-

YES

352

151.5 MHz

XILINX INC

3

192

70 °C

-

PLASTIC/EPOXY

LBGA

PLASTIC, BGA-352

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

BGA

No

3.6 V

3 V

3.3 V

e0

-

Tin/Lead (Sn63Pb37)

288 MACROCELLS

8542.39.00.01

BOTTOM

BALL

225

1.27 mm

not_compliant

30

352

S-PBGA-B352

-

Not Qualified

COMMERCIAL

6 ns

-

-

0 DEDICATED INPUTS, 192 I/O

1.7 mm

FLASH PLD

-

MACROCELL

288

YES

-

YES

-

35 mm

35 mm

-

YES

100

87 MHz

NXP SEMICONDUCTORS

-

80

70 °C

-

PLASTIC/EPOXY

TFQFP

TFQFP,

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Transferred

-

-

5.25 V

4.75 V

5 V

-

-

-

-

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

-

S-PQFP-G100

-

Not Qualified

COMMERCIAL

10 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

14 mm

14 mm

-

YES

28

25 MHz

TELEDYNE E2V (UK) LTD

-

10

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

-

LCC28,.45SQ

SQUARE

CHIP CARRIER, WINDOW

Active

-

-

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

TIN LEAD

10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS

8542.39.00.01

QUAD

NO LEAD

-

1.27 mm

compliant

-

-

S-CQCC-N28

10

Qualified

MILITARY

30 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

2.8956 mm

UV PLD

38535Q/M;38534H;883B

MACROCELL

-

-

11

-

132

11.43 mm

11.43 mm

-

YES

28

25 MHz

CYPRESS SEMICONDUCTOR CORP

-

10

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

WQCCN,

-

SQUARE

CHIP CARRIER, WINDOW

Obsolete

QLCC

-

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

TIN LEAD

10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS

8542.39.00.01

QUAD

NO LEAD

-

1.27 mm

unknown

-

28

S-CQCC-N28

-

Not Qualified

MILITARY

30 ns

-

-

11 DEDICATED INPUTS, 10 I/O

2.8956 mm

UV PLD

-

MACROCELL

-

-

11

-

-

11.43 mm

11.43 mm

-

YES

100

66 MHz

NXP SEMICONDUCTORS

-

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TFQFP,

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Transferred

-

-

3.6 V

3 V

3.3 V

-

-

-

-

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

-

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

14.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

14 mm

14 mm

-

YES

100

69 MHz

XILINX INC

-

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TFQFP,

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

-

3.63 V

2.97 V

3.3 V

-

-

-

128 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

100

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

14.5 ns

-

-

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

14 mm

14 mm

-

YES

84

-

XILINX INC

-

-

85 °C

-40 °C

CERAMIC

QCCJ

-

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

-

No

-

-

5 V

-

-

-

NO

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

-

S-XQCC-J84

-

Not Qualified

INDUSTRIAL

48 ns

-

-

-

-

UV PLD

-

-

72

NO

-

NO

-

-

-

-

YES

84

55 MHz

XILINX INC

1

42

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

WQCCJ, LDCC84,1.2SQ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER, WINDOW

Obsolete

QFJ

No

5.5 V

4.5 V

5 V

-

-

-

PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

84

S-CQCC-J84

-

Not Qualified

INDUSTRIAL

25 ns

-

-

12 DEDICATED INPUTS, 42 I/O

4.826 mm

UV PLD

-

MACROCELL

72

NO

12

NO

-

29.21 mm

29.21 mm

-

YES

44

105 MHz

XILINX INC

-

32

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Obsolete

LPCC

-

5.25 V

4.75 V

5 V

-

-

-

32 MACROCELLS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

44

S-PQCC-J44

-

Not Qualified

COMMERCIAL

8 ns

-

-

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

-

MACROCELL

-

-

2

-

-

16.5862 mm

16.5862 mm

-

NO

20

-

ADVANCED MICRO DEVICES INC

-

6

75 °C

-

CERAMIC, GLASS-SEALED

DIP

DIP, DIP20,.3

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

e0

-

TIN LEAD

-

8542.39.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

20

R-GDIP-T20

8

Not Qualified

COMMERCIAL EXTENDED

35 ns

PAL-TYPE

16

10 DEDICATED INPUTS, 6 I/O

-

OT PLD

-

COMBINATORIAL

-

-

10

-

64

-

-

-

NO

24

33.3 MHz

INTEL CORP

-

16

70 °C

-

CERAMIC, GLASS-SEALED

DIP

DIP, DIP24,.3

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

e0

-

TIN LEAD

PAL WITH MACROCELLS; 16 MACROCELLS; 2 EXTERNAL CLOCKS; ASYNCHRONOUS CLOCKS

8542.39.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

compliant

-

24

R-GDIP-T24

16

Not Qualified

COMMERCIAL

25 ns

PAL-TYPE

20

4 DEDICATED INPUTS, 16 I/O

5.72 mm

UV PLD

-

MACROCELL

-

-

4

-

160

32.07 mm

7.62 mm

-

YES

208

40 MHz

ALTERA CORP

-

160

70 °C

-

METAL

FQFP

FQFP, QFP208,1.2SQ,20

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Obsolete

QFP

No

5.25 V

4.75 V

5 V

e0

-

TIN LEAD

256 MACROCELLS; SHARED INPUT/CLOCK

8542.39.00.01

QUAD

GULL WING

220

0.5 mm

compliant

-

208

S-MQFP-G208

-

Not Qualified

COMMERCIAL

25 ns

-

-

0 DEDICATED INPUTS, 160 I/O

3.96 mm

OT PLD

-

MACROCELL

256

NO

-

NO

-

27.69 mm

27.69 mm

-

YES

84

-

XILINX INC

3

-

70 °C

-

PLASTIC/EPOXY

QCCJ

-

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

-

No

-

-

5 V

e0

-

TIN LEAD

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

-

S-PQCC-J84

-

Not Qualified

COMMERCIAL

48 ns

-

-

-

-

OT PLD

-

-

72

NO

-

NO

-

-

-

-

YES

100

-

XILINX INC

3

81

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

PLASTIC, TQFP-100

-

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

2.6 V

2.4 V

2.5 V

e0

-

TIN LEAD

-

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

compliant

-

100

S-PQFP-G100

-

Not Qualified

INDUSTRIAL

4 ns

-

-

0 DEDICATED INPUTS, 81 I/O

1.6 mm

FLASH PLD

-

REGISTERED

-

-

-

-

-

14 mm

14 mm

-

YES

56

90 MHz

XILINX INC

3

44

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

PLASTIC, CHIP SCALE, BGA-56

BGA56,10X10,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

No

3.6 V

2.7 V

3 V

e0

-

TIN LEAD

YES

8542.39.00.01

BOTTOM

BALL

240

0.5 mm

not_compliant

30

56

S-PBGA-B56

-

Not Qualified

INDUSTRIAL

10 ns

-

-

2 DEDICATED INPUTS, 44 I/O

1.35 mm

EE PLD

-

MACROCELL

64

YES

2

YES

-

6 mm

6 mm

-

YES

24

50 MHz

CYPRESS SEMICONDUCTOR CORP

-

10

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DFP

DFP, FL24,.4

FL24,.4

RECTANGULAR

FLATPACK

Obsolete

DFP

No

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

TIN LEAD

10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS

8542.39.00.01

DUAL

FLAT

-

1.27 mm

not_compliant

-

24

R-GDFP-F24

10

Not Qualified

MILITARY

15 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

2.286 mm

OT PLD

38535Q/M;38534H;883B

MACROCELL

-

-

11

-

132

15.367 mm

9.652 mm

-

-

-

-

E2V TECHNOLOGIES PLC

-

-

-

-

-

-

,

-

-

-

Active

-

-

-

-

-

-

-

-

-

8542.39.00.01

-

-

-

-

compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

44

77 MHz

NXP SEMICONDUCTORS

-

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

-

-

SQUARE

FLATPACK, THIN PROFILE

Obsolete

-

-

5.5 V

4.5 V

5 V

-

-

-

64 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.8 mm

unknown

-

-

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

12 ns

-

-

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

-

MACROCELL

-

-

2

-

-

10 mm

10 mm

-

NO

28

28.5 MHz

CYPRESS SEMICONDUCTOR CORP

-

12

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP, DIP28,.3

DIP28,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

TIN LEAD

SYNCHRONOUS STATE MACHINE; 12 I/O MACROCELLS; 3 EXTERNAL CLOCKS; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

not_compliant

-

28

R-GDIP-T28

12

Not Qualified

MILITARY

35 ns

PAL-TYPE

23

9 DEDICATED INPUTS, 12 I/O

5.08 mm

OT PLD

38535Q/M;38534H;883B

MACROCELL

-

-

9

-

256

37.0205 mm

7.62 mm