- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Packing Method | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
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![]() XC95180-10HQ208C AMD Xilinx | In Stock | - | Datasheet | YES | 208 | - | XILINX INC | 3 | 166 | 70 °C | - | PLASTIC/EPOXY | HFQFP | HFQFP, | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | No | - | - | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 0 DEDICATED INPUTS, 166 I/O | 4.1 mm | FLASH PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
![]() XC9536XV-3CSG48C AMD Xilinx | In Stock | - | Datasheet | YES | 48 | - | XILINX INC | 3 | 36 | 70 °C | - | PLASTIC/EPOXY | FBGA | FBGA, | - | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | BGA | Yes | 2.6 V | 2.4 V | 2.5 V | e1 | - | - | TIN SILVER COPPER | - | 8542.39.00.01 | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | 48 | S-PBGA-B48 | - | Not Qualified | COMMERCIAL | 3.5 ns | - | - | 0 DEDICATED INPUTS, 36 I/O | 1.8 mm | FLASH PLD | - | REGISTERED | - | - | - | - | - | 7 mm | 7 mm | ||
![]() XC95108F-7PQG100C AMD Xilinx | In Stock | - | Datasheet | YES | 100 | 83 MHz | XILINX INC | 3 | 81 | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Obsolete | QFP | Yes | 5.25 V | 4.75 V | 5 V | e3 | - | - | MATTE TIN | - | 8542.39.00.01 | - | QUAD | GULL WING | 245 | 0.65 mm | compliant | 30 | 100 | R-PQFP-G100 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 0 DEDICATED INPUTS, 81 I/O | 3.4 mm | FLASH PLD | - | MACROCELL | - | - | - | - | - | 20 mm | 14 mm | ||
![]() PZ3064-10BC-S AMD Xilinx | In Stock | - | Datasheet | YES | 44 | 77 MHz | XILINX INC | 3 | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | - | - | - | - | 64 MACROCELL | 8542.39.00.01 | TRAY | QUAD | GULL WING | 240 | 0.8 mm | unknown | 30 | 44 | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | - | MACROCELL | 64 | NO | 2 | NO | - | 10 mm | 10 mm | ||
Tiny WHSL | In Stock | - | Datasheet | NO | 24 | 33.3 MHz | ADVANCED MICRO DEVICES INC | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 24 | R-CDIP-T24 | 10 | Not Qualified | MILITARY | 20 ns | PAL-TYPE | 22 | 11 DEDICATED INPUTS, 10 I/O | 5.08 mm | EE PLD | 38535Q/M;38534H;883B | MACROCELL | - | - | 11 | - | 132 | 31.9405 mm | 7.62 mm | ||
![]() PALCE22V10H-20E4/BLA Teledyne e2v | In Stock | - | - | NO | 24 | 31.2 MHz | TELEDYNE E2V (UK) LTD | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 5.5 V | 4.5 V | 5 V | - | - | 3A001.A.2.C | - | IT ALSO AVAILABLE IN GDIP-24 PACKAGE | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | - | compliant | - | - | R-CDIP-T24 | - | - | MILITARY | 20 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | - | EE PLD | - | MACROCELL | - | - | 11 | - | - | - | - | ||
Tiny WHSL | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() PAL16R6B-2CJ Vantis Corporation | In Stock | - | Datasheet | NO | 20 | 25 MHz | VANTIS CORP | - | - | 70 °C | - | CERAMIC | DIP | - | DIP20,.3 | RECTANGULAR | IN-LINE | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-XDIP-T20 | 6 | Not Qualified | COMMERCIAL | 25 ns | PAL-TYPE | 10 | - | - | OT PLD | - | REGISTERED | - | - | - | - | 64 | - | - | ||
![]() PAL16R6B-2CJ AMD | In Stock | - | Datasheet | NO | 20 | 25 MHz | ADVANCED MICRO DEVICES INC | - | 2 | 75 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | POWER-UP RESET; REGISTER PRELOAD; 1 EXTERNAL CLOCK | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-CDIP-T20 | 6 | Not Qualified | COMMERCIAL EXTENDED | 25 ns | PAL-TYPE | 10 | 8 DEDICATED INPUTS, 2 I/O | 5.08 mm | OT PLD | - | MIXED | - | - | 8 | - | 64 | 24.257 mm | 7.62 mm | ||
![]() PZ5128IS15BP AMD Xilinx | In Stock | - | Datasheet | YES | 100 | - | XILINX INC | 3 | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Obsolete | - | No | - | - | 5 V | - | - | - | - | YES | 8542.39.00.01 | - | QUAD | GULL WING | 240 | 0.5 mm | unknown | 30 | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | - | - | EE PLD | - | - | 128 | YES | - | YES | - | - | - | ||
![]() PZ5128IS15BP Philips Semiconductors | In Stock | - | Datasheet | YES | 100 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | - | - | EE PLD | - | - | 128 | YES | - | YES | - | - | - | ||
![]() PZ5128IS15BP NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 63 MHz | NXP SEMICONDUCTORS | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | 14 X 14 X 1 MM, PLASTIC, SOT-386-1, TQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() PAL14L4NC Texas Instruments | In Stock | - | Datasheet | NO | 20 | - | NATIONAL SEMICONDUCTOR CORP | - | - | 75 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | ACTIVE LOW OUTPUT | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T20 | 4 | Not Qualified | COMMERCIAL EXTENDED | 35 ns | PAL-TYPE | 14 | 14 DEDICATED INPUTS, 0 I/O | 5.08 mm | OT PLD | - | COMBINATORIAL | - | - | 14 | - | 16 | 26.075 mm | 7.62 mm | ||
![]() CY7C332-25WC Cypress Semiconductor | In Stock | - | Datasheet | NO | 28 | 35.7 MHz | CYPRESS SEMICONDUCTOR CORP | - | 12 | 75 °C | - | CERAMIC, GLASS-SEALED | WDIP | 0.300 INCH, WINDOWED, CERDIP-28 | DIP28,.3 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | 12 I/O MACROCELLS; 2 EXTERNAL CLOCKS; VARIABLE PRODUCT TERMS; SHARED INPUT/CLOCK | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | not_compliant | - | 28 | R-GDIP-T28 | 12 | Not Qualified | COMMERCIAL EXTENDED | 25 ns | PAL-TYPE | 25 | 10 DEDICATED INPUTS, 12 I/O | 5.08 mm | UV PLD | - | MACROCELL | - | - | 10 | - | 192 | 37.0205 mm | 7.62 mm | ||
![]() M4-64/32-15VC48 Vantis Corporation | In Stock | - | Datasheet | YES | 48 | 37 MHz | VANTIS CORP | - | 32 | 70 °C | - | PLASTIC/EPOXY | QFP | - | QFP48,.35SQ,20 | SQUARE | FLATPACK | Transferred | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 64 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK; PROGRAMMABLE POLARITY | - | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G48 | - | Not Qualified | COMMERCIAL | 15 ns | - | - | 0 DEDICATED INPUTS, 32 I/O | - | EE PLD | - | MACROCELL | 64 | YES | - | YES | - | - | - | ||
![]() XC95180-10HQG208 AMD Xilinx | In Stock | - | Datasheet | YES | 208 | - | XILINX INC | 3 | 168 | - | - | PLASTIC/EPOXY | HFQFP | HFQFP, | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | Yes | - | - | 3.3 V | e3 | - | - | MATTE TIN | CONFIGURABLE 3.3V OR 5V I/O OPERATION; INSYSTEM PROGRAMMABLE | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | FLASH PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
![]() XCR3256XL-7.5CS280C AMD Xilinx | In Stock | - | Datasheet | YES | 280 | 167 MHz | XILINX INC | 3 | 160 | 70 °C | - | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3.6 V | 3 V | 3.3 V | e0 | No | - | TIN LEAD | - | 8542.39.00.01 | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | 280 | S-PBGA-B280 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 160 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 280 | 167 MHz | ADVANCED MICRO DEVICES INC | 3 | 160 | 70 °C | - | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | - | No | 3.6 V | 3 V | 3.3 V | e0 | - | - | TIN LEAD | - | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B280 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 160 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
![]() P3Z22V10-DA-T AMD Xilinx | In Stock | - | Datasheet | YES | 28 | 80 MHz | XILINX INC | - | 10 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 28 | S-PQCC-J28 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 11 | - | - | 11.5062 mm | 11.5062 mm | ||
![]() P3Z22V10-DA-T NXP Semiconductors | In Stock | - | Datasheet | YES | 28 | 83 MHz | NXP SEMICONDUCTORS | - | 10 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Transferred | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J28 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 11 | - | - | 11.5062 mm | 11.5062 mm |