- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 EP600JI Altera Corporation | In Stock | - | Datasheet | YES | 28 | 22.2 MHz | ALTERA CORP | - | 16 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QLCC | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | 16 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | 220 | 1.27 mm | compliant | - | 28 | S-CQCC-J28 | 16 | Not Qualified | INDUSTRIAL | 55 ns | PAL-TYPE | 20 | 4 DEDICATED INPUTS, 16 I/O | 4.57 mm | UV PLD | MACROCELL | - | - | 4 | - | 160 | 11.43 mm | 11.43 mm | ||
DMPAL10H8NC National Semiconductor Corporation | In Stock | - | Datasheet | NO | 20 | - | NATIONAL SEMICONDUCTOR CORP | - | - | 70 °C | - | PLASTIC | DIP | DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | compliant | - | - | R-PDIP-T20 | 8 | Not Qualified | COMMERCIAL | 40 ns | PAL-TYPE | 10 | - | - | OT PLD | COMBINATORIAL | - | - | - | - | 16 | - | - | ||
 PZ3064I15A68 NXP Semiconductors | In Stock | - | Datasheet | YES | 68 | 58 MHz | NXP SEMICONDUCTORS | - | 48 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PEDESTAL, PLASTIC, SOT-188-3, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 68 | S-PQCC-J68 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | 2 DEDICATED INPUTS, 48 I/O | 4.57 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 24.2316 mm | 24.2316 mm | ||
 XCR3032-12VQ44I AMD Xilinx | 764 | - | Datasheet | YES | 44 | 47 MHz | XILINX INC | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | 44 | S-PQFP-G44 | - | Not Qualified | INDUSTRIAL | 15 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
XC9572-15PC44C.I AMD Xilinx | In Stock | - | Datasheet | YES | 44 | - | XILINX INC | 3 | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | QUAD | J BEND | - | - | compliant | - | - | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 15 ns | - | - | 0 DEDICATED INPUTS | - | FLASH PLD | MACROCELL | - | - | - | - | - | - | - | ||
 XC95108F-10PCG84C AMD Xilinx | 870 | - | Datasheet | YES | 84 | 67 MHz | XILINX INC | 3 | 69 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 5.25 V | 4.75 V | 5 V | e3 | - | - | MATTE TIN | - | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | compliant | 30 | 84 | S-PQCC-J84 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 0 DEDICATED INPUTS, 69 I/O | 5.08 mm | FLASH PLD | MACROCELL | - | - | - | - | - | 29.3116 mm | 29.3116 mm | ||
 XH95144-7PQ100C AMD Xilinx | 485 | - | Datasheet | YES | 100 | 111.1 MHz | XILINX INC | 3 | 81 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Transferred | QFP | No | - | - | 5 V | e0 | No | - | TIN LEAD | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | compliant | - | 100 | R-PQFP-G100 | 81 | Not Qualified | - | 7.5 ns | - | 81 | 0 DEDICATED INPUTS, 81 I/O | 2.87 mm | MASK PLD | MACROCELL | - | - | - | - | - | 20 mm | 14 mm | ||
PALCE16V8Q-25 Lattice Semiconductor Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 P3Z22V10-BDH-T AMD Xilinx | 738 | - | Datasheet | YES | 24 | 69 MHz | XILINX INC | - | 10 | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET | 8542.39.00.01 | DUAL | GULL WING | - | 0.65 mm | unknown | - | 24 | R-PDSO-G24 | - | Not Qualified | COMMERCIAL | 15 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 1.1 mm | EE PLD | MACROCELL | - | - | 11 | - | - | 7.8 mm | 4.4 mm | ||
 XC95288-10BGG352C AMD Xilinx | 896 | - | Datasheet | YES | 352 | 67 MHz | XILINX INC | 3 | 192 | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | Yes | 5.25 V | 4.75 V | 5 V | e1 | Yes | - | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 30 | 352 | S-PBGA-B352 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 0 DEDICATED INPUTS, 192 I/O | 1.7 mm | FLASH PLD | MACROCELL | - | - | - | - | - | 35 mm | 35 mm | ||
 PAL20R8-10PC AMD | 68 | - | Datasheet | NO | 24 | 55.5 MHz | ADVANCED MICRO DEVICES INC | - | - | 75 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | POWER-UP RESET | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 24 | R-PDIP-T24 | 8 | Not Qualified | COMMERCIAL EXTENDED | 10 ns | PAL-TYPE | 12 | 12 DEDICATED INPUTS, 0 I/O | 5.08 mm | OT PLD | REGISTERED | - | - | 12 | - | 64 | 30.734 mm | 7.62 mm | ||
PEEL18CV8PI-25 Diodes Incorporated | In Stock | - | Datasheet | NO | 20 | 28.5 MHz | DIODES INC | - | 8 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-PDIP-T20 | 8 | Not Qualified | INDUSTRIAL | 25 ns | PAL-TYPE | 18 | 9 DEDICATED INPUTS, 8 I/O | - | EE PLD | MACROCELL | - | - | 9 | - | 74 | 26.162 mm | 7.62 mm | ||
PZ3064-12BC NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 67 MHz | NXP SEMICONDUCTORS | - | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | 10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44 | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | 44 | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
PZ3064-12BC Philips Semiconductors | In Stock | - | Datasheet | YES | 44 | - | PHILIPS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | SQUARE | FLATPACK | Transferred | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | NO | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | - | - | EE PLD | - | 64 | NO | - | NO | - | - | - | ||
PZ3032I12BC AMD Xilinx | In Stock | - | Datasheet | YES | 44 | - | XILINX INC | 3 | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | SQUARE | FLATPACK | Obsolete | - | No | - | - | 3.3 V | - | - | - | - | NO | 8542.39.00.01 | QUAD | GULL WING | 240 | 0.8 mm | unknown | 30 | - | S-PQFP-G44 | - | Not Qualified | INDUSTRIAL | 15 ns | - | - | - | - | EE PLD | - | 32 | NO | - | NO | - | - | - | ||
EPM2210GF256I4 Altera Corporation | In Stock | - | Datasheet | YES | 256 | - | ALTERA CORP | 3 | - | - | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Transferred | - | No | - | - | - | e0 | No | - | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | - | 9.1 ns | - | - | - | - | FLASH PLD | - | 1700 | YES | - | YES | - | - | - | ||
EPM2210GF256I4 Intel Corporation | In Stock | - | Datasheet | YES | 256 | - | INTEL CORP | 3 | 204 | 100 °C | -40 °C | PLASTIC | BGA | - | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | No | 1.89 V | 1.71 V | 1.8 V | e0 | - | 3A991.D | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B256 | 204 | Not Qualified | - | 9.1 ns | - | 204 | 0 DEDICATED INPUTS, 204 I/O | - | FLASH PLD | MACROCELL | 1700 | YES | - | YES | - | 17 mm | 17 mm | ||
PZ3064DS10A44 NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 90 MHz | NXP SEMICONDUCTORS | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | - | - | SQUARE | CHIP CARRIER | Obsolete | - | - | 3.6 V | 2.7 V | - | - | - | - | - | - | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 11.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
PZ3064DS10A44 Philips Semiconductors | In Stock | - | Datasheet | YES | 44 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Transferred | - | No | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 11.5 ns | - | - | - | - | EE PLD | - | 64 | YES | - | YES | - | - | - | ||
PZ5032I10A44-T NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 59 MHz | NXP SEMICONDUCTORS | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Transferred | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 15 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm |