- Manufacturer
- Number of I/Os
- Package / Case
- Packaging
- Series
- Mounting Type
- Operating Temperature
- Voltage - Supply
- JESD-609 Code
- Terminal Form
- Terminal Position
- Moisture Sensitivity Level (MSL)
- Part Status
Attribute column
Categories
Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Density | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() APA300-PQG208 Microchip Technology | 2112 | - | - | - | - | - | - | Surface Mount | PQFP-208 | - | - | 208-PQFP (28x28) | - | - | 158 | 8192 | APA300 | - | 300000 | 24 | PROASICPLUS | - | - | 180 MHz | 2.7 V | + 70 C | - | Microchip Technology | 2.3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 158 I/O | - | - | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | 0C to 70C | 70C | 0C | Commercial | - | - | Tray | - | - | - | - | - | PQFP | - | 0.22UM | Active | Yes | No | - | - | Details | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | - | 73728 bit | ProASICPLUS | 2.5000 V | - | 0 to 70 °C | Tray | - | APA300 | - | - | - | - | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | 180(MHz) | - | - | 208 | - | - | - | 2.5 V | - | - | - | - | - | 5 mA | - | - | - | - | - | - | - | - | - | 73728 | 300000 | - | - | - | STD | - | - | - | - | - | 3.4 mm | - | 28 mm | 28 mm | - | - | - | - | ||
![]() XC3S500E-4FTG256I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 256-LBGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 190 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2001 | Spartan®-3E | e1 | yes | Active | 3 (168 Hours) | 256 | - | EAR99 | - | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | - | - | - | 30 | XC3S500E | 256 | - | 149 | Not Qualified | 1.2V | 1.21.2/3.32.5V | - | - | - | - | - | 45kB | 572MHz | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 10476 | - | 368640 | 500000 | - | 1164 | - | 4 | - | 9312 | 0.76 ns | - | - | 1mm | - | 17mm | 17mm | - | - | ROHS3 Compliant | - | ||
![]() XC6SLX75-3FGG676C Xilinx Inc. | 862 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 676-BGA | - | 676 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 408 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 676 | - | - | - | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | - | - | 30 | XC6SLX75 | 676 | - | 400 | Not Qualified | 1.2V | - | - | - | - | - | - | 387kB | 862MHz | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 74637 | - | 3170304 | - | - | 5831 | - | 3 | - | 93296 | 0.21 ns | - | - | - | 2.44mm | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
![]() EP3C5F256C7N Intel | 10000 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 256-LBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 182 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | - | Cyclone® III | e1 | - | Active | 3 (168 Hours) | 256 | - | EAR99 | TIN SILVER COPPER | - | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 40 | EP3C5 | - | R-PBGA-B256 | 182 | Not Qualified | - | - | - | - | - | - | - | - | 472.5MHz | - | 182 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 5136 | - | 423936 | - | - | 321 | - | - | - | - | - | - | - | - | 1.55mm | 17mm | 17mm | - | - | RoHS Compliant | - | ||
![]() LCMXO2-1200ZE-1TG100C Lattice Semiconductor Corporation | 16 | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | 100-LQFP | - | 100 | - | 657.000198mg | - | - | - | - | - | - | - | - | - | - | - | - | - | FLASH | - | - | - | - | - | - | - | 79 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2000 | MachXO2 | - | yes | Active | 3 (168 Hours) | 100 | - | EAR99 | Matte Tin (Sn) | - | - | 8542.39.00.01 | - | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | - | 104MHz | 30 | LCMXO2-1200 | 100 | - | 80 | Not Qualified | 1.2V | - | - | - | - | 17.3kB | 58μA | 8kB | - | 10.21 ns | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 1280 | 64 kb | 65536 | - | - | 160 | - | - | 640 | - | - | - | - | 1.4mm | - | 14mm | 14mm | - | No SVHC | ROHS3 Compliant | Lead Free | ||
![]() LCMXO2-1200HC-6MG132I Lattice Semiconductor Corporation | 16 | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | 132-LFBGA, CSPBGA | - | 132 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FLASH | - | - | - | - | - | - | - | 104 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 132 | - | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | - | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 0.5mm | - | - | 30 | LCMXO2-1200 | 132 | - | 105 | - | 2.5V | 2.5/3.3V | - | - | - | 17.3kB | 3.49mA | 8kB | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 1280 | - | 65536 | - | 388MHz | 160 | - | - | 640 | - | - | - | - | - | - | - | - | No | - | ROHS3 Compliant | Lead Free | ||
![]() EP4CE40U19I7N Intel | 10000 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Cyclone® IV E | e1 | - | Active | 3 (168 Hours) | 484 | - | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | EP4CE40 | - | S-PBGA-B484 | 328 | Not Qualified | - | 1.21.2/3.32.5V | - | - | - | - | - | - | - | - | 328 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 39600 | - | 1161216 | - | - | 2475 | - | - | - | - | - | - | - | - | 2.05mm | 19mm | 19mm | - | - | RoHS Compliant | - | ||
![]() LFE2-12E-7FN256C Lattice Semiconductor Corporation | 4 | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | 256-BGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 193 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | ECP2 | e1 | yes | Active | 3 (168 Hours) | 256 | - | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | - | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | not_compliant | - | 30 | LFE2-12 | 256 | - | 193 | Not Qualified | 1.2V | - | - | - | - | 30.6kB | - | 27.6kB | 420MHz | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 12000 | - | 226304 | - | - | 1500 | - | - | - | - | 0.304 ns | - | - | - | 2.1mm | 17mm | 17mm | - | - | ROHS3 Compliant | Lead Free | ||
![]() LFE3-17EA-6FTN256I Lattice Semiconductor Corporation | 18 | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | 256-BGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 133 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2012 | ECP3 | e1 | yes | Active | 3 (168 Hours) | 256 | - | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | 8542.39.00.01 | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | LFE3-17 | 256 | - | 133 | - | 1.2V | - | - | - | - | 92kB | 18mA | 87.5kB | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 17000 | - | 716800 | - | 3.1MHz | 2125 | - | - | - | - | 0.379 ns | - | - | - | 1.55mm | 17mm | 17mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
![]() XC6SLX45-3CSG484I Xilinx Inc. | 1500 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 484-FBGA, CSPBGA | - | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 320 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 484 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | XC6SLX45 | 484 | - | 320 | Not Qualified | 1.2V | - | - | - | - | - | - | 261kB | 862MHz | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 43661 | - | 2138112 | - | - | 3411 | - | 3 | - | 54576 | 0.21 ns | - | - | - | 1.8mm | 19mm | 19mm | - | - | ROHS3 Compliant | - | ||
![]() APA300-FG144M Microchip Technology | 807 |
| - | - | - | - | - | Surface Mount | FBGA | - | - | 144-FPBGA (13x13) | - | - | - | - | APA300 | - | - | 160 | - | - | - | 180 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | - | - | SMD/SMT | 100 I/O | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | - | - | Actel | - | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | - | APA300 | - | - | - | - | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 300000 | - | - | - | - | - | - | - | - | - | 1.05 mm | - | 13 mm | 13 mm | - | - | - | - | ||
![]() XC3S200-4PQG208C Xilinx Inc. | 149 | - | Datasheet | 10 Weeks | - | Tin | Surface Mount | Surface Mount | 208-BFQFP | - | 208 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 141 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2006 | Spartan®-3 | e3 | yes | Active | 3 (168 Hours) | 208 | SMD/SMT | EAR99 | - | - | - | - | - | 1.14V~1.26V | QUAD | GULL WING | 245 | 1.2V | 0.5mm | - | 630MHz | 30 | XC3S200 | 208 | - | 141 | Not Qualified | 1.2V | 1.21.2/3.32.5V | - | - | - | - | - | 27kB | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 4320 | - | 221184 | 200000 | - | 480 | - | 4 | - | - | 0.61 ns | 480 | - | 3.4mm | - | 28mm | 28mm | - | Unknown | ROHS3 Compliant | Lead Free | ||
![]() XC7K325T-1FBG900C Xilinx Inc. | 168 | - | Datasheet | 11 Weeks | - | Copper, Silver, Tin | - | Surface Mount | 900-BBGA, FCBGA | - | 900 | 900-FCBGA (31x31) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DDR3 | - | - | - | - | - | - | - | 500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Kintex®-7 | - | - | Active | 4 (72 Hours) | - | - | - | - | 85°C | 0°C | - | - | 0.97V~1.03V | - | - | - | - | - | - | - | - | XC7K325T | - | - | - | - | - | - | - | 1.03V | 970mV | 1GB | - | 2MB | - | - | - | - | - | - | 326080 | - | 16404480 | - | - | 25475 | 25475 | -1 | - | 407600 | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() XC7K325T-3FFG676E Xilinx Inc. | 990 | - | Datasheet | 11 Weeks | - | - | - | Surface Mount | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DDR3 | - | - | - | - | - | - | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 676 | - | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | 8542.39.00.01 | - | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | not_compliant | - | NOT SPECIFIED | XC7K325T | 676 | S-PBGA-B676 | 400 | Not Qualified | - | 11.83.3V | - | - | - | 1GB | - | 2MB | 1412MHz | - | 400 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 326080 | - | 16404480 | - | - | 25475 | - | -3 | - | 407600 | 0.58 ns | - | - | - | 3.37mm | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
![]() XC3S1200E-4FG320I Xilinx Inc. | 2259 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 320-BGA | - | 320 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 250 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2012 | Spartan®-3E | e0 | no | Active | 3 (168 Hours) | 320 | - | 3A991.D | Tin/Lead (Sn/Pb) | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | - | - | 30 | XC3S1200E | 320 | - | 194 | Not Qualified | 1.2V | 1.21.2/3.32.5V | - | - | - | - | - | 63kB | 572MHz | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 19512 | - | 516096 | 1200000 | - | 2168 | - | 4 | - | 17344 | 0.76 ns | - | - | - | 2mm | 19mm | 19mm | - | - | Non-RoHS Compliant | - | ||
![]() XC5VFX30T-2FFG665I Xilinx Inc. | 777 | - | Datasheet | 16 Weeks | - | Copper, Silver, Tin | Surface Mount | Surface Mount | 665-BBGA, FCBGA | - | 665 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 360 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 1999 | Virtex®-5 FXT | e1 | - | Active | 4 (72 Hours) | 665 | - | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - | - | - | 0.95V~1.05V | BOTTOM | BALL | 250 | 1V | 1mm | not_compliant | - | 30 | XC5VFX30T | 665 | - | 360 | Not Qualified | - | - | - | - | - | - | - | 306kB | - | - | - | 3040 CLBS | - | FIELD PROGRAMMABLE GATE ARRAY | 32768 | - | 2506752 | - | - | 2560 | - | 2 | - | - | - | 3040 | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() XC3S100E-4VQG100C Xilinx Inc. | 990 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 100-TQFP | - | 100 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Spartan®-3E | e3 | yes | Active | 3 (168 Hours) | 100 | - | EAR99 | Matte Tin (Sn) | - | - | - | - | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | - | - | 30 | XC3S100E | 100 | - | 59 | - | 1.2V | 1.21.2/3.32.5V | - | - | - | - | - | 9kB | 572MHz | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 2160 | - | 73728 | 100000 | - | 240 | - | 4 | - | 1920 | 0.76 ns | 240 | - | 1mm | - | 14mm | 14mm | No | - | ROHS3 Compliant | Lead Free | ||
![]() A3P600-FGG256I Microchip Technology | 20 | - | - | - | Production (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | FBGA-256 | YES | 256 | 256-FPBGA (17x17) | - | 256 | - | - | A3P600 | 350 MHz | - | 90 | - | MICROSEMI CORP | A3P600-FGG256I | 231 MHz | - | + 85 C | - | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 177 I/O | - | 6500 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 1.31 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 110592 bit | ProASIC3 | 1.5000 V | - | -40 to 85 °C | Tray | - | A3P600 | e1 | - | - | - | - | - | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | - | 1 mm | compliant | 231 MHz | - | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 45 mA | 13.5 kB | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | - | 110592 | 600000 | 231 MHz | - | - | STD | - | 13824 | - | 13824 | 600000 | 1.2 mm | - | 17 mm | 17 mm | No | - | - | Lead Free | ||
![]() XC2S200-5FG256C Xilinx Inc. | 509 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 256-BGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 176 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 1999 | Spartan®-II | e0 | no | Active | 3 (168 Hours) | 256 | - | EAR99 | Tin/Lead (Sn63Pb37) | - | - | - | - | 2.375V~2.625V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | - | 30 | XC2S200 | 256 | - | 176 | Not Qualified | 2.5V | - | - | - | - | - | - | 7kB | 263MHz | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 5292 | - | 57344 | 200000 | - | 1176 | - | 5 | - | - | 0.7 ns | - | - | - | 2mm | 17mm | 17mm | - | - | Non-RoHS Compliant | Contains Lead | ||
![]() EP4CE55F23C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 484-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 324 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | - | Cyclone® IV E | e1 | - | Active | 3 (168 Hours) | 484 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 40 | EP4CE55 | - | S-PBGA-B484 | 327 | Not Qualified | - | 1.21.2/3.32.5V | - | - | - | - | - | - | 472.5MHz | - | 327 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 55856 | - | 2396160 | - | - | 3491 | - | - | - | - | - | - | - | - | 2.4mm | 23mm | 23mm | - | - | RoHS Compliant | - |