- Manufacturer
- Number of I/Os
- Package / Case
- Packaging
- Series
- Mounting Type
- Operating Temperature
- Voltage - Supply
- JESD-609 Code
- Terminal Form
- Terminal Position
- Moisture Sensitivity Level (MSL)
- Part Status
Attribute column
Categories
Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Manufacturer Package Identifier | Base Product Number | Clock Frequency-Max | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Density | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Max Junction Temperature (Tj) | Number of Logic Cells | Ambient Temperature Range High | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 XC7A200T-1FBG676I Xilinx Inc. | 443 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | - | Surface Mount | 676-BBGA, FCBGA | YES | 676 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DDR3 | - | - | - | - | - | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Artix-7 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | XC7A200T | 676 | - | 400 | Not Qualified | - | 1V | - | 1GB | - | 1.6MB | 1098MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 215360 | - | 13455360 | - | 16825 | - | - | -1 | - | - | 269200 | 1.27 ns | - | - | - | - | - | - | 2.54mm | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
 XC6SLX9-2CSG324C Xilinx Inc. | 16612 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | Surface Mount | 324-LFBGA, CSPBGA | - | 324 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 1999 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | XC6SLX9 | 324 | - | 200 | Not Qualified | 1.2V | - | - | - | - | 72kB | 667MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9152 | - | 589824 | - | 715 | - | - | 2 | - | - | 11440 | - | 715 | - | - | - | - | - | 1.5mm | 15mm | 15mm | - | Unknown | ROHS3 Compliant | - | ||
 XC7K160T-1FFG676I Xilinx Inc. | 495 | - | Datasheet | 10 Weeks | - | - | - | Surface Mount | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.97V~1.03V | BOTTOM | BALL | - | 1V | 1mm | - | - | - | XC7K160 | 676 | S-PBGA-B676 | 400 | - | - | 11.83.3V | - | - | - | 1.4MB | 1098MHz | 120 ps | - | - | 400 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 162240 | - | 11980800 | - | 12675 | - | - | -1 | - | - | 202800 | 0.74 ns | - | - | - | - | - | - | 3.37mm | 27mm | 27mm | No | - | ROHS3 Compliant | - | ||
 XC6SLX9-2FTG256I Xilinx Inc. | 2092 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 256-LBGA | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 186 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 30 | XC6SLX9 | 256 | - | 186 | Not Qualified | 1.2V | - | - | - | - | 72kB | 667MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9152 | - | 589824 | - | 715 | - | 1430 | 2 | - | - | 11440 | - | 715 | - | - | - | - | - | 1.55mm | 17mm | 17mm | - | Unknown | ROHS3 Compliant | - | ||
 XC7K410T-2FFG900I Xilinx Inc. | 990 | - | Datasheet | 12 Weeks | - | - | - | Surface Mount | 900-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2007 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | XC7K410T | 900 | S-PBGA-B900 | 500 | Not Qualified | - | 11.83.3V | - | - | - | 3.5MB | 1286MHz | - | - | - | 500 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 406720 | - | 29306880 | - | 31775 | - | - | -2 | - | - | 508400 | 0.61 ns | - | - | - | - | - | - | 3.35mm | 31mm | 31mm | - | - | ROHS3 Compliant | - | ||
XC7K410T-2FFG676I Xilinx Inc. | 990 | - | Datasheet | 12 Weeks | - | - | - | Surface Mount | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | not_compliant | - | NOT SPECIFIED | XC7K410T | 676 | S-PBGA-B676 | 400 | Not Qualified | - | 11.83.3V | - | - | - | 3.5MB | 1286MHz | - | - | - | 400 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 406720 | - | 29306880 | - | 31775 | - | - | -2 | - | - | 508400 | 0.61 ns | - | - | - | - | - | - | 3.37mm | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
 A3P1000-FGG484 Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | - | FBGA-484 | - | - | - | - | - | - | - | - | - | - | 60 | - | - | 350 MHz | - | + 85 C | - | - | - | 0 C | Yes | - | SMD/SMT | 300 I/O | 11000 LE | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | - | 147456 bit | ProASIC3 | - | 0.421458 oz | - | - | Tray | - | A3P1000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | 8 mA | - | - | - | - | - | - | - | - | - | - | - | - | 1000000 | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.23 mm | - | 23 mm | 23 mm | - | - | - | - | ||
 XC6SLX9-2CSG225C Xilinx Inc. | 2780 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 225-LFBGA, CSPBGA | - | 225 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 160 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | - | 30 | XC6SLX9 | 225 | - | 160 | Not Qualified | 1.2V | - | - | - | - | 72kB | 667MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9152 | - | 589824 | - | 715 | - | - | 2 | - | - | 11440 | - | 715 | - | - | - | - | - | 1.4mm | 13mm | 13mm | - | - | ROHS3 Compliant | - | ||
 EP4CE15F23C8N Intel | 240 | - | Datasheet | 8 Weeks | - | - | - | Surface Mount | 484-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 343 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2016 | Cyclone® IV E | e1 | - | Active | 3 (168 Hours) | 484 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 40 | EP4CE15 | - | S-PBGA-B484 | 346 | Not Qualified | - | 1.21.2/3.32.5V | - | - | - | - | 472.5MHz | - | - | - | 346 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 15408 | - | 516096 | - | 963 | - | - | - | - | - | - | - | 963 | - | - | - | - | - | 2.4mm | 23mm | 23mm | - | - | RoHS Compliant | - | ||
 LCMXO2-640HC-4TG100C Lattice Semiconductor Corporation | 1496 | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | 100-LQFP | - | 100 | - | 657.000198mg | - | - | - | - | - | - | - | - | - | - | - | - | FLASH | - | - | - | - | - | - | 78 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | Active | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | - | 8542.39.00.01 | - | 2.375V~3.465V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 269MHz | 30 | LCMXO2-640 | - | - | 79 | - | 2.5V | 2.5/3.3V | - | 5.9kB | 1.84mA | 2.3kB | - | 7.24 ns | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 640 | 147 kb | 18432 | - | 80 | - | - | - | - | 320 | - | - | - | - | 640 | - | - | - | 1.6mm | 14mm | 14mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
XC7A200T-2FBG676C Xilinx Inc. | 495 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | - | Surface Mount | 676-BBGA, FCBGA | YES | 676 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DDR3 | - | - | - | - | - | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Artix-7 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | XC7A200T | 676 | - | 400 | Not Qualified | - | 1V | - | 1GB | - | 1.6MB | 1286MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 215360 | - | 13455360 | - | 16825 | - | - | -2 | - | - | 269200 | 1.05 ns | - | - | - | - | - | - | 2.54mm | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
XC7A35T-1FTG256C Xilinx Inc. | 990 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | - | Surface Mount | 256-LBGA | YES | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 170 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2001 | Artix-7 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | - | - | - | NOT SPECIFIED | - | 256 | - | 170 | Not Qualified | - | 1V | - | - | - | 225kB | - | 1.09 ns | 1.09 ns | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 33208 | - | 1843200 | - | 2600 | - | - | 1 | - | - | - | - | - | - | 33280 | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
LCMXO2-2000HC-4TG100C Lattice Semiconductor Corporation | 3893 | - | Datasheet | 8 Weeks | - | - | Surface Mount | Surface Mount | 100-LQFP | - | 100 | - | 657.000198mg | - | - | - | - | - | - | - | - | - | - | - | - | FLASH | - | - | - | - | - | - | 79 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | Active | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | - | 8542.39.00.01 | - | 2.375V~3.465V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 269MHz | 30 | LCMXO2-2000 | 100 | - | 80 | - | 2.5V | 2.5/3.3V | - | 21.3kB | 4.8mA | 9.3kB | - | 7.24 ns | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 2112 | - | 75776 | - | 264 | - | - | - | - | 1056 | - | - | - | - | - | - | - | - | - | - | - | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 XC6SLX45T-3FGG484C Xilinx Inc. | 495 | - | Datasheet | 10 Weeks | - | - | Surface Mount | Surface Mount | 484-BBGA | - | 484 | - | - | - | XC6SLX45T-3FGG484C | - | - | - | - | - | - | - | - | - | - | RAM | - | - | - | - | - | - | 296 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LXT | e1 | yes | Active | 3 (168 Hours) | 484 | - | - | - | - | - | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | - | - | 30 | XC6SLX45 | 484 | - | 296 | Not Qualified | 1.2V | - | - | - | - | 261kB | 862MHz | - | - | - | - | - | - | - | 43661 | - | 2138112 | - | 3411 | - | - | 3 | - | - | 54576 | 0.21 ns | - | 125°C | - | 150°C | - | 2.6mm | - | - | - | - | - | ROHS3 Compliant | - | ||
 EP3C25E144C8N Intel | 2092 | - | Datasheet | 11 Weeks | - | - | - | Surface Mount | 144-LQFP Exposed Pad | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 82 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Cyclone® III | e3 | - | Active | 3 (168 Hours) | 144 | 3A991 | MATTE TIN (472) OVER COPPER | - | 8542.39.00.01 | - | 1.15V~1.25V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | - | - | 40 | EP3C25 | - | R-PQFP-G144 | 82 | Not Qualified | - | - | - | - | - | - | 472.5MHz | - | - | - | 82 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 24624 | - | 608256 | - | 1539 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | - | - | RoHS Compliant | - | ||
XC7A200T-1FBG676C Xilinx Inc. | 495 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | - | Surface Mount | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DDR3 | - | - | - | - | - | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Artix-7 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | XC7A200T | 676 | S-PBGA-B676 | 400 | Not Qualified | - | 1V | - | 1GB | - | 1.6MB | 1098MHz | - | - | - | 400 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 215360 | - | 13455360 | - | 16825 | - | - | -1 | - | - | 269200 | 1.27 ns | - | 85°C | - | - | - | 2.54mm | - | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
A3P1000-PQG208I Microchip Technology | 1200 | - | - | - | - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | - | A3P1000 | 350 MHz | 144 kbit | 144 kbit | 24 | MICROSEMI CORP | A3P1000-PQG208I | 350 MHz | 1.575 V | + 100 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 154 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 1.32 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | 147456 bit | ProASIC3 | 1.5000 V | 1.399983 oz | - | -40 to 85 °C | Tray | - | A3P1000 | e3 | - | - | - | - | 3A001.A.7.A | Matte Tin (Sn) | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | - | 0.5 mm | compliant | - | - | - | - | S-PQFP-G208 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | 75 mA | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 147456 | 1000000 | - | - | - | STD | - | - | - | - | 24576 | - | - | - | 1000000 | 3.4 mm | - | 28 mm | 28 mm | - | - | - | - | ||
 A42MX36-1CQ208B Microsemi Corporation | 47 | - | Datasheet | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | Surface Mount | Surface Mount | 208-BFCQFP with Tie Bar | - | 208 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 176 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Military grade | -55°C~125°C TJ | Tray | 2009 | MX | e0 | - | Active | 3 (168 Hours) | 208 | - | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | - | - | 3V~3.6V 4.5V~5.5V | QUAD | FLAT | 225 | 3.3V | 0.5mm | - | - | 20 | A42MX36 | 208 | - | - | - | 3.3V | - | - | - | - | 320B | 83MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | 2560 | 54000 | - | MIL-STD-883 | - | 1 | - | - | 1822 | 2.3 ns | 2438 | - | - | - | - | - | 3.3mm | - | - | No | - | Non-RoHS Compliant | - | ||
XC7A100T-2FGG484I Xilinx Inc. | 990 | - | Datasheet | 12 Weeks | - | - | - | Surface Mount | 484-BBGA | YES | 484 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 285 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Artix-7 | e1 | yes | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | XC7A100T | 484 | - | 285 | Not Qualified | - | 1V | - | - | - | 607.5kB | 1286MHz | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 101440 | - | 4976640 | - | 7925 | - | - | -2 | - | - | 126800 | 1.05 ns | - | - | - | - | - | - | 2.6mm | 23mm | 23mm | - | - | ROHS3 Compliant | - | ||
A3P250-FGG256I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | - | FBGA-256 | - | - | - | - | - | - | - | - | - | - | 90 | - | - | 350 MHz | - | + 100 C | - | - | - | - 40 C | Yes | - | SMD/SMT | 157 I/O | 3000 LE | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 1.575 V | 1.425 V | - | 36864 bit | ProASIC3 | - | 0.032170 oz | - | - | Tray | - | A3P250 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | 30 mA | - | - | - | - | - | - | - | - | - | - | - | - | 250000 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 mm | - | 17 mm | 17 mm | - | - | - | - |