- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Packing Method | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Tiny WHSL | In Stock | - | Datasheet | YES | 208 | - | ADVANCED MICRO DEVICES INC | 3 | 168 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | - | Yes | - | - | 5 V | e3 | - | - | MATTE TIN | - | - | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | 30 | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
 P3Z22V10-DDH AMD Xilinx | In Stock | - | Datasheet | YES | 24 | 80 MHz | XILINX INC | - | - | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP24,.25 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | - | DUAL | GULL WING | - | 0.635 mm | unknown | - | - | R-PDSO-G24 | 10 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 22 | - | - | EE PLD | - | MACROCELL | - | - | - | - | 132 | - | - | ||
 P3Z22V10-DDH NXP Semiconductors | In Stock | - | Datasheet | YES | 24 | 83 MHz | NXP SEMICONDUCTORS | - | 10 | 70 °C | - | PLASTIC/EPOXY | TSSOP | 4.40 MM, PLASTIC, SOT-355-1, TSSOP-24 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | - | DUAL | GULL WING | - | 0.65 mm | unknown | - | 24 | R-PDSO-G24 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 1.1 mm | EE PLD | - | MACROCELL | - | - | 11 | - | - | 7.8 mm | 4.4 mm | ||
PZ3064DS10BP Philips Semiconductors | In Stock | - | Datasheet | YES | 100 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | - | TQFP100,.63SQ | SQUARE | FLATPACK | Transferred | - | No | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 11.5 ns | - | - | - | - | EE PLD | - | - | 64 | YES | - | YES | - | - | - | ||
PZ3064DS10BP AMD Xilinx | In Stock | - | Datasheet | YES | 100 | - | XILINX INC | 3 | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Obsolete | - | No | - | - | - | - | - | - | - | YES | 8542.39.00.01 | - | QUAD | GULL WING | 240 | 0.5 mm | unknown | 30 | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 11.5 ns | - | - | - | - | EE PLD | - | - | 64 | YES | - | YES | - | - | - | ||
PZ5032-10BC-S AMD Xilinx | In Stock | - | Datasheet | YES | 44 | 59 MHz | XILINX INC | 3 | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | TRAY | QUAD | GULL WING | 240 | 0.8 mm | unknown | 30 | 44 | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | - | MACROCELL | 32 | NO | 2 | NO | - | 10 mm | 10 mm | ||
PZ5032-10BC-S Philips Semiconductors | In Stock | - | Datasheet | YES | 44 | - | PHILIPS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | SQUARE | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | NO | 8542.39.00.01 | TRAY | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | - | - | EE PLD | - | - | 32 | NO | - | NO | - | - | - | ||
XC7336-15WC44M AMD Xilinx | In Stock | - | Datasheet | YES | 44 | 41.67 MHz | XILINX INC | - | 32 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | LCC | - | 5.5 V | 4.5 V | 5 V | - | - | 3A001.A.2.C | - | CONFIGURABLE 3.3V OR 5V I/O OPERATION; 18 OUTPUT MACROCELLS | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-CQCC-J44 | - | Not Qualified | MILITARY | 23 ns | - | - | 0 DEDICATED INPUTS, 32 I/O | 4.826 mm | UV PLD | - | MACROCELL | - | - | - | - | - | 16.51 mm | 16.51 mm | ||
PZ3032CS10A44-T AMD Xilinx | In Stock | - | Datasheet | YES | 44 | 57 MHz | XILINX INC | - | 32 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LPCC | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 13 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
 PAL16R6AMJ/883B Rochester Electronics LLC | In Stock | - | Datasheet | NO | 20 | 20 MHz | ROCHESTER ELECTRONICS LLC | - | 2 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | CERAMIC, DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | DIP | No | 5.5 V | 4.5 V | 5 V | - | No | 3A001.A.2.C | - | PAL; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | unknown | NOT SPECIFIED | 20 | R-CDIP-T20 | - | Not Qualified | MILITARY | 30 ns | - | - | 8 DEDICATED INPUTS, 2 I/O | 5.08 mm | OT PLD | - | MIXED | - | - | 8 | - | - | 24.257 mm | 7.62 mm | ||
| Tiny WHSL | In Stock | - | Datasheet | NO | 20 | 20 MHz | ADVANCED MICRO DEVICES INC | - | 2 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | CERAMIC, DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | PAL; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-CDIP-T20 | 6 | Not Qualified | MILITARY | 30 ns | PAL-TYPE | 10 | 8 DEDICATED INPUTS, 2 I/O | 5.08 mm | OT PLD | 38535Q/M;38534H;883B | MIXED | - | - | 8 | - | 64 | 24.257 mm | 7.62 mm | ||
 PZ3064-12BB1-T AMD Xilinx | 471 | - | Datasheet | YES | 100 | 67 MHz | XILINX INC | - | 64 | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 64 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.65 mm | unknown | - | 100 | R-PQFP-G100 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 64 I/O | 3.4 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
PZ3032CS8BC-S NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 91 MHz | NXP SEMICONDUCTORS | - | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Transferred | - | - | 3.63 V | 3 V | 3.3 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
 XA9572XL-10VQG64Q AMD Xilinx | 722 | - | Datasheet | YES | 64 | - | XILINX INC | 3 | 52 | 125 °C | -40 °C | PLASTIC/EPOXY | TFQFP | VQFP-64 | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | QFP | Yes | 3.6 V | 3 V | 3.3 V | e3 | Yes | - | MATTE TIN | YES | 8542.39.00.01 | - | QUAD | GULL WING | 260 | 0.5 mm | compliant | 30 | 64 | S-PQFP-G64 | - | Not Qualified | AUTOMOTIVE | 10 ns | - | - | 0 DEDICATED INPUTS, 52 I/O | 1.2 mm | FLASH PLD | AEC-Q100 | MACROCELL | 72 | YES | - | YES | - | 10 mm | 10 mm | ||
| Tiny WHSL | 604 | - | Datasheet | NO | 20 | - | ADVANCED MICRO DEVICES INC | - | - | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | - | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-CDIP-T20 | 4 | Not Qualified | MILITARY | 45 ns | PAL-TYPE | 18 | 18 DEDICATED INPUTS, 0 I/O | 4.318 mm | OT PLD | 38535Q/M;38534H;883B | COMBINATORIAL | - | - | 18 | - | 20 | 25.908 mm | 7.62 mm | ||
 PZ5128CS12BE-T AMD Xilinx | 103 | - | Datasheet | YES | 128 | 63 MHz | XILINX INC | - | 96 | 70 °C | - | PLASTIC/EPOXY | LFQFP | LFQFP, | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | 128 | R-PQFP-G128 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 96 I/O | 1.6 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
PZ5064CS10BC NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 80 MHz | NXP SEMICONDUCTORS | - | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | - | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 64 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
 XC7272A-16PG84C AMD Xilinx | 210 | - | Datasheet | NO | 84 | 55 MHz | XILINX INC | - | 42 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | WPGA | WPGA, PGA84M,11X11 | PGA84M,11X11 | SQUARE | GRID ARRAY, WINDOW | Obsolete | PGA | Yes | 5.25 V | 4.75 V | 5 V | - | - | - | - | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | 8542.39.00.01 | - | PERPENDICULAR | PIN/PEG | - | 2.54 mm | unknown | - | 84 | S-CPGA-P84 | - | Not Qualified | COMMERCIAL | 25 ns | - | - | 12 DEDICATED INPUTS, 42 I/O | 5.207 mm | UV PLD | - | MACROCELL | 72 | NO | 12 | NO | - | 27.94 mm | 27.94 mm | ||
| Tiny WHSL | 651 | - | Datasheet | YES | 304 | - | ADVANCED MICRO DEVICES INC | - | 192 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-304 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | - | - | - | - | 5 V | e3 | - | - | MATTE TIN | - | - | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G304 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 192 I/O | 4.5 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 40 mm | 40 mm | ||
PZ3032AS10A44 NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 59 MHz | NXP SEMICONDUCTORS | - | 32 | 70 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, SOT-187-2, LCC-44 | - | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm |