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  • RoHS
  • RAM Size
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  • Memory Size
  • Max Supply Voltage

Attribute column

Categories

Embedded - Microcontroller, Microprocessor, FPGA Modules

View Mode:
2817 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Surface Mount

Number of Terminals

Clock Frequency-Max

Ihs Manufacturer

Mfr

Moisture Sensitivity Levels

Number of I/O Lines

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Product Status

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Operating Temperature

Packaging

Series

Size / Dimension

JESD-609 Code

Part Status

Connector Type

Terminal Finish

Additional Feature

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Temperature Grade

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Supply Current-Max

Bit Size

Seated Height-Max

Address Bus Width

Boundary Scan

External Data Bus Width

RAM (words)

Bus Compatibility

Module/Board Type

Flash Size

Co-Processor

Length

Width

TE0712-02-72C06-M
TE0712-02-72C06-M

Trenz Electronic

In Stock

-

-

-

-

-

-

Trenz Electronic GmbH

-

-

-

-

Bulk

-

-

-

-

-

-

-

-

Active

-

-

-

-

0°C ~ 85°C

-

TE0712

1.970 L x 1.570 W (50.00mm x 40.00mm)

-

-

Samtec LSHM

-

-

-

-

-

-

-

-

-

-

-

-

-

200MHz

1GB

-

-

-

-

-

-

-

-

-

-

FPGA Core

32MB

-

-

-

TE0720-03-1QFA
TE0720-03-1QFA

Trenz Electronic

In Stock

-

-

-

-

-

-

Trenz Electronic GmbH

-

-

-

-

Bulk

-

-

-

-

-

-

-

-

Obsolete

-

-

-

-

-

-

TE0720

1.970 L x 1.570 W (50.00mm x 40.00mm)

-

-

B2B

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1GB

-

ARM Cortex-A9

-

-

-

-

-

-

-

-

MCU, FPGA

32MB

Zynq-7000 (Z-7020)

-

-

M100PF-3AC
M100PF-3AC

Aries Electronics

In Stock

-

-

-

-

-

-

ARIES Embedded

-

-

-

-

Box

-

-

-

-

-

-

-

-

Active

-

-

-

-

0°C ~ 70°C

-

PolarFire™

-

-

-

Board-to-Board (BTB) Socket

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1GB

-

-

-

-

-

-

-

-

-

-

FPGA

-

-

-

-

MCXL-H055BBB-I
MCXL-H055BBB-I

Aries Electronics

In Stock

-

-

-

-

-

-

ARIES Embedded

-

-

-

-

Box

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

221 Pin

-

-

-

-

-

-

-

-

-

-

-

-

-

-

256MB

-

-

-

-

-

-

-

-

-

-

FPGA

-

-

-

-

MX10-U
MX10-U

Aries Electronics

In Stock

-

-

-

-

-

-

ARIES Embedded

-

-

-

-

Box

-

-

-

-

-

-

-

-

Active

-

-

-

-

0°C ~ 70°C

-

-

2.760 L x 1.380 W (70.00mm x 35.00mm)

-

-

100 Pin

-

-

-

-

-

-

-

-

-

-

-

-

-

25MHz

128MB

-

-

-

-

-

-

-

-

-

-

FPGA

4MB (NOR)

-

-

-

MCV-X6DB
MCV-X6DB

Aries Electronics

In Stock

-

-

-

-

-

-

ARIES Embedded

-

-

-

-

Box

-

-

-

-

-

-

-

-

Active

-

-

-

-

0°C ~ 70°C

-

-

2.910 L x 1.650 W (74.00mm x 42.00mm)

-

-

360 Pin

-

-

-

-

-

-

-

-

-

-

-

-

-

800MHz

1GB

-

ARM Cortex-A9 (Dual Core)

-

-

-

-

-

-

-

-

FPGA

4GB

-

-

-

MCXL-S055BC-I
MCXL-S055BC-I

Aries Electronics

In Stock

-

-

-

-

-

-

ARIES Embedded

-

-

-

-

Box

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

221 Pin

-

-

-

-

-

-

-

-

-

-

-

-

-

-

512MB

-

-

-

-

-

-

-

-

-

-

FPGA

-

-

-

-

MCV-6DB
MCV-6DB

Aries Electronics

In Stock

-

-

-

-

-

-

ARIES Embedded

-

-

-

-

Box

-

-

-

-

-

-

-

-

Active

-

-

-

-

0°C ~ 70°C

-

-

2.910 L x 1.650 W (74.00mm x 42.00mm)

-

-

360 Pin

-

-

-

-

-

-

-

-

-

-

-

-

-

800MHz

1GB

-

ARM Cortex-A9 (Dual Core)

-

-

-

-

-

-

-

-

FPGA

4GB

-

-

-

TE0714-03-35-2IC7
TE0714-03-35-2IC7

Trenz Electronic

In Stock

-

-

-

-

-

-

Trenz Electronic GmbH

-

-

-

-

Bulk

-

-

-

-

-

-

-

-

Last Time Buy

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

PSD51/18
PSD51/18

POWER SEMICONDUCTORS INC

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

STIH207-BKB
STIH207-BKB

STMicroelectronics

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SIS5600
SIS5600

Silicon Integrated Systems Corp

In Stock

-

Datasheet

YES

487

-

SILICON INTEGRATED SYSTEMS CORP

-

-

-

-

-

-

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Obsolete

BGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.39.00.01

BOTTOM

BALL

-

1.27 mm

unknown

-

487

S-PBGA-B487

Not Qualified

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

35 mm

35 mm

PIMX8UX6AVLFZAC
PIMX8UX6AVLFZAC

NXP Semiconductors

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 75°C

Bulk

-

1.450" L x 0.750" W (36.70mm x 19.10mm)

-

Obsolete

RJ45

-

-

-

-

-

-

-

-

-

-

-

-

-

75MHz

16MB

-

ARM926EJ-S, NS9210

-

-

-

-

-

-

-

-

MPU Core

8MB

-

-

-

PC97307-ICK/VUL
PC97307-ICK/VUL

Texas Instruments

In Stock

-

Datasheet

YES

16

48 MHz

NATIONAL SEMICONDUCTOR CORP

-

2A

24

70 °C

-

-

PLASTIC/EPOXY

QFP

QFP, QFP160,1.2SQ

QFP160,1.2SQ

SQUARE

FLATPACK

Transferred

-

-

No

5.5 V

4.5 V

5 V

-

-

-

-

e0

-

-

TIN LEAD

-

8542.39.00.01

QUAD

GULL WING

220

0.65 mm

compliant

30

-

S-PQFP-G16

Not Qualified

COMMERCIAL

-

-

-

-

50 mA

-

4.1 mm

16

NO

8

242

PC-AT; EISA; ISA; PS/2; MICROCHANNEL

-

-

-

28 mm

28 mm

PC97307-ICK/VUL
PC97307-ICK/VUL

Winbond Electronics Corp

In Stock

-

Datasheet

YES

16

48 MHz

WINBOND ELECTRONICS CORP

-

2A

24

70 °C

-

-

PLASTIC/EPOXY

QFP

QFP,

-

SQUARE

FLATPACK

Obsolete

QFP

-

No

5.5 V

4.5 V

5 V

-

-

-

-

e0

-

-

TIN LEAD

-

8542.39.00.01

QUAD

GULL WING

220

0.65 mm

not_compliant

30

16

S-PQFP-G16

Not Qualified

COMMERCIAL

-

-

-

-

-

-

4.1 mm

16

NO

8

242

PC-AT; EISA; ISA; PS/2; MICROCHANNEL

-

-

-

28 mm

28 mm

F82C100
F82C100

Intel Corporation

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

PSD50/18
PSD50/18

POWER SEMICONDUCTORS INC

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

W83910F
W83910F

Winbond Electronics Corp

In Stock

-

Datasheet

YES

128

40 MHz

WINBOND ELECTRONICS CORP

-

-

38

70 °C

-

-

PLASTIC/EPOXY

FQFP

FQFP, QFP128,.67X.93,20

QFP128,.67X.93,20

RECTANGULAR

FLATPACK, FINE PITCH

Obsolete

QFP

-

-

5.5 V

4.5 V

5 V

-

-

-

-

-

-

-

-

-

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

128

R-PQFP-G128

Not Qualified

COMMERCIAL

-

-

-

-

-

-

3.32 mm

4

NO

4

242

LPC

-

-

-

20 mm

14 mm

STPCI0166BTC3
STPCI0166BTC3

STMicroelectronics

In Stock

-

Datasheet

YES

388

14.318 MHz

STMICROELECTRONICS

-

-

8

115 °C

-40 °C

-

PLASTIC/EPOXY

BGA

BGA, BGA388,26X26,50

BGA388,26X26,50

SQUARE

GRID ARRAY

Obsolete

BGA

-

No

3.6 V

3 V

3.3 V

-

-

-

-

e0

-

-

TIN LEAD

0 TO 100 OPERATING CASE TEMPERATURE

8542.39.00.01

BOTTOM

BALL

-

1.27 mm

not_compliant

-

388

S-PBGA-B388

Not Qualified

INDUSTRIAL

66 MHz

-

MULTIFUNCTION PERIPHERAL

-

-

32

2.38 mm

32

NO

32

-

PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2

-

-

-

35 mm

35 mm