- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 PALCE610H-15PC Lattice Semiconductor Corporation | In Stock | - | Datasheet | NO | 24 | 50 MHz | LATTICE SEMICONDUCTOR CORP | - | 16 | 75 °C | - | PLASTIC/EPOXY | DIP | 0.300 INCH, SKINNY, PLASTIC, DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | Tin/Lead (Sn85Pb15) | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | not_compliant | - | 24 | R-PDIP-T24 | 16 | Not Qualified | COMMERCIAL EXTENDED | 15 ns | PAL-TYPE | 20 | 4 DEDICATED INPUTS, 16 I/O | 5.08 mm | EE PLD | - | MACROCELL | - | - | 4 | - | 160 | 30.734 mm | 7.62 mm | ||
 EP900LI-3 Altera Corporation | In Stock | - | Datasheet | YES | 44 | 23.8 MHz | ALTERA CORP | - | 24 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | 24 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 50 ns | - | - | 12 DEDICATED INPUTS, 24 I/O | - | OT PLD | - | MACROCELL | - | - | 12 | - | - | 16.6116 mm | 16.6116 mm | ||
| Tiny WHSL | 572 | - | Datasheet | NO | 24 | 50 MHz | ADVANCED MICRO DEVICES INC | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 24 | R-CDIP-T24 | 10 | Not Qualified | MILITARY | 15 ns | PAL-TYPE | 22 | 11 DEDICATED INPUTS, 10 I/O | 5.08 mm | OT PLD | 38535Q/M;38534H;883B | MACROCELL | - | - | 11 | - | 132 | 31.9405 mm | 7.62 mm | ||
 PAL22V10-12/BLA Rochester Electronics LLC | In Stock | - | Datasheet | NO | 24 | 50 MHz | ROCHESTER ELECTRONICS LLC | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Active | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 24 | R-CDIP-T24 | - | Not Qualified | MILITARY | 15 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 5.08 mm | OT PLD | - | MACROCELL | - | - | 11 | - | - | 31.9405 mm | 7.62 mm | ||
PZ5032I10A44-T NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 59 MHz | NXP SEMICONDUCTORS | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Transferred | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 15 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
M425R4GA3BB0-CQKOL Samsung Electronics Co. Ltd | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
PZ5064I12BB1-S NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 67 MHz | NXP SEMICONDUCTORS | - | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Transferred | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | unknown | - | - | R-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 64 I/O | 3.4 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
 P85C220-10 Intel Corporation | In Stock | - | Datasheet | NO | 20 | 58.8 MHz | INTEL CORP | - | 8 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | compliant | - | 20 | R-PDIP-T20 | 8 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 18 | 9 DEDICATED INPUTS, 8 I/O | 5.08 mm | OT PLD | - | MACROCELL | - | - | 9 | - | 72 | 25.55 mm | 7.62 mm | ||
GAL22V10-15LPI Lattice Semiconductor Corporation | In Stock | - | Datasheet | NO | 24 | 50 MHz | LATTICE SEMICONDUCTOR CORP | - | 10 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | SKINNY, PLASTIC, DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | not_compliant | - | 24 | R-PDIP-T24 | 10 | Not Qualified | INDUSTRIAL | 15 ns | PAL-TYPE | 22 | 11 DEDICATED INPUTS, 10 I/O | 5.08 mm | EE PLD | - | MACROCELL | - | - | 11 | - | 132 | 31.75 mm | 7.62 mm | ||
PLUS153DN Philips Semiconductors | In Stock | - | Datasheet | NO | 20 | - | PHILIPS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T20 | 10 | Not Qualified | COMMERCIAL | 12 ns | PLA-TYPE | 18 | - | - | OT PLD | - | - | - | - | - | - | 42 | - | - | ||
PLUS153DN YAGEO Corporation | In Stock | - | Datasheet | NO | 20 | - | PHILIPS COMPONENTS | - | 10 | 75 °C | - | PLASTIC/EPOXY | - | , | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | - | unknown | - | - | R-PDIP-T20 | - | Not Qualified | COMMERCIAL EXTENDED | 12 ns | - | - | 8 DEDICATED INPUTS, 10 I/O | - | OT PLD | - | COMBINATORIAL | - | - | 8 | - | - | - | - | ||
XC95288XV-10CSG280C AMD Xilinx | In Stock | - | Datasheet | YES | 280 | 100 MHz | XILINX INC | 3 | 192 | 70 °C | - | PLASTIC/EPOXY | TFBGA | CSP-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 2.62 V | 2.37 V | 2.5 V | e1 | - | - | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8 mm | unknown | 30 | 280 | S-PBGA-B280 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 0 DEDICATED INPUTS, 192 I/O | 1.2 mm | FLASH PLD | - | MACROCELL | 288 | YES | - | YES | - | 16 mm | 16 mm | ||
PZ3064I15BC-T NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 58 MHz | NXP SEMICONDUCTORS | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Transferred | - | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
PZ5032CS6A44-T AMD Xilinx | In Stock | - | - | YES | 44 | 111 MHz | XILINX INC | - | 32 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LPCC | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 8 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
PZ3128IS12A84 Philips Semiconductors | In Stock | - | Datasheet | YES | 84 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | - | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Transferred | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J84 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | - | - | EE PLD | - | - | 128 | YES | - | YES | - | - | - | ||
PZ3128IS12A84 AMD Xilinx | In Stock | - | Datasheet | YES | 84 | - | XILINX INC | 3 | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | - | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 3.3 V | e0 | - | - | TIN LEAD | YES | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | 30 | - | S-PQCC-J84 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | - | - | EE PLD | - | - | 128 | YES | - | YES | - | - | - | ||
 XC95576-12HQ304 AMD Xilinx | 468 | - | Datasheet | YES | 304 | 100 MHz | XILINX INC | 3 | 232 | - | - | PLASTIC/EPOXY | HFQFP | HFQFP, | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | No | - | - | 5 V | e0 | - | 3A991.D | TIN LEAD | 3.3 OR 5V I/O CAPABILITY | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | 304 | S-PQFP-G304 | - | Not Qualified | - | - | - | - | 232 I/O | 4.5 mm | FLASH PLD | - | MACROCELL | - | - | - | - | - | 40 mm | 40 mm | ||
 XC9536XV-5CSG48I AMD Xilinx | 418 | - | Datasheet | YES | 48 | - | XILINX INC | 3 | 36 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | - | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | BGA | Yes | 2.6 V | 2.4 V | 2.5 V | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | NOT SPECIFIED | 48 | S-PBGA-B48 | - | Not Qualified | INDUSTRIAL | 3.5 ns | - | - | 0 DEDICATED INPUTS, 36 I/O | 1.8 mm | FLASH PLD | - | REGISTERED | - | - | - | - | - | 7 mm | 7 mm | ||
 PZ5064-7A68-T AMD Xilinx | 686 | - | Datasheet | YES | 68 | 105 MHz | XILINX INC | - | 48 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 64 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 68 | S-PQCC-J68 | - | Not Qualified | COMMERCIAL | 9.5 ns | - | - | 2 DEDICATED INPUTS, 48 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 24.2316 mm | 24.2316 mm | ||
 ATV750-20KC Atmel Corporation | In Stock | - | Datasheet | YES | 28 | 55 MHz | ATMEL CORP | 2 | 10 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QFJ | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | 10 MACROCELLS; VARIABLE PRODUCT TERMS | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | - | 28 | S-CQCC-J28 | - | Not Qualified | COMMERCIAL | 20 ns | - | - | 12 DEDICATED INPUTS, 10 I/O | 4.57 mm | UV PLD | - | MACROCELL | 10 | NO | 12 | NO | - | 11.5062 mm | 11.5062 mm |