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Embedded - Microcontroller, Microprocessor, FPGA Modules

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2817 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Base Product Number

Brand

Dimensions

Factory Pack QuantityFactory Pack Quantity

Installed RAM

Interface Type

Manufacturer

Maximum Operating Temperature

Maximum RAM Capacity

Mfr

Minimum Operating Temperature

Package

Processor Brand

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Product Status

RoHS

Operating Temperature

Packaging

Series

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Speed

RAM Size

Core Processor

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Product

Co-Processor

Product Category

1011051
1011051

Samsung

In Stock

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G400S-SM-480
G400S-SM-480

Fastrax

In Stock

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FS3004
FS3004

Infineon

In Stock

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DLP-245PL-G
DLP-245PL-G

FTDI

32
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DLP-245

FTDI

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1

-

-

FTDI

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-

FTDI, Future Technology Devices International Ltd

-

Bulk

-

-

Active

Details

-

Bulk

-

2.800 L x 2.000 W (71.10mm x 50.80mm)

USB - B, Pin Header

Development Tools

-

-

-

3.75KB

PIC16F8722

Interface Development Tools

-

-

128KB

-

-

Interface Development Tools

JN5169-001-M03-2
JN5169-001-M03-2

NXP

In Stock

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-

-

-

-

-

-

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NXP USA Inc.

-

Bulk

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-

Active

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*

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1010561
1010561

Phoenix Contact

In Stock

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-

-

Phoenix Contact

-

50

-

-

Phoenix Contact

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-

-

-

-

-

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Details

-

-

-

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Terminal Blocks

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Fixed Terminal Blocks

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-

-

Fixed Terminal Blocks

-

Fixed Terminal Blocks

20-101-1142
20-101-1142

Digi

In Stock

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-

-

-

-

-

-

-

-

-

-

Digi

-

Bulk

-

-

Obsolete

-

-20°C ~ 85°C

-

-

1.850 L x 2.840 W (47.00mm x 72.00mm)

Header

-

-

-

58.98MHz

512KB

Rabbit 4000

-

-

MPU Core

4MB

-

-

-

TE0808-05-BBE21-AZ
TE0808-05-BBE21-AZ

Trenz Electronic

In Stock

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-

-

-

-

-

-

-

-

-

-

Trenz Electronic GmbH

-

Box

-

-

Active

-

0°C ~ 85°C

-

-

2.050 L x 2.990 W (52.00mm x 76.00mm)

Board-to-Board (BTB) Socket

-

-

-

-

2GB

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E

-

-

FPGA Core

128MB

-

-

-

TE0823-01-3PIU1F
TE0823-01-3PIU1F

Trenz Electronic

In Stock

-

-

-

-

-

-

-

-

-

-

-

Trenz Electronic GmbH

-

Bulk

-

-

Obsolete

-

-40°C ~ 85°C

-

TE0823

1.970 L x 1.570 W (50.00mm x 40.00mm)

USB

-

-

-

-

1GB

ARM Cortex-A53, ARM® Cortex®-R5

-

-

MCU, FPGA

128MB

-

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

TE0745-02-92I11-F
TE0745-02-92I11-F

Trenz Electronic

In Stock

-

-

-

-

-

-

-

-

-

-

-

Trenz Electronic GmbH

-

Bulk

-

-

Obsolete

-

-40°C ~ 85°C

-

TE0745

2.050 L x 2.990 W (52.00mm x 76.00mm)

Board-to-Board (BTB) Socket - 480

-

-

-

-

1GB

ARM Cortex-A9

-

-

MCU, FPGA

64MB

-

Zynq-7000 (Z-7045)

-

TE0820-05-3BE21MA
TE0820-05-3BE21MA

Trenz Electronic

In Stock

-

-

-

-

-

-

-

-

-

-

-

Trenz Electronic GmbH

-

Bulk

-

-

Active

-

0°C ~ 85°C

-

TE0820

1.970 L x 1.570 W (50.00mm x 40.00mm)

Pin(s)

-

-

-

-

2GB

ARM® Cortex®-A53, ARM® Cortex®-R5

-

-

MPU Core

128MB

-

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E

-

TE0720-03-31C33MA
TE0720-03-31C33MA

Trenz Electronic

In Stock

-

-

-

-

-

-

-

-

-

-

-

Trenz Electronic GmbH

-

Bulk

-

-

Obsolete

-

0°C ~ 70°C

-

TE0720

1.970 L x 1.570 W (50.00mm x 40.00mm)

Samtec LSHM

-

-

-

766MHz

1GB

ARM Cortex-A9

-

-

MCU, FPGA

8GB

-

Zynq-7000 (Z-7014S)

-

TE0714-04-52I-8-A
TE0714-04-52I-8-A

Trenz Electronic

2449
  • 1:$116.900746
  • 10:$110.283723
  • 100:$104.041248
  • 500:$98.152121
    • View all price
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-

-

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-

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Trenz Electronic GmbH

-

Bulk

-

-

Active

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-40°C ~ 85°C

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TE0714

1.570 L x 1.180 W (40.00mm x 30.00mm)

-

-

-

-

-

-

Artix-7 A50T

-

-

FPGA

16MB

-

Artix-7

-

TE0782-02-92I33MA
TE0782-02-92I33MA

Trenz Electronic

998
  • 1:$2,153.758648
  • 10:$2,082.938731
  • 25:$2,068.459515
  • 50:$2,054.080948
    • View all price
-

-

-

-

-

-

-

-

-

-

Trenz Electronic GmbH

-

Bulk

-

-

Active

-

-40°C ~ 85°C

-

TE0782

3.350 L x 3.350 W (85.00mm x 85.00mm)

Board-to-Board (BTB) Socket

-

-

-

-

1GB

ARM Cortex-A9

-

-

MCU, FPGA

32MB

-

Zynq-7000 (Z-7045)

-

MAX 10 FPGA
MAX 10 FPGA

Intel

In Stock

-

-

-

-

-

-

-

-

-

-

-

Intel

-

Bulk

-

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Active

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ARRIA 10 GX
ARRIA 10 GX

Intel

In Stock

-

-

-

-

-

-

-

-

-

-

-

Intel

-

Bulk

-

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Active

-

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1011055
1011055

Samsung

In Stock

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-

-

-

-

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TE0823-01-3PIU1MA
TE0823-01-3PIU1MA

Trenz Electronic

750
  • 1:$638.274394
  • 10:$602.145655
  • 100:$568.061938
  • 500:$535.907489
    • View all price
-

-

-

50 mm x 40 mm

-

1 GB

DP, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, USB 3.0

-

+ 85 C

1 GB

Trenz Electronic GmbH

- 40 C

Bulk

Xilinx

XCZU3CG-L1SFVC784I

Active

-

-40°C ~ 85°C

-

TE0823

1.970 L x 1.570 W (50.00mm x 40.00mm)

USB

-

3.3 V to 5 V

1 GB

-

1GB

ARM Cortex-A53, ARM® Cortex®-R5

-

40 mm x 50 mm

MCU, FPGA

128MB

-

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

M100PF-2AC
M100PF-2AC

Aries Electronics

In Stock

-

-

-

-

-

-

-

-

-

-

-

ARIES Embedded

-

Box

-

-

Active

-

0°C ~ 70°C

-

PolarFire™

-

Board-to-Board (BTB) Socket

-

-

-

-

1GB

-

-

-

FPGA

-

-

-

-

MX10-S16
MX10-S16

Aries Electronics

In Stock

-

-

-

-

-

-

-

-

-

-

-

ARIES Embedded

-

Box

-

-

Active

-

0°C ~ 70°C

-

-

2.760 L x 1.380 W (70.00mm x 35.00mm)

100 Pin

-

-

-

25MHz

128MB

-

-

-

FPGA

-

-

-

-

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