- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
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- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Packing Method | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
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![]() PAL16R8A-2CJ AMD | In Stock | - | Datasheet | NO | 20 | 18 MHz | ADVANCED MICRO DEVICES INC | - | - | 75 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-GDIP-T20 | 8 | Not Qualified | COMMERCIAL EXTENDED | 25 ns | PAL-TYPE | 8 | 8 DEDICATED INPUTS, 0 I/O | - | OT PLD | - | REGISTERED | - | - | 8 | - | 64 | - | - | ||
![]() XCR3032-8PC44C AMD Xilinx | In Stock | - | Datasheet | YES | 44 | 74 MHz | XILINX INC | - | 33 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 10.5 ns | - | - | 2 DEDICATED INPUTS, 33 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 44 | 80 MHz | ADVANCED MICRO DEVICES INC | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | 4 PAL BLOCKS; BURIED MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 14 ns | - | - | 0 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | 64 | NO | - | YES | - | 16.5862 mm | 16.5862 mm | ||
![]() MACH211SP-10JI Vantis Corporation | In Stock | - | Datasheet | YES | 44 | 74 MHz | VANTIS CORP | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | - | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Transferred | - | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | PAL BLOCKS INTERCONNECTED BY PIA | - | - | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 14 ns | - | - | 0 DEDICATED INPUTS, 32 I/O | - | EE PLD | - | MACROCELL | 64 | NO | - | YES | - | - | - | ||
![]() GAL16V8-35LP Lattice Semiconductor Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() XC9536XV-4CSG48C AMD Xilinx | In Stock | - | Datasheet | YES | 48 | - | XILINX INC | 3 | 36 | 70 °C | - | PLASTIC/EPOXY | FBGA | PLASTIC, CSP-48 | - | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | BGA | Yes | 2.62 V | 2.37 V | 2.5 V | e1 | - | - | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | 8542.39.00.01 | - | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 | 48 | S-PBGA-B48 | - | Not Qualified | COMMERCIAL | 4 ns | - | - | 0 DEDICATED INPUTS, 36 I/O | 1.8 mm | FLASH PLD | - | MACROCELL | - | - | - | - | - | 7 mm | 7 mm | ||
![]() XC9536XV-4PCG44I AMD Xilinx | In Stock | - | Datasheet | YES | 44 | - | XILINX INC | 3 | 34 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 2.6 V | 2.4 V | 2.5 V | e3 | - | - | Matte Tin (Sn) | - | 8542.39.00.01 | - | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | compliant | NOT SPECIFIED | 44 | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 3.5 ns | - | - | 0 DEDICATED INPUTS, 34 I/O | 4.57 mm | FLASH PLD | - | REGISTERED | - | - | - | - | - | 16.5862 mm | 16.5862 mm | ||
![]() PLUS173BN NXP Semiconductors | In Stock | - | Datasheet | NO | 24 | - | NXP SEMICONDUCTORS | - | 10 | 75 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | - | - | - | - | PROGRAMMABLE OUTPUT POLARITY | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 24 | R-PDIP-T24 | 10 | Not Qualified | COMMERCIAL EXTENDED | 15 ns | PLA-TYPE | 22 | 12 DEDICATED INPUTS, 10 I/O | 4.7 mm | OT PLD | - | COMBINATORIAL | - | - | 12 | - | 42 | 31.7 mm | 7.62 mm | ||
![]() TIBPSG507ACNT Texas Instruments | 4 | - | Datasheet | NO | 24 | 45 MHz | TEXAS INSTRUMENTS INC | - | - | 75 °C | - | PLASTIC/EPOXY | DIP | DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | - | No | - | - | F_MAX FOR 6-BIT COUNTER CNT_/HLD0 APPLICATION = 33MHZ; PROGRAMMABLE SEQUENCE GENERATOR | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | - | R-PDIP-T24 | 8 | Not Qualified | COMMERCIAL EXTENDED | 20 ns | PLS-TYPE | 13 | 12 DEDICATED INPUTS, 0 I/O | 5.08 mm | OT PLD | - | MACROCELL | - | - | 12 | - | 80 | 31.64 mm | 7.62 mm | ||
![]() EPM2210GF324I3N Altera Corporation | In Stock | - | Datasheet | YES | 324 | - | ALTERA CORP | 3 | 272 | - | - | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Transferred | BGA | Yes | 1.89 V | 1.71 V | 1.8 V | e1 | Yes | 3A991.D | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | - | BOTTOM | BALL | 245 | 1 mm | compliant | - | 324 | S-PBGA-B324 | - | Not Qualified | - | 7 ns | - | - | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | FLASH PLD | - | MACROCELL | 1700 | YES | - | YES | - | 19 mm | 19 mm | ||
![]() EPM2210GF324I3N Intel Corporation | In Stock | - | Datasheet | YES | 324 | 172.4 MHz | INTEL CORP | - | 272 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | - | Yes | 1.89 V | 1.71 V | 1.8 V | e1 | - | 3A991.D | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B324 | 272 | Not Qualified | - | 7 ns | - | 272 | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | FLASH PLD | - | MACROCELL | 1700 | YES | - | YES | - | 19 mm | 19 mm | ||
![]() XCR3256XL-7.5PQG208I AMD Xilinx | In Stock | - | Datasheet | YES | 208 | 167 MHz | XILINX INC | 3 | 160 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP-208 | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | Yes | 3.6 V | 2.7 V | 3.3 V | e3 | Yes | - | MATTE TIN | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | - | Not Qualified | INDUSTRIAL | 7.5 ns | - | - | 160 I/O | 4.1 mm | EE PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
![]() PZ3128IS12BP-S NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 66 MHz | NXP SEMICONDUCTORS | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() PZ3128IS12BP-S AMD Xilinx | In Stock | - | Datasheet | YES | 100 | 69 MHz | XILINX INC | 3 | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, PLASTIC, TQFP-100 | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | No | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | TRAY | QUAD | GULL WING | 240 | 0.5 mm | unknown | 30 | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | 128 | YES | 2 | YES | - | 14 mm | 14 mm | ||
Tiny WHSL | In Stock | - | Datasheet | NO | 20 | - | ADVANCED MICRO DEVICES INC | - | 6 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | - | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-CDIP-T20 | 8 | Not Qualified | MILITARY | 75 ns | PAL-TYPE | 16 | 10 DEDICATED INPUTS, 6 I/O | 4.318 mm | OT PLD | 38535Q/M;38534H;883B | COMBINATORIAL | - | - | 10 | - | 64 | 25.908 mm | 7.62 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 280 | - | ADVANCED MICRO DEVICES INC | 3 | 216 | 70 °C | - | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Yes | 3.6 V | 3 V | 3.3 V | e1 | - | - | TIN SILVER COPPER | - | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B280 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 216 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
![]() XCR3384XL-7.5CSG280C AMD Xilinx | In Stock | - | Datasheet | YES | 280 | - | XILINX INC | 3 | 216 | 70 °C | - | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.6 V | 3 V | 3.3 V | e1 | Yes | 3A991.D | TIN SILVER COPPER | - | 8542.39.00.01 | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | 280 | S-PBGA-B280 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 216 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
![]() 18CV8PC-25 onsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() PZ3128-S10BP-S AMD Xilinx | In Stock | - | Datasheet | YES | 100 | 77 MHz | XILINX INC | - | 80 | 70 °C | - | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | 100 | S-PQFP-G100 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() PZ3128-S10BP-S NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 74 MHz | NXP SEMICONDUCTORS | - | 80 | 70 °C | - | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | COMMERCIAL | 13 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm |