- Manufacturer
- Number of I/Os
- Package / Case
- Packaging
- Series
- Mounting Type
- Operating Temperature
- Voltage - Supply
- JESD-609 Code
- Terminal Form
- Terminal Position
- Moisture Sensitivity Level (MSL)
- Part Status
Attribute column
Categories
Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Voltage | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Density | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A3P250-FGG144I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | FBGA-144 | - | - | - | - | - | - | - | - | - | 160 | - | - | - | - | 350 MHz | + 100 C | - | - | - 40 C | Yes | - | - | SMD/SMT | 97 I/O | - | 3000 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | 1.575 V | 1.425 V | - | 36864 bit | ProASIC3 | 0.108878 oz | - | Tray | - | A3P250 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | 30 mA | - | - | - | - | - | - | - | - | - | - | - | 250000 | - | - | - | - | - | - | - | - | 1.05 mm | - | 13 mm | 13 mm | - | - | - | - | ||
 XC6SLX16-3CSG324C Xilinx Inc. | 3000 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 324-LFBGA, CSPBGA | - | 324 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 232 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 324 | - | - | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | XC6SLX16 | 324 | - | 232 | Not Qualified | 1.2V | - | - | - | - | - | 72kB | 862MHz | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 14579 | - | 589824 | - | 1139 | 3 | - | - | 18224 | 0.21 ns | - | - | - | 1.5mm | 15mm | 15mm | - | - | ROHS3 Compliant | - | ||
 5CEFA7F23I7N Intel | 837 | - | Datasheet | 8 Weeks | - | - | Surface Mount | 484-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 240 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V E | - | - | Active | 3 (168 Hours) | 484 | - | - | - | - | 8542.39.00.01 | - | 1.07V~1.13V | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | - | NOT SPECIFIED | 5CEFA7 | - | S-PBGA-B484 | 240 | Not Qualified | - | 1.11.2/3.32.5V | - | - | - | - | - | - | - | - | 240 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 149500 | - | 7880704 | - | 56480 | - | - | - | - | - | - | - | - | 2mm | 23mm | 23mm | - | - | RoHS Compliant | - | ||
 XC6SLX4-2CPG196I Xilinx Inc. | 2700 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 196-TFBGA, CSBGA | - | 196 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 106 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e8 | yes | Active | 3 (168 Hours) | 196 | - | EAR99 | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.5mm | - | - | 30 | XC6SLX4 | 196 | - | 100 | Not Qualified | 1.2V | - | - | - | - | - | 27kB | 667MHz | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 3840 | - | 221184 | - | 300 | 2 | - | - | 4800 | - | 300 | - | - | 1.1mm | 8mm | 8mm | - | - | ROHS3 Compliant | - | ||
 EP4CGX50CF23I7N Intel | 1265 | - | Datasheet | 8 Weeks | - | - | Surface Mount | 484-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 290 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2014 | Cyclone® IV GX | e1 | - | Active | 3 (168 Hours) | 484 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | 1.16V~1.24V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | EP4CGX50 | - | S-PBGA-B484 | 290 | Not Qualified | - | 1.21.2/3.32.5V | - | - | - | - | - | 472.5MHz | - | - | 290 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 49888 | - | 2562048 | - | 3118 | - | - | - | - | - | - | - | - | 2.4mm | 23mm | 23mm | - | - | RoHS Compliant | - | ||
A3P1000-FGG144I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | FBGA-144 | - | - | - | - | - | - | - | - | - | 160 | - | - | - | - | 350 MHz | + 100 C | - | - | - 40 C | Yes | - | - | SMD/SMT | 97 I/O | - | 11000 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | 1.575 V | 1.425 V | - | - | ProASIC3 | 0.014110 oz | - | Tray | - | A3P1000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1000000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A42MX16-PLG84 Microchip Technology | 12 | - | - | - | - | - | Surface Mount | PLCC-84 | YES | - | 84-PLCC (29.31x29.31) | 84 | 72 | 928 | A42MX16 | 94 MHz | 24000 | 16 | 42MX | MICROSEMI CORP | 608 | A42MX16-PLG84 | - | + 70 C | - | Microchip Technology | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 72 I/O | 608 | 608 LE | 24000 | 5.25(V) | 3(V) | 3.3/5(V) | 0C to 70C | 70C | 0C | COMMERCIALC | 70 °C | Tube | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | PLCC | Active | 0.45UM | Active | Yes | No | 40 | 1.52 | Details | Yes | 5.25 V | 3 V | 3.3 V | - | Actel | 0.239083 oz | 0°C ~ 70°C (TA) | Tube | - | A42MX16 | e3 | - | - | - | - | - | - | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | - | 1.27 mm | compliant | 103/172(MHz) | - | - | 84 | S-PQCC-J84 | - | Not Qualified | 3.3 V, 5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 24000 | - | STD | - | - | - | 2.8 ns | 1232 | 24000 | 3.68 mm | - | 29.31 mm | 29.31 mm | - | - | - | - | ||
 XC6SLX45-3CSG484C Xilinx Inc. | 1688 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 484-FBGA, CSPBGA | - | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 320 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 484 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | XC6SLX45 | 484 | - | 310 | Not Qualified | 1.2V | - | - | - | - | - | 261kB | 862MHz | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 43661 | - | 2138112 | - | 3411 | 3 | - | - | 54576 | 0.21 ns | - | - | - | 1.8mm | 19mm | 19mm | - | - | ROHS3 Compliant | - | ||
 XC7K160T-1FBG484C Xilinx Inc. | 990 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | Surface Mount | 484-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 285 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 484 | - | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | 0.97V~1.03V | BOTTOM | BALL | - | 1V | 1mm | - | - | - | XC7K160 | 484 | S-PBGA-B484 | 285 | - | - | 11.83.3V | - | - | - | - | 1.4MB | 1098MHz | 120 ps | - | 285 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 162240 | - | 11980800 | - | 12675 | -1 | - | - | 202800 | 0.74 ns | - | - | - | 2.54mm | 23mm | 23mm | No | - | ROHS3 Compliant | - | ||
 EP3C5F256I7N Intel | 92 | - | Datasheet | 8 Weeks | - | - | Surface Mount | 256-LBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 182 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Cyclone® III | e1 | - | Active | 3 (168 Hours) | 256 | - | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | EP3C5 | - | R-PBGA-B256 | 182 | Not Qualified | - | - | - | - | - | - | - | 472.5MHz | - | - | 182 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 5136 | - | 423936 | - | 321 | - | - | - | - | - | - | - | - | 1.55mm | 17mm | 17mm | - | - | RoHS Compliant | - | ||
 XC3SD1800A-4FGG676I Xilinx Inc. | 9 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 676-BGA | - | 676 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 519 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2008 | Spartan®-3A DSP | e1 | yes | Active | 3 (168 Hours) | 676 | SMD/SMT | 3A991.D | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | - | 667MHz | 30 | XC3SD1800A | 676 | - | 409 | Not Qualified | 1.2V | 1.22.5/3.3V | - | - | - | - | 189kB | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 37440 | - | 1548288 | 1800000 | 4160 | 4 | - | - | - | - | - | - | - | 2.6mm | 27mm | 27mm | - | Unknown | ROHS3 Compliant | - | ||
XC3SD1800A-4CSG484I Xilinx Inc. | 15 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 484-FBGA, CSPBGA | - | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 309 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2008 | Spartan®-3A DSP | e1 | yes | Active | 3 (168 Hours) | 484 | - | 3A991.D | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | XC3SD1800A | 484 | - | 249 | Not Qualified | - | 1.22.5/3.3V | - | - | - | - | 189kB | 250MHz | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 37440 | - | 1548288 | 1800000 | 4160 | 4 | - | - | - | - | - | - | - | - | - | - | - | Unknown | ROHS3 Compliant | - | ||
 XC6SLX25-2FGG484C Xilinx Inc. | 2839 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 484-BBGA | - | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 266 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2007 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 484 | - | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | - | - | 30 | XC6SLX25 | 484 | - | 266 | Not Qualified | 1.2V | - | - | - | - | - | 117kB | 667MHz | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 24051 | - | 958464 | - | 1879 | 2 | - | - | 30064 | - | - | - | 2mm | - | 23mm | 23mm | - | Unknown | ROHS3 Compliant | - | ||
 XC5VLX85T-1FFG1136C Xilinx Inc. | 1200 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 1136-BBGA, FCBGA | - | 1136 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 480 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 1999 | Virtex®-5 LXT | e1 | yes | Active | 4 (72 Hours) | - | - | - | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - | - | 0.95V~1.05V | BOTTOM | BALL | 245 | 1V | - | not_compliant | 550MHz | 30 | XC5VLX85 | - | - | 480 | Not Qualified | 1V | - | - | 3V | - | - | 486kB | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 82944 | - | 3981312 | 85000 | 6480 | 1 | - | - | - | - | - | - | - | 3.4mm | 35mm | 35mm | - | - | ROHS3 Compliant | - | ||
EP3C5F256C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | Surface Mount | 256-LBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 182 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Cyclone® III | e1 | - | Active | 3 (168 Hours) | 256 | - | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | EP3C5 | - | R-PBGA-B256 | 182 | Not Qualified | - | - | - | - | - | - | - | 472.5MHz | - | - | 182 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 5136 | - | 423936 | - | 321 | - | - | - | - | - | - | - | - | 1.55mm | 17mm | 17mm | - | - | RoHS Compliant | - | ||
 XC3S400A-4FTG256I Xilinx Inc. | 7020 |
| Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 256-LBGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 195 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2007 | Spartan®-3A | e1 | yes | Active | 3 (168 Hours) | 256 | - | EAR99 | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | XC3S400A | 256 | - | 160 | Not Qualified | 1.2V | 1.22.5/3.3V | - | - | - | - | 45kB | 667MHz | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 8064 | - | 368640 | 400000 | 896 | 4 | - | - | - | 0.71 ns | 896 | - | - | 1.55mm | 17mm | 17mm | - | No SVHC | ROHS3 Compliant | - | ||
 LCMXO2-7000HC-4FG484C Lattice Semiconductor Corporation | 10445 | - | Datasheet | 8 Weeks | - | Surface Mount | Surface Mount | 484-BBGA | - | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FLASH | - | - | - | - | - | - | 334 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 484 | - | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 1mm | - | 269MHz | 30 | LCMXO2-7000 | - | - | 335 | - | 2.5V | 2.5/3.3V | - | - | 68.8kB | 189μA | 30kB | - | 7.24 ns | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 6864 | 240 kb | 245760 | - | 858 | - | - | 3432 | - | - | - | - | - | 2.6mm | 23mm | 23mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
EP3C25F256C7N Intel | 713 | - | Datasheet | 8 Weeks | - | - | Surface Mount | 256-LBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 156 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Cyclone® III | e1 | - | Active | 3 (168 Hours) | 256 | - | 3A991 | TIN SILVER COPPER | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 40 | EP3C25 | - | R-PBGA-B256 | 156 | Not Qualified | - | - | - | - | - | - | - | 472.5MHz | - | - | 156 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 24624 | - | 608256 | - | 1539 | - | - | - | - | - | - | - | - | 1.55mm | 17mm | 17mm | - | - | RoHS Compliant | - | ||
 XC7K325T-1FBG676I Xilinx Inc. | 990 | - | Datasheet | 11 Weeks | Copper, Silver, Tin | - | Surface Mount | 676-BBGA, FCBGA | YES | 676 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DDR3 | - | - | - | - | - | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 676 | - | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | XC7K325T | 676 | - | 400 | Not Qualified | - | 11.83.3V | - | - | 1GB | - | 2MB | 1098MHz | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 326080 | - | 16404480 | - | 25475 | -1 | - | - | 407600 | 0.74 ns | - | - | - | 2.54mm | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
 EP4CE22E22C8N Intel | 720 | - | Datasheet | 11 Weeks | - | - | Surface Mount | 144-LQFP Exposed Pad | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 79 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | - | Cyclone® IV E | e3 | - | Active | 3 (168 Hours) | 144 | - | - | MATTE TIN (472) OVER COPPER | - | 8542.39.00.01 | - | 1.15V~1.25V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | - | - | 40 | EP4CE22 | - | S-PQFP-G144 | 79 | Not Qualified | - | 1.21.2/3.32.5V | - | - | - | - | - | 472.5MHz | - | - | 79 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 22320 | - | 608256 | - | 1395 | - | - | - | - | - | - | - | - | 1.65mm | 20mm | 20mm | - | - | RoHS Compliant | - |