14 ns

-

-

0 DEDICATED INPUTS, 32 I/O

-

EE PLD

-

MACROCELL

64

NO

-

YES

-

-

-

GAL16V8-35LP
GAL16V8-35LP

Lattice Semiconductor Corporation

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

Datasheet

YES

48

-

XILINX INC

3

36

70 °C

-

PLASTIC/EPOXY

FBGA

PLASTIC, CSP-48

-

SQUARE

GRID ARRAY, FINE PITCH

Obsolete

BGA

Yes

2.62 V

2.37 V

2.5 V

e1

-

-

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

-

8542.39.00.01

-

BOTTOM

BALL

260

0.8 mm

compliant

30

48

S-PBGA-B48

-

Not Qualified

COMMERCIAL

4 ns

-

-

0 DEDICATED INPUTS, 36 I/O

1.8 mm

FLASH PLD

-

MACROCELL

-

-

-

-

-

7 mm

7 mm

In Stock

-

Datasheet

YES

44

-

XILINX INC

3

34

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Obsolete

LCC

Yes

2.6 V

2.4 V

2.5 V

e3

-

-

Matte Tin (Sn)

-

8542.39.00.01

-

QUAD

J BEND

NOT SPECIFIED

1.27 mm

compliant

NOT SPECIFIED

44

S-PQCC-J44

-

Not Qualified

INDUSTRIAL

3.5 ns

-

-

0 DEDICATED INPUTS, 34 I/O

4.57 mm

FLASH PLD

-

REGISTERED

-

-

-

-

-

16.5862 mm

16.5862 mm

PLUS173BN
PLUS173BN

NXP Semiconductors

In Stock

-

Datasheet

NO

24

-

NXP SEMICONDUCTORS

-

10

75 °C

-

PLASTIC/EPOXY

DIP

DIP, DIP24,.3

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

-

-

-

-

PROGRAMMABLE OUTPUT POLARITY

8542.39.00.01

-

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

24

R-PDIP-T24

10

Not Qualified

COMMERCIAL EXTENDED

15 ns

PLA-TYPE

22

12 DEDICATED INPUTS, 10 I/O

4.7 mm

OT PLD

-

COMBINATORIAL

-

-

12

-

42

31.7 mm

7.62 mm

TIBPSG507ACNT
TIBPSG507ACNT

Texas Instruments

4

-

Datasheet

NO

24

45 MHz

TEXAS INSTRUMENTS INC

-

-

75 °C

-

PLASTIC/EPOXY

DIP

DIP-24

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

-

No

5.25 V

4.75 V

5 V

-

No

-

-

F_MAX FOR 6-BIT COUNTER CNT_/HLD0 APPLICATION = 33MHZ; PROGRAMMABLE SEQUENCE GENERATOR

8542.39.00.01

-

DUAL

THROUGH-HOLE

NOT SPECIFIED

2.54 mm

not_compliant

NOT SPECIFIED

-

R-PDIP-T24

8

Not Qualified

COMMERCIAL EXTENDED

20 ns

PLS-TYPE

13

12 DEDICATED INPUTS, 0 I/O

5.08 mm

OT PLD

-

MACROCELL

-

-

12

-

80

31.64 mm

7.62 mm

EPM2210GF324I3N
EPM2210GF324I3N

Altera Corporation

In Stock

-

Datasheet

YES

324

-

ALTERA CORP

3

272

-

-

PLASTIC/EPOXY

BGA

BGA, BGA324,18X18,40

BGA324,18X18,40

SQUARE

GRID ARRAY

Transferred

BGA

Yes

1.89 V

1.71 V

1.8 V

e1

Yes

3A991.D

TIN SILVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

-

BOTTOM

BALL

245

1 mm

compliant

-

324

S-PBGA-B324

-

Not Qualified

-

7 ns

-

-

0 DEDICATED INPUTS, 272 I/O

2.2 mm

FLASH PLD

-

MACROCELL

1700

YES

-

YES

-

19 mm

19 mm

EPM2210GF324I3N
EPM2210GF324I3N

Intel Corporation

In Stock

-

Datasheet

YES

324

172.4 MHz

INTEL CORP

-

272

100 °C

-40 °C

PLASTIC/EPOXY

BGA

19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324

BGA324,18X18,40

SQUARE

GRID ARRAY

Active

-

Yes

1.89 V

1.71 V

1.8 V

e1

-

3A991.D

TIN SILVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

-

BOTTOM

BALL

-

1 mm

compliant

-

-

S-PBGA-B324

272

Not Qualified

-

7 ns

-

272

0 DEDICATED INPUTS, 272 I/O

2.2 mm

FLASH PLD

-

MACROCELL

1700

YES

-

YES

-

19 mm

19 mm

In Stock

-

Datasheet

YES

208

167 MHz

XILINX INC

3

160

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP-208

-

SQUARE

FLATPACK, FINE PITCH

Obsolete

QFP

Yes

3.6 V

2.7 V

3.3 V

e3

Yes

-

MATTE TIN

-

8542.39.00.01

-

QUAD

GULL WING

-

0.5 mm

compliant

-

208

S-PQFP-G208

-

Not Qualified

INDUSTRIAL

7.5 ns

-

-

160 I/O

4.1 mm

EE PLD

-

MACROCELL

-

-

-

-

-

28 mm

28 mm

PZ3128IS12BP-S
PZ3128IS12BP-S

NXP Semiconductors

In Stock

-

Datasheet

YES

100

66 MHz

NXP SEMICONDUCTORS

-

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TFQFP,

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Transferred

-

-

3.6 V

3 V

3.3 V

-

-

-

-

-

8542.39.00.01

-

QUAD

GULL WING

-

0.5 mm

unknown

-

-

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

14.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

14 mm

14 mm

PZ3128IS12BP-S
PZ3128IS12BP-S

AMD Xilinx

In Stock

-

Datasheet

YES

100

69 MHz

XILINX INC

3

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

14 X 14 MM, 1 MM HEIGHT, PLASTIC, TQFP-100

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

No

3.63 V

2.97 V

3.3 V

-

-

-

-

128 MACROCELLS

8542.39.00.01

TRAY

QUAD

GULL WING

240

0.5 mm

unknown

30

100

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

14.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

128

YES

2

YES

-

14 mm

14 mm

In Stock

-

Datasheet

NO

20

-

ADVANCED MICRO DEVICES INC

-

6

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP, DIP20,.3

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.5 V

4.5 V

5 V

e0

-

3A001.A.2.C

TIN LEAD

-

8542.39.00.01

-

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

20

R-CDIP-T20

8

Not Qualified

MILITARY

75 ns

PAL-TYPE

16

10 DEDICATED INPUTS, 6 I/O

4.318 mm

OT PLD

38535Q/M;38534H;883B

COMBINATORIAL

-

-

10

-

64

25.908 mm

7.62 mm

In Stock

-

Datasheet

YES

280

-

ADVANCED MICRO DEVICES INC

3

216

70 °C

-

PLASTIC/EPOXY

TFBGA

CHIP SCALE, BGA-280

BGA280,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

-

Yes

3.6 V

3 V

3.3 V

e1

-

-

TIN SILVER COPPER

-

-

-

BOTTOM

BALL

-

0.8 mm

compliant

-

-

S-PBGA-B280

-

Not Qualified

COMMERCIAL

7.5 ns

-

-

216 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

-

-

-

16 mm

16 mm

In Stock

-

Datasheet

YES

280

-

XILINX INC

3

216

70 °C

-

PLASTIC/EPOXY

TFBGA

CHIP SCALE, BGA-280

BGA280,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Transferred

BGA

Yes

3.6 V

3 V

3.3 V

e1

Yes

3A991.D

TIN SILVER COPPER

-

8542.39.00.01

-

BOTTOM

BALL

-

0.8 mm

compliant

-

280

S-PBGA-B280

-

Not Qualified

COMMERCIAL

7.5 ns

-

-

216 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

-

-

-

16 mm

16 mm

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

PZ3128-S10BP-S
PZ3128-S10BP-S

AMD Xilinx

In Stock

-

Datasheet

YES

100

77 MHz

XILINX INC

-

80

70 °C

-

PLASTIC/EPOXY

TFQFP

TFQFP,

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

-

3.63 V

2.97 V

3.3 V

-

-

-

-

128 MACROCELLS

8542.39.00.01

-

QUAD

GULL WING

-

0.5 mm

unknown

-

100

S-PQFP-G100

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

14 mm

14 mm

PZ3128-S10BP-S
PZ3128-S10BP-S

NXP Semiconductors

In Stock

-

Datasheet

YES

100

74 MHz

NXP SEMICONDUCTORS

-

80

70 °C

-

PLASTIC/EPOXY

TFQFP

TFQFP,

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Transferred

-

-

3.6 V

3 V

3.3 V

-

-

-

-

-

8542.39.00.01

-

QUAD

GULL WING

-

0.5 mm

unknown

-

-

S-PQFP-G100

-

Not Qualified

COMMERCIAL

13 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

14 mm

14 mm