- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
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![]() XC2C64-4PCG44C AMD Xilinx | 363 | - | Datasheet | YES | 44 | 213 MHz | XILINX INC | 3 | 33 | 70 °C | - | PLASTIC/EPOXY | QCCJ | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | - | SQUARE | CHIP CARRIER | Transferred | LCC | Yes | 1.9 V | 1.7 V | 1.8 V | e3 | Yes | - | MATTE TIN | FAST ZERO POWER DESIGN TECHNOLOGY | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | compliant | 30 | 44 | S-PQCC-J44 | 33 | Not Qualified | COMMERCIAL | 4 ns | PLA-TYPE | 33 | 0 DEDICATED INPUTS, 33 I/O | 4.57 mm | FLASH PLD | - | MACROCELL | 64 | - | - | - | - | 16.5862 mm | 16.5862 mm | ||
![]() PAL16L8DCJ AMD | 330 | - | Datasheet | NO | 20 | - | ADVANCED MICRO DEVICES INC | - | 6 | 75 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | PAL | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-GDIP-T20 | 8 | Not Qualified | COMMERCIAL EXTENDED | 10 ns | PAL-TYPE | 16 | 10 DEDICATED INPUTS, 6 I/O | 5.08 mm | OT PLD | - | COMBINATORIAL | - | - | 10 | - | 64 | 24.257 mm | 7.62 mm | ||
![]() PAL20R8-10JC AMD | 864 | - | Datasheet | YES | 28 | 55.5 MHz | ADVANCED MICRO DEVICES INC | - | - | 75 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | POWER-UP RESET | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 28 | S-PQCC-J28 | 8 | Not Qualified | COMMERCIAL EXTENDED | 10 ns | PAL-TYPE | 12 | 12 DEDICATED INPUTS, 0 I/O | 4.57 mm | OT PLD | - | REGISTERED | - | - | 12 | - | 64 | 11.5062 mm | 11.5062 mm | ||
![]() 82S100F Fairchild Semiconductor Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 100 | 83.3 MHz | ADVANCED MICRO DEVICES INC | 3 | 81 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Obsolete | - | Yes | - | - | 5 V | e3 | - | - | MATTE TIN | - | - | QUAD | GULL WING | 245 | 0.65 mm | compliant | 30 | - | R-PQFP-G100 | 81 | Not Qualified | - | 10 ns | - | 81 | 0 DEDICATED INPUTS, 81 I/O | 2.87 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 20 mm | 14 mm | ||
![]() XH95144-10PQG100I AMD Xilinx | In Stock | - | Datasheet | YES | 100 | 83.3 MHz | XILINX INC | 3 | 81 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Transferred | QFP | Yes | - | - | 5 V | e3 | Yes | - | MATTE TIN | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | compliant | - | 100 | R-PQFP-G100 | 81 | Not Qualified | - | 10 ns | - | 81 | 0 DEDICATED INPUTS, 81 I/O | 2.87 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 20 mm | 14 mm | ||
![]() EPM570GT100I3N Intel Corporation | In Stock | - | Datasheet | YES | 100 | 175.4 MHz | INTEL CORP | 3 | 76 | 100 °C | -40 °C | PLASTIC/EPOXY | TFQFP | 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100 | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | - | Yes | 1.89 V | 1.71 V | 1.8 V | e3 | - | - | MATTE TIN | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | - | S-PQFP-G100 | 76 | Not Qualified | - | 5.4 ns | - | 76 | 0 DEDICATED INPUTS, 76 I/O | 1.2 mm | FLASH PLD | - | MACROCELL | 440 | YES | - | YES | - | 14 mm | 14 mm | ||
![]() XC95288XL-6BG352C AMD Xilinx | 423 | - | Datasheet | YES | 352 | 151.5 MHz | XILINX INC | 3 | 192 | 70 °C | - | PLASTIC/EPOXY | LBGA | PLASTIC, BGA-352 | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.6 V | 3 V | 3.3 V | e0 | - | - | Tin/Lead (Sn63Pb37) | 288 MACROCELLS | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 30 | 352 | S-PBGA-B352 | - | Not Qualified | COMMERCIAL | 6 ns | - | - | 0 DEDICATED INPUTS, 192 I/O | 1.7 mm | FLASH PLD | - | MACROCELL | 288 | YES | - | YES | - | 35 mm | 35 mm | ||
![]() PZ5128-S7BP-T NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 87 MHz | NXP SEMICONDUCTORS | - | 80 | 70 °C | - | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() 5962-87539023A Teledyne e2v | In Stock | - | - | YES | 28 | 25 MHz | TELEDYNE E2V (UK) LTD | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | - | LCC28,.45SQ | SQUARE | CHIP CARRIER, WINDOW | Active | - | - | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 8542.39.00.01 | QUAD | NO LEAD | - | 1.27 mm | compliant | - | - | S-CQCC-N28 | 10 | Qualified | MILITARY | 30 ns | PAL-TYPE | 22 | 11 DEDICATED INPUTS, 10 I/O | 2.8956 mm | UV PLD | 38535Q/M;38534H;883B | MACROCELL | - | - | 11 | - | 132 | 11.43 mm | 11.43 mm | ||
![]() 5962-87539023A Cypress Semiconductor | In Stock | - | Datasheet | YES | 28 | 25 MHz | CYPRESS SEMICONDUCTOR CORP | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | WQCCN, | - | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QLCC | - | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 8542.39.00.01 | QUAD | NO LEAD | - | 1.27 mm | unknown | - | 28 | S-CQCC-N28 | - | Not Qualified | MILITARY | 30 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 2.8956 mm | UV PLD | - | MACROCELL | - | - | 11 | - | - | 11.43 mm | 11.43 mm | ||
![]() PZ3128IS12BP-T NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 66 MHz | NXP SEMICONDUCTORS | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() PZ3128IS12BP-T AMD Xilinx | 929 | - | Datasheet | YES | 100 | 69 MHz | XILINX INC | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() XC7272-30WC84I AMD Xilinx | In Stock | - | Datasheet | YES | 84 | - | XILINX INC | - | - | 85 °C | -40 °C | CERAMIC | QCCJ | - | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | - | - | - | - | NO | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-XQCC-J84 | - | Not Qualified | INDUSTRIAL | 48 ns | - | - | - | - | UV PLD | - | - | 72 | NO | - | NO | - | - | - | ||
![]() XC7272A-16WC84I AMD Xilinx | 473 | - | Datasheet | YES | 84 | 55 MHz | XILINX INC | 1 | 42 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QFJ | No | 5.5 V | 4.5 V | 5 V | - | - | - | - | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 84 | S-CQCC-J84 | - | Not Qualified | INDUSTRIAL | 25 ns | - | - | 12 DEDICATED INPUTS, 42 I/O | 4.826 mm | UV PLD | - | MACROCELL | 72 | NO | 12 | NO | - | 29.21 mm | 29.21 mm | ||
![]() PZ5032-6A44-T AMD Xilinx | In Stock | - | Datasheet | YES | 44 | 105 MHz | XILINX INC | - | 32 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LPCC | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 8 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
![]() AMPAL16H8LDC AMD | 817 | - | Datasheet | NO | 20 | - | ADVANCED MICRO DEVICES INC | - | 6 | 75 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-GDIP-T20 | 8 | Not Qualified | COMMERCIAL EXTENDED | 35 ns | PAL-TYPE | 16 | 10 DEDICATED INPUTS, 6 I/O | - | OT PLD | - | COMBINATORIAL | - | - | 10 | - | 64 | - | - | ||
![]() P5Z22V10-7DH-T AMD Xilinx | 678 | - | Datasheet | YES | 24 | 103 MHz | XILINX INC | - | 10 | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET | 8542.39.00.01 | DUAL | GULL WING | - | 0.65 mm | unknown | - | 24 | R-PDSO-G24 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 1.1 mm | EE PLD | - | MACROCELL | - | - | 11 | - | - | 7.8 mm | 4.4 mm | ||
![]() XCR3320-10BG256C AMD Xilinx | 158 | - | Datasheet | YES | 256 | 87 MHz | XILINX INC | 3 | 3 | 70 °C | - | PLASTIC/EPOXY | BGA | PLASTIC, BGA-256 | BGA256,20X20,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 3.6 V | 3 V | 3.3 V | e0 | - | - | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 30 | 256 | S-PBGA-B256 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 12 DEDICATED INPUTS, 3 I/O | 2.55 mm | LOADABLE PLD | - | MACROCELL | 320 | YES | 12 | YES | - | 27 mm | 27 mm | ||
![]() PZ5128CS10BE-T NXP Semiconductors | In Stock | - | Datasheet | YES | 128 | 71 MHz | NXP SEMICONDUCTORS | - | 96 | 70 °C | - | PLASTIC/EPOXY | LFQFP | LFQFP, | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | Transferred | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | R-PQFP-G128 | - | Not Qualified | COMMERCIAL | 12 ns | - | - | 2 DEDICATED INPUTS, 96 I/O | 1.6 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm |