- Manufacturer
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Macro Cells
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Programmable Type
- Propagation Delay
- RoHS Status
- Series
Attribute column
Categories
Embedded - CPLDs (Complex Programmable Logic Devices)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Programmable Type | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Number of Ports | Nominal Supply Current | Clock Frequency | Propagation Delay | Turn On Delay Time | Address Bus Width | Number of Logic Elements/Cells | Density | Number of Gates | Max Frequency | Number of Programmable I/O | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | Voltage Supply - Internal | Delay Time tpd(1) Max | Number of Logic Elements/Blocks | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 LC4256V-75T100C Lattice Semiconductor Corporation | 742 | - | Datasheet | - | - | Surface Mount | Surface Mount | 100-LQFP | - | 100 | - | EEPROM | 64 | - | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | - | - | YES | 8542.39.00.01 | QUAD | GULL WING | 240 | 3.3V | 0.5mm | - | 178.57MHz | 30 | LC4256 | 100 | - | - | 3.3V | - | - | - | In System Programmable | 3.6V | 3V | 12.5mA | - | 12.5mA | - | 7.5 ns | 7.5 ns | - | 36 | - | - | - | 48 | - | - | MACROCELL | 256 | YES | 10 | 3V~3.6V | - | 16 | 1.6mm | 14mm | 14mm | No | Non-RoHS Compliant | Lead Free | ||
 XCR3128XL-10CS144I Xilinx Inc. | 695 | - | Datasheet | 10 Weeks | - | - | Surface Mount | 144-TFBGA, CSPBGA | YES | 144 | - | EEPROM | 108 | - | -40°C~85°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | - | - | YES | - | BOTTOM | BALL | 240 | 3.3V | - | - | - | 30 | - | 144 | - | - | 3.3V | 3.6V | - | - | In System Programmable (min 1K program/erase cycles) | - | - | - | - | - | - | 10 ns | 10 ns | - | 8 | - | 3000 | 95MHz | - | - | 10 | MACROCELL | 128 | YES | - | 2.7V~3.6V | 9.1ns | - | 1.2mm | 12mm | 12mm | No | Non-RoHS Compliant | - | ||
 XCR3256XL-12FTG256I Xilinx Inc. | 33 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 256-LBGA | - | - | - | EEPROM | 164 | - | -40°C~85°C TA | Tray | 2003 | CoolRunner XPLA3 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | - | - | 30 | - | 256 | - | Not Qualified | 3.3V | 3.6V | - | - | In System Programmable (min 1K program/erase cycles) | - | - | - | - | - | - | 12 ns | - | - | 16 | - | 6000 | 88MHz | - | - | 12 | MACROCELL | 256 | YES | - | 2.7V~3.6V | 10.8ns | - | 1.55mm | 17mm | 17mm | - | ROHS3 Compliant | - | ||
 EPM570GF256C3 Intel | 33 |
| Datasheet | 8 Weeks | - | - | Surface Mount | 256-BGA | YES | - | - | - | 160 | - | 0°C~85°C TJ | Tray | 2014 | MAX® II | e0 | - | Active | 3 (168 Hours) | 256 | EAR99 | TIN LEAD | - | - | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | - | - | 30 | EPM570 | - | S-PBGA-B256 | Not Qualified | - | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | - | - | - | - | - | - | 5.4 ns | - | - | - | - | - | - | - | - | - | MACROCELL | 440 | YES | - | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | - | Non-RoHS Compliant | - | ||
 ATF1508AS-15QC100 Microchip Technology | 33 | - | Datasheet | - | Lead, Tin | Surface Mount | Surface Mount | 100-BQFP | - | 100 | 100-PQFP (14x20) | EEPROM | 80 | - | 0°C~70°C TA | Tray | 1997 | ATF15xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | 70°C | 0°C | - | - | - | - | - | - | - | - | - | - | ATF1508AS | - | - | - | 5V | - | - | - | In System Programmable (min 10K program/erase cycles) | 5.25V | 4.75V | - | - | - | - | 15 ns | - | - | - | - | 3000 | 100MHz | 80 | 8 | 15 | - | 128 | - | - | 4.75V~5.25V | 15ns | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
 XC2C256-7PQG208C Xilinx Inc. | 22 | - | Datasheet | 10 Weeks | Tin | Surface Mount | Surface Mount | 208-BFQFP | - | 208 | - | - | 173 | - | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e3 | yes | Active | 3 (168 Hours) | 208 | EAR99 | - | - | - | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | QUAD | GULL WING | 245 | 1.8V | 0.5mm | - | - | 30 | XC2C256 | 208 | - | Not Qualified | 1.8V | - | - | - | In System Programmable | 1.9V | 1.7V | - | - | - | - | 7.5 ns | 7.5 ns | - | 16 | - | 6000 | 152MHz | - | - | 7 | MACROCELL | 256 | YES | - | 1.7V~1.9V | 6.7ns | - | 4.1mm | 28mm | 28mm | - | ROHS3 Compliant | Lead Free | ||
 XCR3064XL-10CS48I Xilinx Inc. | 33 | - | Datasheet | 10 Weeks | Lead, Tin | Surface Mount | Surface Mount | 48-FBGA, CSPBGA | - | 48 | - | EEPROM | 40 | - | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | - | - | YES | - | BOTTOM | BALL | 240 | 3.3V | 0.8mm | - | - | 30 | XCR3064XL | 48 | - | - | 3.3V | - | - | - | In System Programmable (min 1K program/erase cycles) | 3.6V | 2.7V | - | - | - | - | 10 ns | 10 ns | - | 4 | - | 1500 | 95MHz | - | - | 10 | MACROCELL | 64 | YES | - | 2.7V~3.6V | 9.1ns | - | 1.8mm | 7mm | 7mm | No | Non-RoHS Compliant | Contains Lead | ||
 XC95108-10PC84C Xilinx Inc. | 210 | - | Datasheet | - | - | Surface Mount | Surface Mount | 84-LCC (J-Lead) | - | 84 | - | FLASH | 69 | - | 0°C~70°C TA | Tube | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 84 | EAR99 | - | - | - | YES | - | QUAD | J BEND | 225 | 5V | 1.27mm | - | - | 30 | XC95108 | 84 | - | - | 5V | - | - | - | In System Programmable (min 10K program/erase cycles) | - | - | - | - | - | - | 10 ns | - | - | 8 | - | 2400 | 66.7MHz | - | - | 10 | MACROCELL | 108 | YES | - | 4.75V~5.25V | - | 6 | - | - | - | No | Non-RoHS Compliant | Contains Lead | ||
 EPM1270GT144C5N Intel | 33 |
| Datasheet | 8 Weeks | - | - | Surface Mount | 144-LQFP | YES | - | - | - | 116 | - | 0°C~85°C TJ | Tray | - | MAX® II | e3 | - | Active | 3 (168 Hours) | 144 | 3A991 | Matte Tin (Sn) - annealed | - | - | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | - | - | 40 | EPM1270 | - | S-PQFP-G144 | Not Qualified | - | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | - | - | - | - | - | - | 10 ns | - | - | - | - | - | - | - | - | - | MACROCELL | 980 | YES | - | 1.71V~1.89V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | - | RoHS Compliant | - | ||
 EPM7032AETC44-4 Intel | 33 |
| Datasheet | 8 Weeks | - | - | Surface Mount | 44-TQFP | YES | - | - | - | 36 | - | 0°C~70°C TA | Tray | - | MAX® 7000A | e0 | - | Active | 3 (168 Hours) | 44 | - | Tin/Lead (Sn/Pb) | - | - | - | - | QUAD | GULL WING | 235 | 3.3V | 0.8mm | - | - | 30 | EPM7032 | - | S-PQFP-G44 | Not Qualified | - | 3.6V | - | 3V | In System Programmable | - | - | - | - | - | - | 4.5 ns | - | - | - | - | 600 | - | - | - | - | MACROCELL | 32 | YES | - | 3V~3.6V | 4.5ns | 2 | - | 10mm | 10mm | - | Non-RoHS Compliant | - | ||
 EPM7256AETC100-7 Intel | 2987 | - | Datasheet | 8 Weeks | - | - | Surface Mount | 100-TQFP | YES | - | - | - | 84 | - | 0°C~70°C TA | Tray | 1998 | MAX® 7000A | e0 | - | Active | 3 (168 Hours) | 100 | 3A991 | Tin/Lead (Sn85Pb15) | - | - | YES | 8542.39.00.01 | QUAD | GULL WING | 235 | 3.3V | 0.5mm | not_compliant | - | 30 | EPM7256 | - | S-PQFP-G100 | Not Qualified | - | 3.6V | 2.5/3.33.3V | 3V | In System Programmable | - | - | - | - | - | 126.6MHz | 7.5 ns | - | - | - | - | 5000 | - | - | - | - | MACROCELL | 256 | YES | - | 3V~3.6V | 7.5ns | 16 | 1.27mm | 14mm | 14mm | - | Non-RoHS Compliant | - | ||
 ATF1504ASV-15JU44 Microchip Technology | 2237 | - | Datasheet | 14 Weeks | Tin | Surface Mount | Surface Mount | 44-LCC (J-Lead) | - | 44 | - | EEPROM | 32 | - | -40°C~85°C TA | Tube | 1997 | ATF15xx | e3 | yes | Active | 3 (168 Hours) | 44 | - | - | - | - | YES | - | QUAD | J BEND | 245 | 3.3V | 1.27mm | - | 76.9MHz | 40 | ATF1504ASV | - | - | Not Qualified | 3.3V | - | - | - | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | - | - | - | - | 15 ns | 15 ns | - | - | - | 1500 | - | - | - | 15 | MACROCELL | 64 | YES | - | 3V~3.6V | - | - | 4.572mm | 16.586mm | 16.586mm | - | ROHS3 Compliant | Lead Free | ||
EPM1270T144C3 Intel | 158 | - | Datasheet | 8 Weeks | - | - | Surface Mount | 144-LQFP | YES | - | - | - | 116 | - | 0°C~85°C TJ | Tray | 2003 | MAX® II | e0 | - | Active | 3 (168 Hours) | 144 | 3A991 | TIN LEAD | - | - | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | GULL WING | 220 | 2.5V | 0.5mm | - | - | 30 | EPM1270 | - | S-PQFP-G144 | Not Qualified | - | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | - | - | - | - | - | - | 6.2 ns | - | - | - | - | - | - | - | - | - | MACROCELL | 980 | YES | - | 2.5V 3.3V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | - | Non-RoHS Compliant | - | ||
XC2C384-10FTG256I Xilinx Inc. | 278 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 256-LBGA | - | 256 | - | ROMless | 212 | - | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e1 | yes | Active | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | - | - | 30 | XC2C384 | 256 | - | - | 1.8V | - | - | - | In System Programmable | 1.9V | 1.7V | - | - | - | - | 10 ns | 10 ns | - | 24 | - | 9000 | 125MHz | - | - | 10 | MACROCELL | 384 | YES | - | 1.7V~1.9V | 9.2ns | - | 1.55mm | 17mm | 17mm | No | ROHS3 Compliant | - | ||
 EPM7064SLC84-10 Intel | In Stock | - | Datasheet | - | - | - | Surface Mount | 84-LCC (J-Lead) | YES | - | - | - | 68 | - | 0°C~70°C TA | Tray | - | MAX® 7000S | e0 | - | Obsolete | 2 (1 Year) | 84 | - | Tin/Lead (Sn/Pb) | - | - | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | - | QUAD | J BEND | 220 | 5V | 1.27mm | - | - | 30 | EPM7064 | - | - | Not Qualified | - | 5.25V | 3.3/55V | - | In System Programmable | - | - | - | - | - | 125MHz | 10 ns | - | - | - | - | 1250 | - | - | - | - | MACROCELL | 64 | YES | - | 4.75V~5.25V | 10ns | 4 | 5.08mm | 29.3116mm | 29.3116mm | - | Non-RoHS Compliant | - | ||
 EPM7064QC100-12 Intel | In Stock | - | Datasheet | - | - | - | Surface Mount | 100-BQFP | YES | - | - | - | 68 | - | 0°C~70°C TA | Tray | - | MAX® 7000 | e0 | - | Obsolete | 3 (168 Hours) | 100 | - | TIN LEAD | - | - | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | - | QUAD | GULL WING | 220 | 5V | 0.65mm | compliant | - | 30 | EPM7064 | - | R-PQFP-G100 | Not Qualified | - | 5.25V | 3.3/55V | - | EE PLD | - | - | - | - | - | 125MHz | 12 ns | - | - | - | - | 1250 | - | - | - | - | MACROCELL | 64 | NO | - | 4.75V~5.25V | 12ns | 4 | 3.65mm | 20mm | - | - | Non-RoHS Compliant | - | ||
 XA2C256-8VQG100Q Xilinx Inc. | 861 | - | Datasheet | 10 Weeks | Tin | Surface Mount | Surface Mount | 100-TQFP | - | 100 | - | - | 80 | Automotive grade | -40°C~105°C TA | Tray | 2001 | CoolRunner II | e3 | yes | Active | 3 (168 Hours) | 100 | EAR99 | - | - | - | REAL DIGITAL DESIGN TECHNOLOGY | - | QUAD | GULL WING | 260 | 1.8V | 0.5mm | - | - | 30 | XA2C256 | 100 | - | Not Qualified | 1.8V | - | - | - | In System Programmable | 1.9V | 1.7V | - | 1 | - | - | 7.5 ns | 7.5 ns | 17b | 16 | 1 Mb | 6000 | 139MHz | - | - | 8 | MACROCELL | 256 | YES | - | 1.7V~1.9V | 7ns | - | - | - | - | - | ROHS3 Compliant | - | ||
XCR3256XL-12PQ208C Xilinx Inc. | 446 | - | Datasheet | 10 Weeks | - | - | Surface Mount | 208-BFQFP | YES | 208 | - | EEPROM | 164 | - | 0°C~70°C TA | Bulk | 2003 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | YES | 8542.39.00.01 | QUAD | GULL WING | 225 | 3.3V | 0.5mm | - | - | 30 | - | 208 | - | Not Qualified | 3.3V | 3.6V | - | - | In System Programmable (min 1K program/erase cycles) | - | - | - | - | - | - | 12 ns | - | - | - | - | 6000 | 88MHz | - | - | 12 | MACROCELL | 256 | YES | - | 3V~3.6V | 10.8ns | 16 | 4.1mm | 28mm | 28mm | - | Non-RoHS Compliant | - | ||
 EPM240F100C4N Intel | 33 |
| Datasheet | 8 Weeks | - | - | Surface Mount | 100-LBGA | YES | - | - | - | 80 | - | 0°C~85°C TJ | Tray | - | MAX® II | e1 | - | Active | 3 (168 Hours) | 100 | EAR99 | TIN SILVER COPPER | - | - | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | - | - | 40 | EPM240 | - | S-PBGA-B100 | Not Qualified | - | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | - | - | - | - | - | - | 6.1 ns | - | - | - | - | - | - | - | - | - | MACROCELL | 192 | YES | - | 2.5V 3.3V | 4.7ns | 240 | 1.7mm | 11mm | 11mm | - | RoHS Compliant | - | ||
EPM570GF256C3N Intel | 33 |
| Datasheet | 8 Weeks | - | - | Surface Mount | 256-BGA | YES | - | - | - | 160 | - | 0°C~85°C TJ | Tray | - | MAX® II | e1 | - | Active | 3 (168 Hours) | 256 | EAR99 | TIN SILVER COPPER | - | - | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | - | - | 40 | EPM570 | - | S-PBGA-B256 | Not Qualified | - | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | - | - | - | - | - | - | 5.4 ns | - | - | - | - | - | - | - | - | - | MACROCELL | 440 | YES | - | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | - | RoHS Compliant | - |