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Embedded - PLDs (Programmable Logic Device)

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2797 Results

Product	Inventory	Pricing(USD)	Datasheet	Surface Mount	Number of Terminals	Clock Frequency-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of I/O Lines	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	JESD-609 Code	Pbfree Code	Terminal Finish	Additional Feature	HTS Code	Packing Method	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Temperature Grade	Propagation Delay	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Screening Level	Output Function	Number of Macro Cells	JTAG BST	Number of Dedicated Inputs	In-System Programmable	Number of Product Terms	Length	Width
XCR3032XL-5CSG48I AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	48	200 MHz	XILINX INC	3	32	85 °C	-40 °C	PLASTIC/EPOXY	FBGA	CHIP SCALE, BGA-48	-	SQUARE	GRID ARRAY, FINE PITCH	Transferred	BGA	Yes	3.6 V	2.7 V	3.3 V	e1	Yes	TIN SILVER COPPER	-	8542.39.00.01	-	BOTTOM	BALL	260	0.8 mm	compliant	30	48	S-PBGA-B48	-	Not Qualified	INDUSTRIAL	5 ns	-	-	32 I/O	1.8 mm	EE PLD	-	MACROCELL	-	-	-	-	-	7 mm	7 mm
XCR3032XL-5CSG48I AMD Tiny WHSL	In Stock	-	Datasheet	YES	48	200 MHz	ADVANCED MICRO DEVICES INC	3	32	85 °C	-40 °C	PLASTIC/EPOXY	FBGA	CHIP SCALE, BGA-48	-	SQUARE	GRID ARRAY, FINE PITCH	Obsolete	-	Yes	3.6 V	2.7 V	3.3 V	e1	-	TIN SILVER COPPER	-	-	-	BOTTOM	BALL	260	0.8 mm	compliant	30	-	S-PBGA-B48	-	Not Qualified	INDUSTRIAL	5 ns	-	-	32 I/O	1.8 mm	EE PLD	-	MACROCELL	-	-	-	-	-	7 mm	7 mm
P3Z22V10-BDH Philips Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	24	69 MHz	PHILIPS SEMICONDUCTORS	-	-	70 °C	-	PLASTIC/EPOXY	TSSOP	-	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Transferred	-	No	-	-	3.3 V	e0	-	Tin/Lead (Sn/Pb)	-	8542.39.00.01	-	DUAL	GULL WING	-	0.635 mm	unknown	-	-	R-PDSO-G24	10	Not Qualified	COMMERCIAL	15 ns	PAL-TYPE	22	-	-	EE PLD	-	MACROCELL	-	-	-	-	132	-	-
P3Z22V10-BDH AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	24	69 MHz	XILINX INC	-	-	70 °C	-	PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP24,.25	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	-	No	-	-	3.3 V	e0	-	Tin/Lead (Sn/Pb)	-	8542.39.00.01	-	DUAL	GULL WING	-	0.635 mm	unknown	-	-	R-PDSO-G24	10	Not Qualified	COMMERCIAL	15 ns	PAL-TYPE	22	-	-	EE PLD	-	MACROCELL	-	-	-	-	132	-	-
P3Z22V10-BDH NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	24	69 MHz	NXP SEMICONDUCTORS	-	10	70 °C	-	PLASTIC/EPOXY	TSSOP	4.40 MM, PLASTIC, SOT-355-1, TSSOP-24	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSSOP	-	3.6 V	3 V	3.3 V	-	-	-	-	8542.39.00.01	-	DUAL	GULL WING	-	0.65 mm	unknown	-	24	R-PDSO-G24	-	Not Qualified	COMMERCIAL	15 ns	-	-	11 DEDICATED INPUTS, 10 I/O	1.1 mm	EE PLD	-	MACROCELL	-	-	11	-	-	7.8 mm	4.4 mm
XC73108-20PQ160I AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	160	35.7 MHz	XILINX INC	3	78	85 °C	-40 °C	PLASTIC/EPOXY	QFP	PLASTIC, QFP-160	QFP160,1.2SQ	SQUARE	FLATPACK	Obsolete	QFP	No	5.5 V	4.5 V	5 V	e0	-	TIN LEAD	108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS	8542.39.00.01	-	QUAD	GULL WING	225	0.65 mm	not_compliant	30	160	S-PQFP-G160	-	Not Qualified	INDUSTRIAL	45 ns	-	-	12 DEDICATED INPUTS, 78 I/O	4.1 mm	OT PLD	-	MACROCELL	108	NO	12	NO	-	28 mm	28 mm
PALC16R8-35WC Cypress Semiconductor Tiny WHSL	In Stock	-	Datasheet	NO	20	18 MHz	CYPRESS SEMICONDUCTOR CORP	-	-	75 °C	-	CERAMIC, GLASS-SEALED	WDIP	WDIP, DIP20,.3	DIP20,.3	RECTANGULAR	IN-LINE, WINDOW	Obsolete	DIP	No	5.5 V	4.5 V	5 V	e0	No	TIN LEAD	1 EXTERNAL CLOCK	8542.39.00.01	-	DUAL	THROUGH-HOLE	-	2.54 mm	not_compliant	-	20	R-GDIP-T20	8	Not Qualified	COMMERCIAL EXTENDED	25 ns	PAL-TYPE	8	8 DEDICATED INPUTS, 0 I/O	5.08 mm	UV PLD	-	REGISTERED	-	-	8	-	64	24.13 mm	7.62 mm
XC95144XV-4TQG100I AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	100	-	XILINX INC	3	81	85 °C	-40 °C	PLASTIC/EPOXY	LFQFP	PLASTIC, TQFP-100	-	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP	Yes	2.6 V	2.4 V	2.5 V	e3	-	MATTE TIN	-	8542.39.00.01	-	QUAD	GULL WING	-	0.5 mm	compliant	-	100	S-PQFP-G100	-	Not Qualified	INDUSTRIAL	4 ns	-	-	0 DEDICATED INPUTS, 81 I/O	1.6 mm	FLASH PLD	-	REGISTERED	-	-	-	-	-	14 mm	14 mm
PZ5064CS10BC-S AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	44	80 MHz	XILINX INC	3	32	70 °C	-	PLASTIC	QFP	TQFP-44	TQFP44,.47SQ,32	SQUARE	FLATPACK	Transferred	-	No	5.5 V	4.5 V	5 V	-	-	-	YES	8542.39.00.01	TRAY	QUAD	GULL WING	240	0.8 mm	not_compliant	30	-	S-PQFP-G44	32	Not Qualified	COMMERCIAL	12 ns	PAL/PLA-TYPE	36	2 DEDICATED INPUTS, 32 I/O	-	EE PLD	-	-	64	YES	2	YES	-	10 mm	10 mm
XC9536F-15VQ44I AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	44	56 MHz	XILINX INC	3	34	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,	-	SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	No	5.5 V	4.5 V	5 V	e0	-	TIN LEAD	-	8542.39.00.01	-	QUAD	GULL WING	-	0.8 mm	compliant	-	44	S-PQFP-G44	-	Not Qualified	INDUSTRIAL	15 ns	-	-	0 DEDICATED INPUTS, 34 I/O	1.2 mm	FLASH PLD	-	MACROCELL	-	-	-	-	-	10 mm	10 mm
XA9536XL-10VQG44Q AMD Tiny WHSL	In Stock	-	Datasheet	YES	44	-	ADVANCED MICRO DEVICES INC	3	34	125 °C	-40 °C	PLASTIC/EPOXY	TQFP	VQFP-44	TQFP44,.47SQ,32	SQUARE	FLATPACK, THIN PROFILE	Obsolete	-	Yes	3.6 V	3 V	3.3 V	e3	-	MATTE TIN	YES	-	-	QUAD	GULL WING	260	0.8 mm	compliant	30	-	S-PQFP-G44	-	Not Qualified	AUTOMOTIVE	10 ns	-	-	0 DEDICATED INPUTS, 34 I/O	1.2 mm	FLASH PLD	AEC-Q100	MACROCELL	36	YES	-	YES	-	10 mm	10 mm
PZ5064I10A84-T NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	84	77 MHz	NXP SEMICONDUCTORS	-	64	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,	-	SQUARE	CHIP CARRIER	Transferred	-	-	5.5 V	4.5 V	5 V	-	-	-	-	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	-	S-PQCC-J84	-	Not Qualified	INDUSTRIAL	12.5 ns	-	-	2 DEDICATED INPUTS, 64 I/O	4.57 mm	EE PLD	-	MACROCELL	-	-	2	-	-	29.3116 mm	29.3116 mm
PZ5064I10A84-T AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	84	77 MHz	XILINX INC	-	64	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,	-	SQUARE	CHIP CARRIER	Obsolete	LCC	-	5.5 V	4.5 V	5 V	-	-	-	64 MACROCELLS	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	84	S-PQCC-J84	-	Not Qualified	INDUSTRIAL	12.5 ns	-	-	2 DEDICATED INPUTS, 64 I/O	4.57 mm	EE PLD	-	MACROCELL	-	-	2	-	-	29.3116 mm	29.3116 mm
PZ3064-12BC-T AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	44	67 MHz	XILINX INC	-	32	70 °C	-	PLASTIC/EPOXY	TQFP	TQFP,	-	SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	-	3.63 V	2.97 V	3.3 V	-	-	-	64 MACROCELLS	8542.39.00.01	-	QUAD	GULL WING	-	0.8 mm	unknown	-	44	S-PQFP-G44	-	Not Qualified	COMMERCIAL	14.5 ns	-	-	2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD	-	MACROCELL	-	-	2	-	-	10 mm	10 mm
PZ3064-12BC-T NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	44	67 MHz	NXP SEMICONDUCTORS	-	32	70 °C	-	PLASTIC/EPOXY	TQFP	TQFP,	-	SQUARE	FLATPACK, THIN PROFILE	Transferred	-	-	3.63 V	2.97 V	3.3 V	-	-	-	-	8542.39.00.01	-	QUAD	GULL WING	-	0.8 mm	unknown	-	-	S-PQFP-G44	-	Not Qualified	COMMERCIAL	14.5 ns	-	-	2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD	-	MACROCELL	-	-	2	-	-	10 mm	10 mm
PZ3032I12BC Philips Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	44	-	PHILIPS SEMICONDUCTORS	-	-	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP, TQFP44,.47SQ,32	TQFP44,.47SQ,32	SQUARE	FLATPACK	Transferred	-	No	-	-	3.3 V	e0	-	Tin/Lead (Sn/Pb)	NO	8542.39.00.01	-	QUAD	GULL WING	-	0.8 mm	unknown	-	-	S-PQFP-G44	-	Not Qualified	INDUSTRIAL	15 ns	-	-	-	-	EE PLD	-	-	32	NO	-	NO	-	-	-
PZ3032I12BC NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	44	47 MHz	NXP SEMICONDUCTORS	-	32	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44	-	SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	-	3.63 V	2.97 V	3.3 V	-	-	-	-	8542.39.00.01	-	QUAD	GULL WING	-	0.8 mm	unknown	-	44	S-PQFP-G44	-	Not Qualified	INDUSTRIAL	19 ns	-	-	2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD	-	MACROCELL	-	-	2	-	-	10 mm	10 mm
EPM1810GC-45 Altera Corporation Tiny WHSL	In Stock	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
PZ3064DS10A44 AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	44	-	XILINX INC	3	-	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	-	LDCC44,.7SQ	SQUARE	CHIP CARRIER	Obsolete	-	No	-	-	-	e0	-	TIN LEAD	YES	8542.39.00.01	-	QUAD	J BEND	225	1.27 mm	not_compliant	30	-	S-PQCC-J44	-	Not Qualified	INDUSTRIAL	11.5 ns	-	-	-	-	EE PLD	-	-	64	YES	-	YES	-	-	-
XH95216-7PQ160C AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	160	-	XILINX INC	3	133	-	-	PLASTIC/EPOXY	QFP	PLASTIC, QFP-160	QFP160,1.2SQ	SQUARE	FLATPACK	Transferred	QFP	No	-	-	5 V	e0	No	TIN LEAD	-	8542.39.00.01	-	QUAD	GULL WING	-	0.65 mm	compliant	-	160	S-PQFP-G160	-	Not Qualified	-	-	-	-	0 DEDICATED INPUTS, 133 I/O	3.94 mm	MASK PLD	-	MACROCELL	-	-	-	-	-	28 mm	28 mm