- Manufacturer
- Number of I/Os
- Package / Case
- Packaging
- Series
- Mounting Type
- Operating Temperature
- Voltage - Supply
- JESD-609 Code
- Terminal Form
- Terminal Position
- Moisture Sensitivity Level (MSL)
- Part Status
Attribute column
Categories
Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Max Junction Temperature (Tj) | Number of Logic Cells | Ambient Temperature Range High | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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![]() XC6SLX16-2CSG225I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 225-LFBGA, CSPBGA | - | 225 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 160 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | XC6SLX16 | 225 | - | 160 | Not Qualified | 1.2V | - | - | - | - | - | - | 72kB | 667MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 14579 | 589824 | - | - | 1139 | 2 | - | 18224 | - | - | - | - | - | - | - | 1.4mm | 13mm | 13mm | - | ROHS3 Compliant | - | ||
![]() A3P125-TQG144I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | - | TQFP-144 | - | - | - | - | - | - | 60 | - | - | 350 MHz | - | + 100 C | - | - | - | - 40 C | Yes | - | SMD/SMT | 100 I/O | - | 1500 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 1.575 V | 1.425 V | - | 36864 bit | ProASIC3 | - | 0.046530 oz | - | Tray | - | A3P125 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | 15 mA | - | - | - | - | - | - | - | - | - | - | - | 125000 | - | - | - | - | - | - | - | - | - | - | - | 1.4 mm | - | 20 mm | 20 mm | - | - | - | ||
![]() XC4VFX100-11FF1152C Xilinx Inc. | 106 | - | Datasheet | 10 Weeks | - | - | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 576 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 1999 | Virtex®-4 FX | e0 | no | Active | 4 (72 Hours) | - | 3A991.D | Tin/Lead (Sn63Pb37) | - | - | - | 8542.39.00.01 | - | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | - | 30 | - | - | - | 576 | Not Qualified | 1.2V | - | - | - | - | - | - | 846kB | - | - | - | - | 576 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 94896 | 6930432 | - | - | 10544 | 11 | - | - | - | - | - | - | - | - | - | 3.4mm | 35mm | 35mm | - | Non-RoHS Compliant | - | ||
![]() XC6VLX195T-2FFG1156C Xilinx Inc. | 4 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | Surface Mount | 1156-BBGA, FCBGA | - | 1156 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 600 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Virtex®-6 LXT | e1 | yes | Active | 4 (72 Hours) | - | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | - | - | 0.95V~1.05V | BOTTOM | BALL | 245 | 1V | 1mm | not_compliant | - | 30 | XC6VLX195T | - | - | 600 | Not Qualified | - | - | - | - | - | - | - | 1.5MB | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 199680 | 12681216 | - | - | 15600 | 2 | - | - | - | - | - | - | - | - | - | 3.5mm | 35mm | 35mm | - | ROHS3 Compliant | - | ||
![]() XC7A75T-2FGG484C Xilinx Inc. | 400 | - | Datasheet | 12 Weeks | - | - | Surface Mount | Surface Mount | 484-BBGA | - | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 285 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2010 | Artix-7 | e1 | yes | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | - | - | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | - | 484 | - | 285 | Not Qualified | 1V | 1V | - | - | - | - | - | 472.5kB | - | 850 ps | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 75520 | 3870720 | - | - | 5900 | 2 | - | 94400 | 1.05 ns | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() EP2C20F484C8N Intel | 17 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 484-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 315 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | - | Cyclone® II | e1 | - | Active | 3 (168 Hours) | 484 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | EP2C20 | - | S-PBGA-B484 | 299 | Not Qualified | - | 1.21.5/3.33.3V | - | - | - | - | - | - | 402.5MHz | - | - | - | 315 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 18752 | 239616 | - | - | 1172 | - | - | - | - | - | - | - | - | - | - | 2.6mm | 23mm | 23mm | - | RoHS Compliant | - | ||
![]() EP2S90F1020C5N Intel | 1300 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 1020-BBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 758 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | - | Stratix® II | e1 | - | Active | 3 (168 Hours) | - | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 245 | 1.2V | 1mm | not_compliant | - | 40 | EP2S90 | - | S-PBGA-B1020 | 750 | Not Qualified | - | 1.21.5/3.33.3V | - | - | - | - | - | - | 640MHz | - | - | - | 758 | 36384 CLBS | - | FIELD PROGRAMMABLE GATE ARRAY | 90960 | 4520488 | - | - | 4548 | - | - | - | 5.962 ns | 36384 | - | - | - | - | - | 3.5mm | 33mm | 33mm | - | RoHS Compliant | - | ||
![]() AGL600V2-FGG256 Microchip Technology | 2147 |
| - | - | - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FGG256 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | - | 6500 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 1.46 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | 110592 bit | IGLOOe | 1.2, 1.5 V | - | 0 to 70 °C | Tray | - | AGL600V2 | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | - | 1 mm | compliant | - | - | - | - | S-PBGA-B256 | - | Not Qualified | 1.2 V to 1.5 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | STD | - | - | - | 13824 | - | - | - | 600000 | 1.2 mm | - | 17 mm | 17 mm | - | - | - | ||
![]() XC3S1200E-5FTG256C Xilinx Inc. | 23 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 256-LBGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 190 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Spartan®-3E | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | TIN SILVER COPPER | - | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | XC3S1200E | 256 | - | 150 | Not Qualified | 1.2V | - | - | - | - | - | - | 63kB | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 19512 | 516096 | 1200000 | - | 2168 | 5 | - | 17344 | 0.66 ns | - | - | - | - | - | - | - | 17mm | 17mm | - | ROHS3 Compliant | - | ||
![]() A3P125-FG144 Microchip Technology | 40 |
| - | - | - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | 144 | A3P125 | 350 MHz | 160 | MICROSEMI CORP | A3P125-FG144 | 231 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.22 | N | No | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | - | A3P125 | e0 | - | - | - | - | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | - | 1 mm | compliant | - | - | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 125000 | - | - | STD | - | - | - | 3072 | - | - | - | 125000 | 1.05 mm | - | 13 mm | 13 mm | - | - | - | ||
![]() XC7A75T-1FGG484C Xilinx Inc. | 495 | - | Datasheet | 12 Weeks | - | Copper, Silver, Tin | Surface Mount | Surface Mount | 484-BBGA | - | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 285 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Artix-7 | e1 | yes | Active | 3 (168 Hours) | 484 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | - | - | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | - | - | - | NOT SPECIFIED | - | 484 | - | 285 | Not Qualified | - | 1V | - | - | - | - | - | 472.5kB | - | 1.09 ns | 1.09 ns | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 75520 | 3870720 | - | - | 5900 | 1 | - | 94400 | - | - | - | - | - | - | - | 2.6mm | 23mm | 23mm | - | ROHS3 Compliant | - | ||
![]() XC5VLX155T-1FFG1738I Xilinx Inc. | 135 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 1738-BBGA, FCBGA | - | 1738 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 680 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 1999 | Virtex®-5 LXT | e1 | - | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - | - | - | - | 0.95V~1.05V | BOTTOM | BALL | 245 | 1V | - | not_compliant | - | 30 | XC5VLX155T | - | - | 680 | Not Qualified | 1V | - | - | - | - | - | - | 954kB | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 155648 | 7815168 | - | - | 12160 | 1 | - | - | - | - | - | - | - | - | - | 3.5mm | 42.5mm | 42.5mm | - | ROHS3 Compliant | - | ||
![]() A42MX16-PLG84M Microchip Technology | 700 | - | - | - | - | - | - | Surface Mount | PLCC-84 | YES | - | 84-PLCC (29.31x29.31) | 84 | A42MX16 | 94 MHz | 16 | MICROSEMI CORP | A42MX16-PLG84M | 172 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | 3 | SMD/SMT | 72 I/O | - | 608 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-84 | - | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.28 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | - | Actel | - | 0.239083 oz | -55°C ~ 125°C (TC) | Tube | - | A42MX16 | e3 | - | - | - | - | 3A001.A.2.C | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | - | 1.27 mm | compliant | - | - | - | - | S-PQCC-J84 | - | Not Qualified | 3.3 V, 5 V | - | MILITARY | - | - | - | - | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | - | - | - | - | 2.8 ns | 1232 | - | - | - | 24000 | 3.68 mm | - | 29.31 mm | 29.31 mm | - | - | - | ||
![]() XC7VX485T-1FFG1761I Xilinx Inc. | 9300 | - | Datasheet | 10 Weeks | - | - | - | Surface Mount | 1760-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 700 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Virtex®-7 XT | e1 | yes | Active | 4 (72 Hours) | 1761 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | 0.97V~1.03V | BOTTOM | BALL | - | 1V | 1mm | - | - | - | XC7VX485T | 1761 | S-PBGA-B1761 | 700 | - | - | 11.8V | - | - | - | - | - | 4.5MB | 1818MHz | - | - | - | 700 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 485760 | 37969920 | - | - | 37950 | -1 | - | 607200 | 0.74 ns | - | - | - | - | - | - | 3.5mm | 42.5mm | 42.5mm | No | ROHS3 Compliant | - | ||
![]() XC2S200-5FGG456I Xilinx Inc. | 2956 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 456-BBGA | - | 456 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 284 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2004 | Spartan®-II | e1 | yes | Active | 3 (168 Hours) | 456 | 3A991.D | - | - | - | - | - | - | 2.375V~2.625V | BOTTOM | BALL | 250 | 2.5V | 1mm | - | - | 30 | XC2S200 | 456 | - | 284 | Not Qualified | 2.5V | - | - | - | - | - | - | 7kB | 263MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 57344 | 200000 | - | 1176 | 5 | - | - | 0.7 ns | - | - | - | - | - | - | 2.6mm | 23mm | 23mm | - | ROHS3 Compliant | Lead Free | ||
![]() A3PE3000-FGG484 Microchip Technology | 2219 |
| - | - | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | A3PE3000-FGG484 | 350 MHz | - | + 85 C | FLASH | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 341 I/O | - | 35000 LE | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.58 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | 516096 bit | ProASIC3 | - | 0.861390 oz | 0°C ~ 85°C (TJ) | Tray | - | A3PE3000 | e1 | - | - | - | - | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | - | 1 mm | compliant | 231 MHz | - | - | - | S-PBGA-B484 | 341 | Not Qualified | 1.425 V to 1.575 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 128 B | 25 mA | 63 kB | - | - | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 35000 | 516096 | 3000000 | 231 MHz | - | STD | - | 75264 | - | 75264 | 85 °C | 75264 | 70 °C | 3000000 | 1.73 mm | - | 23 mm | 23 mm | No | - | - | ||
![]() EP3C40U484C8N Intel | 2529 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 331 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | - | Cyclone® III | e1 | - | Active | 3 (168 Hours) | 484 | 3A001.A.7.A | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 40 | EP3C40 | - | R-PBGA-B484 | 331 | Not Qualified | - | - | - | - | - | - | - | - | 472.5MHz | - | - | - | 331 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 39600 | 1161216 | - | - | 2475 | - | - | - | - | - | - | - | - | - | - | 2.2mm | 19mm | 19mm | - | RoHS Compliant | - | ||
![]() A3P600-PQG208I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | - | PQFP-208 | - | - | - | - | - | - | 24 | - | - | 350 MHz | - | + 100 C | - | - | - | - 40 C | Yes | - | SMD/SMT | 154 I/O | - | 7000 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 1.575 V | 1.425 V | - | 110592 bit | ProASIC3 | - | 1 oz | - | Tray | - | A3P600 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | 45 mA | - | - | - | - | - | - | - | - | - | - | - | 600000 | - | - | - | - | - | - | - | - | - | - | - | 3.4 mm | - | 28 mm | 28 mm | - | - | - | ||
![]() XC5VLX110T-1FFG1738C Xilinx Inc. | 3689 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 1738-BBGA, FCBGA | - | 1738 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 680 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 1999 | Virtex®-5 LXT | e1 | yes | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - | - | - | - | 0.95V~1.05V | BOTTOM | BALL | 245 | 1V | - | - | - | 30 | XC5VLX110T | - | - | 680 | Not Qualified | 1V | - | - | - | - | - | - | 666kB | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 5455872 | - | - | 8640 | 1 | - | - | - | - | - | - | - | - | - | 3.5mm | 42.5mm | 42.5mm | - | ROHS3 Compliant | - | ||
![]() XC2S200-5FG256I Xilinx Inc. | 980 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 256-BGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 176 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 1999 | Spartan®-II | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | - | - | - | - | - | 2.375V~2.625V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | - | 30 | XC2S200 | 256 | - | 176 | Not Qualified | 2.5V | - | - | - | - | - | - | 7kB | 263MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 57344 | 200000 | - | 1176 | 5 | - | - | 0.7 ns | - | - | - | - | - | - | 2mm | 17mm | 17mm | - | Non-RoHS Compliant | Contains Lead |