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Embedded - Microcontrollers - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Number of Bits | Supply Current-Max | Seated Height-Max | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Output Clock Frequency-Max | Bus Compatibility | Communication Protocol | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 SCC66470CAB Philips Semiconductors | In Stock | - | Datasheet | YES | 120 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP120,1.2SQ,32 | QFP120,1.2SQ,32 | SQUARE | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G120 | Not Qualified | INDUSTRIAL | - | - | - | 100 mA | - | - | - | - | - | - | - | - | ||
SCC66470CAB NXP Semiconductors | In Stock | - | Datasheet | YES | 120 | - | NXP SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP120,1.2SQ,32 | QFP120,1.2SQ,32 | SQUARE | FLATPACK | Active | - | - | - | - | 5 V | - | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 0.8 mm | compliant | - | - | S-PQFP-G120 | Not Qualified | INDUSTRIAL | - | - | - | 100 mA | - | - | - | - | - | - | - | - | ||
 MCP23016-I/P Microchip Technology Inc | In Stock | - | Datasheet | NO | 28 | - | MICROCHIP TECHNOLOGY INC | - | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | - | DIP28,.6 | RECTANGULAR | IN-LINE | Contact Manufacturer | DIP | Yes | - | - | - | e3 | Yes | EAR99 | MATTE TIN | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | compliant | - | 28 | R-PDIP-T28 | Not Qualified | INDUSTRIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 16 | - | - | - | - | - | - | - | - | - | ||
SC15025CV Sierra Semiconductor | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 CY26580OI-1T Cypress Semiconductor | In Stock | - | Datasheet | YES | 20 | - | CYPRESS SEMICONDUCTOR CORP | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP, SSOP20,.25 | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | - | 3.47 V | 3.14 V | 3.3 V | e0 | - | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 0.635 mm | unknown | - | 20 | R-PDSO-G20 | Not Qualified | INDUSTRIAL | - | CLOCK GENERATOR, OTHER | - | 50 mA | 1.7526 mm | 125 MHz | - | 133.33 MHz | - | - | 8.6487 mm | 3.8989 mm | ||
 MK2049-35SITR Integrated Device Technology Inc | In Stock | - | Datasheet | YES | 20 | - | INTEGRATED CIRCUIT SYSTEMS INC | 1 | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.45 V | 3.15 V | 3.3 V | - | - | EAR99 | - | 8542.39.00.01 | DUAL | GULL WING | - | 1.27 mm | unknown | - | 20 | R-PDSO-G20 | Not Qualified | INDUSTRIAL | - | CLOCK GENERATOR, OTHER | - | - | 2.65 mm | 25.6 MHz | - | 49.152 MHz | - | - | 12.8 mm | 7.5 mm | ||
TC8570P Toshiba America Electronic Components | In Stock | - | Datasheet | NO | 40 | - | TOSHIBA CORP | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Active | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T40 | Not Qualified | INDUSTRIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | - | - | - | NO | - | - | ASYNC, BIT | - | - | ||
PSB50505EV1.3GXT Infineon Technologies AG | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
ICS843021AG Renesas Electronics Corporation | In Stock | - | Datasheet | YES | 8 | - | RENESAS ELECTRONICS CORP | 1 | - | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | End Of Life | - | No | 3.63 V | 2.97 V | 3.3 V | e0 | - | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 0.65 mm | compliant | - | - | R-PDSO-G8 | Not Qualified | COMMERCIAL | - | CLOCK GENERATOR, OTHER | - | 85 mA | 1.2 mm | 40 MHz | - | 140 MHz | - | - | 4.4 mm | 3 mm | ||
XCZU7EG-3FFVC1156I AMD Xilinx | In Stock | - | Datasheet | YES | 1156 | 2017-02-15 | XILINX INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | - | Yes | - | - | 0.9 V | e1 | - | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 3.51 mm | - | - | - | - | - | 35 mm | 35 mm | ||
RS5C313-F Ricoh Electronic Devices Co Ltd | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
R6765P Rockwell Automation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
R6765P Conexant Systems Inc | In Stock | - | Datasheet | NO | 40 | - | CONEXANT SYSTEMS | - | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T40 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | ||
XCZU9CG-1FBVB900I AMD Xilinx | In Stock | - | Datasheet | YES | 900 | - | XILINX INC | - | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA900,30X30,40 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | unknown | - | - | S-PBGA-B900 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 2.88 mm | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | 31 mm | 31 mm | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 900 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 2.88 mm | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | 31 mm | 31 mm | ||
PC87310DVF National Semiconductor Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XCZU6CG-1SBVA484I AMD Xilinx | In Stock | - | Datasheet | YES | 484 | - | XILINX INC | - | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | - | S-PBGA-B484 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 2.61 mm | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | 19 mm | 19 mm | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | - | 3.32 mm | - | - | - | CAN, I2C, SPI, UART | - | 23 mm | 23 mm | ||
RT9247CC Richtek Technology Corp | In Stock | - | Datasheet | - | - | - | RICHTEK TECHNOLOGY CORP | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | e3 | - | - | Matte Tin (Sn) | 8542.31.00.01 | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XC68302RC16 Motorola Semiconductor Products | In Stock | - | Datasheet | NO | 132 | - | MOTOROLA INC | - | - | 70 °C | - | CERAMIC | PGA | - | PGA132,13X13 | SQUARE | GRID ARRAY | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | - | 2.54 mm | unknown | - | - | S-XPGA-P132 | Not Qualified | COMMERCIAL | - | - | - | 64 mA | - | - | - | - | - | - | - | - |