-

YES

100

-

PHILIPS SEMICONDUCTORS

-

-

70 °C

-

PLASTIC/EPOXY

QFP

QFP, QFP100,.7X.9

QFP100,.7X.9

RECTANGULAR

FLATPACK

Transferred

-

No

-

-

5 V

e0

-

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

GULL WING

-

0.635 mm

unknown

-

-

R-PQFP-G100

-

Not Qualified

COMMERCIAL

9.5 ns

-

-

-

-

EE PLD

-

64

NO

-

NO

-

-

-

-

YES

68

66.7 MHz

ALTERA CORP

-

52

70 °C

-

CERAMIC, METAL-SEALED COFIRED

WQCCJ

WQCCJ, LDCC68,1.0SQ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER, WINDOW

Obsolete

LCC

No

5.25 V

4.75 V

5 V

e0

-

TIN LEAD

LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

QUAD

J BEND

220

1.27 mm

unknown

-

68

S-CQCC-J68

-

Not Qualified

COMMERCIAL

33 ns

-

-

7 DEDICATED INPUTS, 52 I/O

5.08 mm

UV PLD

MACROCELL

128

NO

7

NO

-

24.13 mm

24.13 mm

-

YES

84

80 MHz

NXP SEMICONDUCTORS

-

64

70 °C

-

PLASTIC/EPOXY

QCCJ

PEDESTAL, PLASTIC, SOT-189-3, LCC-84

-

SQUARE

CHIP CARRIER

Obsolete

LCC

-

3.63 V

2.97 V

3.3 V

-

-

-

-

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

84

S-PQCC-J84

-

Not Qualified

COMMERCIAL

12.5 ns

-

-

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

-

-

2

-

-

29.3116 mm

29.3116 mm

-

NO

24

74 MHz

NXP SEMICONDUCTORS

-

2

75 °C

-

PLASTIC/EPOXY

DIP

DIP,

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

-

-

5.25 V

4.75 V

5 V

-

-

-

POWER-UP RESET

8542.39.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

-

R-PDIP-T24

-

Not Qualified

COMMERCIAL EXTENDED

10 ns

-

-

12 DEDICATED INPUTS, 2 I/O

4.7 mm

OT PLD

MIXED

-

-

12

-

-

31.7 mm

7.62 mm

-

NO

20

41.6 MHz

VANTIS CORP

-

8

85 °C

-40 °C

PLASTIC/EPOXY

DIP

PLASTIC, DIP-20

DIP20,.3

RECTANGULAR

IN-LINE

Transferred

-

No

-

-

5 V

e0

-

Tin/Lead (Sn/Pb)

-

-

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

-

R-PDIP-T20

8

Not Qualified

INDUSTRIAL

25 ns

PAL-TYPE

18

10 DEDICATED INPUTS, 8 I/O

-

EE PLD

MACROCELL

-

-

10

-

64

-

-

-

NO

24

50 MHz

ADVANCED MICRO DEVICES INC

-

10

75 °C

-

PLASTIC/EPOXY

DIP

DIP, DIP24,.3

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

e0

-

TIN LEAD

10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

24

R-PDIP-T24

10

Not Qualified

COMMERCIAL EXTENDED

15 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

5.08 mm

EE PLD

MACROCELL

-

-

11

-

132

30.734 mm

7.62 mm

-

YES

304

-

ADVANCED MICRO DEVICES INC

-

232

-

-

PLASTIC/EPOXY

HFQFP

HEAT SINK, QFP-304

-

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Obsolete

-

-

-

-

5 V

e3

-

MATTE TIN

-

-

QUAD

GULL WING

-

0.5 mm

unknown

-

-

S-PQFP-G304

-

Not Qualified

-

-

-

-

0 DEDICATED INPUTS, 232 I/O

4.5 mm

MASK PLD

MACROCELL

-

-

-

-

-

40 mm

40 mm

-

YES

84

67 MHz

XILINX INC

3

69

70 °C

-

PLASTIC/EPOXY

QCCJ

PLASTIC, LCC-84

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5.25 V

4.75 V

5 V

e0

-

Tin/Lead (Sn85Pb15)

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

84

S-PQCC-J84

-

Not Qualified

COMMERCIAL

10 ns

-

-

0 DEDICATED INPUTS, 69 I/O

5.08 mm

FLASH PLD

MACROCELL

72

YES

-

NO

-

29.3116 mm

29.3116 mm

-

NO

24

37 MHz

ADVANCED MICRO DEVICES INC

-

8

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP, DIP24,.3

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.5 V

4.5 V

5 V

e0

-

TIN LEAD

PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

-

2.54 mm

unknown

-

24

R-PDIP-T24

8

Not Qualified

INDUSTRIAL

25 ns

PAL-TYPE

20

12 DEDICATED INPUTS, 8 I/O

5.08 mm

EE PLD

MACROCELL

-

-

12

-

64

30.734 mm

7.62 mm

-

YES

144

125 MHz

XILINX INC

3

117

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

CSP-144

BGA144,13X13,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

2.62 V

2.37 V

2.5 V

e1

-

TIN SILVER COPPER

YES

8542.39.00.01

BOTTOM

BALL

260

0.8 mm

unknown

30

144

S-PBGA-B144

-

Not Qualified

INDUSTRIAL

7.5 ns

-

-

0 DEDICATED INPUTS, 117 I/O

1.2 mm

FLASH PLD

MACROCELL

144

YES

-

YES

-

12 mm

12 mm

-

YES

100

-

ALTERA CORP

-

-

-

-

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Transferred

BGA

Yes

2.625 V

2.375 V

2.5 V

e1

Yes

TIN SILVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

BOTTOM

BALL

-

-

compliant

-

100

S-PBGA-B100

-

Not Qualified

-

-

-

-

0 DEDICATED INPUTS, 0 I/O

-

FLASH PLD

MACROCELL

-

-

-

-

-

-

-

-

YES

44

-

XILINX INC

3

34

70 °C

-

PLASTIC/EPOXY

QCCJ

PLASTIC, LCC-44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

2.62 V

2.37 V

2.5 V

e0

-

Tin/Lead (Sn85Pb15)

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

44

S-PQCC-J44

-

Not Qualified

COMMERCIAL

4 ns

-

-

0 DEDICATED INPUTS, 34 I/O

4.57 mm

FLASH PLD

MACROCELL

36

YES

-

YES

-

16.5862 mm

16.5862 mm

-

YES

84

105 MHz

XILINX INC

-

64

70 °C

-

PLASTIC/EPOXY

QCCJ

QCCJ,

-

SQUARE

CHIP CARRIER

Obsolete

LCC

-

5.25 V

4.75 V

5 V

-

-

-

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

-

1.27 mm

unknown

-

84

S-PQCC-J84

-

Not Qualified

COMMERCIAL

9.5 ns

-

-

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

-

-

2

-

-

29.3116 mm

29.3116 mm

-

YES

44

91 MHz

NXP SEMICONDUCTORS

-

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

TQFP,

-

SQUARE

FLATPACK, THIN PROFILE

Transferred

-

-

3.63 V

2.97 V

3.3 V

-

-

-

32 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.8 mm

unknown

-

-

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

9.5 ns

-

-

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

-

-

2

-

-

10 mm

10 mm

-

YES

44

91 MHz

XILINX INC

-

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

TQFP,

-

SQUARE

FLATPACK, THIN PROFILE

Obsolete

QFP

-

3.63 V

2.97 V

3.3 V

-

-

-

32 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.8 mm

unknown

-

44

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

9.5 ns

-

-

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

-

-

2

-

-

10 mm

10 mm

-

YES

44

-

XILINX INC

3

-

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK

Obsolete

-

No

-

-

5 V

-

-

-

NO

8542.39.00.01

QUAD

GULL WING

240

0.8 mm

unknown

30

-

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

9.5 ns

-

-

-

-

EE PLD

-

32

NO

-

NO

-

-

-

-

YES

44

91 MHz

NXP SEMICONDUCTORS

-

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44

-

SQUARE

FLATPACK, THIN PROFILE

Obsolete

QFP

-

5.5 V

4.5 V

5 V

-

-

-

-

8542.39.00.01

QUAD

GULL WING

-

0.8 mm

unknown

-

44

S-PQFP-G44

-

Not Qualified

INDUSTRIAL

12 ns

-

-

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

-

-

2

-

-

10 mm

10 mm

-

NO

84

62.5 MHz

INTEL CORP

-

64

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

WINDOWED, CERAMIC, PGA-84

-

SQUARE

GRID ARRAY

Active

-

No

5.5 V

4.5 V

5 V

e0

-

TIN LEAD

-

8542.39.00.01

PERPENDICULAR

PIN/PEG

-

-

compliant

-

-

S-CPGA-P84

-

Not Qualified

INDUSTRIAL

25 ns

PAL-TYPE

-

7 DEDICATED INPUTS, 64 I/O

-

UV PLD

MACROCELL

192

-

7

-

-

-

-

-

YES

160

71 MHz

XILINX INC

-

96

70 °C

-

PLASTIC/EPOXY

QFP

QFP,

QFP160,1.2SQ

SQUARE

FLATPACK

Obsolete

QFP

-

5.25 V

4.75 V

5 V

-

-

-

128 MACROCELLS

8542.39.00.01

QUAD

GULL WING

-

0.65 mm

unknown

-

160

S-PQFP-G160

-

Not Qualified

COMMERCIAL

12 ns

-

-

2 DEDICATED INPUTS, 96 I/O

4.07 mm

EE PLD

MACROCELL

-

-

2

-

-

28 mm

28 mm

-

YES

128

-

PHILIPS SEMICONDUCTORS

-

-

70 °C

-

PLASTIC/EPOXY

QFP

-

QFP128,.63X.87,20

RECTANGULAR

FLATPACK

Transferred

-

No

-

-

5 V

e0

-

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

GULL WING

-

0.5 mm

unknown

-

-

R-PQFP-G128

-

Not Qualified

COMMERCIAL

14.5 ns

-

-

-

-

EE PLD

-

128

YES

-

YES

-

-

-