-

YES

56

111 MHz

XILINX INC

-

44

70 °C

-

PLASTIC/EPOXY

LFBGA

6 X 6 MM, 1.05 MM HEIGHT, LFBGA-56

BGA56,10X10,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

No

3.6 V

3 V

3.3 V

e0

-

-

TIN LEAD

YES

8542.39.00.01

-

BOTTOM

BALL

-

0.5 mm

compliant

-

56

S-PBGA-B56

-

Not Qualified

COMMERCIAL

9 ns

-

-

2 DEDICATED INPUTS, 44 I/O

1.35 mm

EE PLD

-

MACROCELL

64

YES

2

YES

-

6 mm

6 mm

-

YES

56

-

PHILIPS SEMICONDUCTORS

-

-

70 °C

-

PLASTIC/EPOXY

FBGA

FBGA, BGA56,10X10,20

BGA56,10X10,20

SQUARE

GRID ARRAY, FINE PITCH

Transferred

-

No

-

-

3.3 V

e0

-

-

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

-

BOTTOM

BALL

-

0.5 mm

unknown

-

-

S-PBGA-B56

-

Not Qualified

COMMERCIAL

9 ns

-

-

-

-

EE PLD

-

-

64

YES

-

YES

-

-

-

-

YES

28

71.4 MHz

CYPRESS SEMICONDUCTOR CORP

-

16

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC28,.5SQ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

Obsolete

QLCC

No

5.25 V

4.75 V

5 V

e0

-

-

TIN LEAD

MACROCELLS INTERCONNECTED BY PIA; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

-

QUAD

J BEND

-

1.27 mm

not_compliant

-

28

S-PQCC-J28

16

Not Qualified

COMMERCIAL

16 ns

PAL-TYPE

24

7 DEDICATED INPUTS, 16 I/O

4.572 mm

OT PLD

-

MACROCELL

-

-

7

-

320

11.5316 mm

11.5316 mm

-

NO

24

74 MHz

INTEL CORP

-

8

70 °C

-

PLASTIC/EPOXY

DIP

DIP, DIP24,.3

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

e0

-

-

TIN LEAD

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

-

DUAL

THROUGH-HOLE

-

2.54 mm

compliant

-

24

R-PDIP-T24

8

Not Qualified

COMMERCIAL

9 ns

PAL-TYPE

22

13 DEDICATED INPUTS, 8 I/O

4.32 mm

OT PLD

-

MACROCELL

-

-

13

-

72

31.61 mm

7.62 mm

-

YES

44

-

PHILIPS SEMICONDUCTORS

-

-

70 °C

-

PLASTIC/EPOXY

QFP

QFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK

Transferred

-

No

-

-

5 V

e0

-

-

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

-

QUAD

GULL WING

-

0.8 mm

unknown

-

-

S-PQFP-G44

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

-

-

EE PLD

-

-

32

YES

-

YES

-

-

-

-

YES

44

59 MHz

NXP SEMICONDUCTORS

-

32

70 °C

-

PLASTIC/EPOXY

TQFP

10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44

-

SQUARE

FLATPACK, THIN PROFILE

Obsolete

QFP

-

5.25 V

4.75 V

5 V

-

-

-

-

32 MACROCELLS

8542.39.00.01

-

QUAD

GULL WING

-

0.8 mm

unknown

-

44

S-PQFP-G44

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

10 mm

10 mm

-

YES

208

222 MHz

XILINX INC

3

168

70 °C

-

PLASTIC/EPOXY

FQFP

PLASTIC, QFP-208

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Obsolete

QFP

No

2.62 V

2.37 V

2.5 V

e0

-

-

Tin/Lead (Sn85Pb15)

YES

8542.39.00.01

-

QUAD

GULL WING

225

0.5 mm

unknown

30

208

S-PQFP-G208

-

Not Qualified

COMMERCIAL

5 ns

-

-

0 DEDICATED INPUTS, 168 I/O

4.1 mm

FLASH PLD

-

MACROCELL

288

YES

-

YES

-

28 mm

28 mm

-

YES

100

63 MHz

NXP SEMICONDUCTORS

-

80

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP,

-

RECTANGULAR

FLATPACK

Transferred

-

-

5.5 V

4.5 V

5 V

-

-

-

-

-

8542.39.00.01

-

QUAD

GULL WING

-

0.65 mm

unknown

-

-

R-PQFP-G100

-

Not Qualified

INDUSTRIAL

17.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

-

MACROCELL

-

-

2

-

-

20 mm

14 mm

-

YES

44

-

PHILIPS SEMICONDUCTORS

-

-

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK

Transferred

-

No

-

-

5 V

e0

-

-

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

TAPE AND REEL

QUAD

GULL WING

-

0.8 mm

unknown

-

-

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

14 ns

-

-

-

-

EE PLD

-

-

64

YES

-

YES

-

-

-

-

YES

100

59 MHz

XILINX INC

3

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

PLASTIC, VQFP-100

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

No

3.63 V

2.97 V

3.3 V

e0

-

-

TIN LEAD

YES

8542.39.00.01

-

QUAD

GULL WING

240

0.5 mm

not_compliant

30

100

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

15 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

128

YES

2

YES

-

14 mm

14 mm

-

YES

44

80 MHz

XILINX INC

3

32

70 °C

-

PLASTIC/EPOXY

QFP

PLASTIC, QFP-44

QFP44,.5SQ,32

SQUARE

FLATPACK

Obsolete

QFP

No

5.25 V

4.75 V

5 V

e0

-

-

TIN LEAD

36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 36 FLIP-FLOPS

8542.39.00.01

-

QUAD

GULL WING

225

0.8 mm

not_compliant

30

44

S-PQFP-G44

-

Not Qualified

COMMERCIAL

19 ns

-

-

2 DEDICATED INPUTS, 32 I/O

2.35 mm

OT PLD

-

MACROCELL

36

NO

2

NO

-

10 mm

10 mm

-

YES

100

-

XILINX INC

3

-

70 °C

-

PLASTIC/EPOXY

QFP

QFP, TQFP100,.63SQ

TQFP100,.63SQ

SQUARE

FLATPACK

Obsolete

-

No

-

-

5 V

-

-

-

-

YES

8542.39.00.01

-

QUAD

GULL WING

240

0.5 mm

unknown

30

-

S-PQFP-G100

-

Not Qualified

COMMERCIAL

12 ns

-

-

-

-

EE PLD

-

-

128

YES

-

YES

-

-

-

-

YES

100

71 MHz

NXP SEMICONDUCTORS

-

80

70 °C

-

PLASTIC/EPOXY

TFQFP

14 X 14 X 1 MM, PLASTIC, SOT-386-1, TQFP-100

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

-

5.25 V

4.75 V

5 V

-

-

-

-

-

8542.39.00.01

-

QUAD

GULL WING

-

0.5 mm

unknown

-

100

S-PQFP-G100

-

Not Qualified

COMMERCIAL

12 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

14 mm

14 mm

-

YES

84

-

XILINX INC

3

-

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

-

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

-

No

-

-

5 V

e0

-

-

TIN LEAD

NO

8542.39.00.01

-

QUAD

J BEND

225

1.27 mm

unknown

30

-

S-PQCC-J84

-

Not Qualified

INDUSTRIAL

40 ns

-

-

-

-

OT PLD

-

-

72

NO

-

NO

-

-

-

-

YES

208

-

ALTERA CORP

-

134

-

-

PLASTIC/EPOXY

HFQFP

HFQFP,

-

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Obsolete

QFP

No

-

-

1.8 V

e3

-

-

MATTE TIN

-

8542.39.00.01

-

QUAD

GULL WING

220

0.5 mm

compliant

-

208

S-PQFP-G208

-

Not Qualified

-

-

-

-

4 DEDICATED INPUTS, 134 I/O

4.1 mm

LOADABLE PLD

-

MACROCELL

-

-

4

-

-

28 mm

28 mm

-

YES

68

20.8 MHz

ALTERA CORP

-

48

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC68,1.0SQ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5.5 V

4.5 V

5 V

e0

No

-

TIN LEAD

48 MACROCELLS

8542.39.00.01

-

QUAD

J BEND

220

1.27 mm

unknown

-

68

S-PQCC-J68

-

Not Qualified

INDUSTRIAL

70 ns

-

-

12 DEDICATED INPUTS, 48 I/O

-

OT PLD

-

MACROCELL

48

NO

12

NO

-

24.2316 mm

24.2316 mm

-

YES

44

-

XILINX INC

3

-

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK

Obsolete

-

No

-

-

-

-

-

-

-

YES

8542.39.00.01

-

QUAD

GULL WING

240

0.8 mm

unknown

30

-

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

11.5 ns

-

-

-

-

EE PLD

-

-

64

YES

-

YES

-

-

-

-

NO

20

-

ADVANCED MICRO DEVICES INC

-

-

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

0.250 X 1 INCH, CERAMIC, DIP-20

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.5 V

4.5 V

5 V

e0

-

3A001.A.2.C

TIN LEAD

-

8542.39.00.01

-

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

20

R-CDIP-T20

8

Not Qualified

MILITARY

45 ns

PAL-TYPE

10

10 DEDICATED INPUTS, 0 I/O

4.318 mm

OT PLD

38535Q/M;38534H;883B

COMBINATORIAL

-

-

10

-

16

25.908 mm

7.62 mm

-

YES

84

63 MHz

NXP SEMICONDUCTORS

-

64

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

PEDESTAL, PLASTIC, SOT-189-3, LCC-84

-

SQUARE

CHIP CARRIER

Obsolete

LCC

-

5.5 V

4.5 V

5 V

-

-

-

-

-

8542.39.00.01

-

QUAD

J BEND

-

1.27 mm

unknown

-

84

S-PQCC-J84

-

Not Qualified

INDUSTRIAL

17.5 ns

-

-

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

-

MACROCELL

-

-

2

-

-

29.3116 mm

29.3116 mm

-

YES

84

-

XILINX INC

3

-

70 °C

-

PLASTIC/EPOXY

QCCJ

-

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

-

No

-

-

3.3 V

e0

-

-

TIN LEAD

YES

8542.39.00.01

-

QUAD

J BEND

225

1.27 mm

unknown

30

-

S-PQCC-J84

-

Not Qualified

COMMERCIAL

14.5 ns

-

-

-

-

EE PLD

-

-

128

YES

-

YES

-

-

-