- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XC7236-25PC44I AMD Xilinx | 423 | - | Datasheet | YES | 44 | 33 MHz | XILINX INC | 3 | 30 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | 36 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | 44 | S-PQCC-J44 | - | Not Qualified | INDUSTRIAL | 40 ns | - | - | 2 DEDICATED INPUTS, 30 I/O | 4.57 mm | OT PLD | - | MACROCELL | 36 | NO | 2 | NO | - | 16.5862 mm | 16.5862 mm | ||
 EPM9560RC240-25 Altera Corporation | In Stock | - | Datasheet | YES | 240 | 66.7 MHz | ALTERA CORP | - | 191 | 70 °C | - | PLASTIC/EPOXY | HFQFP | HFQFP, | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | - | 5.25 V | 4.75 V | 5 V | e3 | - | - | MATTE TIN | 560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 240 | S-PQFP-G240 | - | Not Qualified | COMMERCIAL | 25 ns | - | - | 0 DEDICATED INPUTS, 191 I/O | 4.1 mm | EE PLD | - | MACROCELL | - | - | - | - | - | 32 mm | 32 mm | ||
 PAL16R8DMJ/883B Rochester Electronics LLC | In Stock | - | Datasheet | NO | 20 | 37 MHz | ROCHESTER ELECTRONICS LLC | - | - | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | DIP20,.3 | RECTANGULAR | IN-LINE | Active | - | - | 5.5 V | 4.5 V | 5 V | - | - | 3A001.A.2.C | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | - | unknown | NOT SPECIFIED | - | R-GDIP-T20 | - | - | MILITARY | 12 ns | - | - | 8 DEDICATED INPUTS, 0 I/O | - | OT PLD | - | REGISTERED | - | - | 8 | - | - | - | - | ||
| Tiny WHSL | 48 | - | Datasheet | NO | 20 | 37 MHz | ADVANCED MICRO DEVICES INC | - | - | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-GDIP-T20 | 8 | Not Qualified | MILITARY | 12 ns | PAL-TYPE | 8 | 8 DEDICATED INPUTS, 0 I/O | - | OT PLD | 38535Q/M;38534H;883B | REGISTERED | - | - | 8 | - | 64 | - | - | ||
| Tiny WHSL | In Stock | - | Datasheet | YES | 208 | - | ADVANCED MICRO DEVICES INC | 3 | 168 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | - | Yes | - | - | 5 V | e3 | - | - | MATTE TIN | - | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | 30 | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
P3Z22V10-DDH AMD Xilinx | In Stock | - | Datasheet | YES | 24 | 80 MHz | XILINX INC | - | - | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP24,.25 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | DUAL | GULL WING | - | 0.635 mm | unknown | - | - | R-PDSO-G24 | 10 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 22 | - | - | EE PLD | - | MACROCELL | - | - | - | - | 132 | - | - | ||
 P3Z22V10-DDH NXP Semiconductors | In Stock | - | Datasheet | YES | 24 | 83 MHz | NXP SEMICONDUCTORS | - | 10 | 70 °C | - | PLASTIC/EPOXY | TSSOP | 4.40 MM, PLASTIC, SOT-355-1, TSSOP-24 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | DUAL | GULL WING | - | 0.65 mm | unknown | - | 24 | R-PDSO-G24 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 1.1 mm | EE PLD | - | MACROCELL | - | - | 11 | - | - | 7.8 mm | 4.4 mm | ||
PZ3064DS10BP Philips Semiconductors | In Stock | - | Datasheet | YES | 100 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | - | TQFP100,.63SQ | SQUARE | FLATPACK | Transferred | - | No | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 11.5 ns | - | - | - | - | EE PLD | - | - | 64 | YES | - | YES | - | - | - | ||
PZ3064DS10BP AMD Xilinx | In Stock | - | Datasheet | YES | 100 | - | XILINX INC | 3 | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Obsolete | - | No | - | - | - | - | - | - | - | YES | 8542.39.00.01 | QUAD | GULL WING | 240 | 0.5 mm | unknown | 30 | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 11.5 ns | - | - | - | - | EE PLD | - | - | 64 | YES | - | YES | - | - | - | ||
PALCE16V8Q-15JC Lattice Semiconductor Corporation | 176 | - | Datasheet | YES | 20 | 45.5 MHz | LATTICE SEMICONDUCTOR CORP | 1 | 8 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC20,.4SQ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | - | S-PQCC-J20 | 8 | Not Qualified | COMMERCIAL | 15 ns | PAL-TYPE | 18 | 8 DEDICATED INPUTS, 8 I/O | - | EE PLD | - | MACROCELL | - | - | 8 | - | 64 | - | - | ||
PZ3320C10EB Philips Semiconductors | In Stock | - | Datasheet | YES | 256 | - | PHILIPS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,20X20,50 | BGA256,20X20,50 | SQUARE | GRID ARRAY | Transferred | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | BOTTOM | BALL | - | 1.27 mm | unknown | - | - | S-PBGA-B256 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | - | - | LOADABLE PLD | - | - | 320 | YES | - | YES | - | - | - | ||
PZ3320C10EB AMD Xilinx | In Stock | - | Datasheet | YES | 256 | - | XILINX INC | 3 | - | 70 °C | - | PLASTIC | BGA | - | BGA256,20X20,50 | SQUARE | GRID ARRAY | Obsolete | - | No | - | - | 3.3 V | e0 | - | - | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 30 | - | S-PBGA-B256 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | - | - | LOADABLE PLD | - | - | 320 | YES | - | YES | - | - | - | ||
XC95432-10HQG304C AMD Xilinx | In Stock | - | Datasheet | YES | 304 | - | XILINX INC | - | 232 | 70 °C | - | PLASTIC/EPOXY | HFQFP | HFQFP, | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | - | - | - | 5 V | e3 | - | 3A991.D | MATTE TIN | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 304 | S-PQFP-G304 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 0 DEDICATED INPUTS, 232 I/O | 4.5 mm | FLASH PLD | - | MACROCELL | - | - | - | - | - | 40 mm | 40 mm | ||
| Tiny WHSL | 466 | - | Datasheet | YES | 160 | - | ADVANCED MICRO DEVICES INC | 3 | 133 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | - | No | - | - | 5 V | e0 | - | - | TIN LEAD | - | - | QUAD | GULL WING | - | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
 PZ3032I10BC NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | 58.8 MHz | NXP SEMICONDUCTORS | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | 10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44 | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | 44 | S-PQFP-G44 | - | Not Qualified | INDUSTRIAL | 16 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
 EPM9560WC208-15 Altera Corporation | In Stock | - | Datasheet | YES | 208 | 117.6 MHz | ALTERA CORP | - | 153 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | No | - | TIN LEAD | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | GULL WING | 220 | 0.5 mm | unknown | - | 208 | S-CQFP-G208 | - | Not Qualified | COMMERCIAL | 16.6 ns | - | - | 0 DEDICATED INPUTS, 153 I/O | 4.1 mm | EE PLD | - | MACROCELL | 560 | YES | - | YES | - | 28 mm | 28 mm | ||
EPM9560WC208-20C Altera Corporation | In Stock | - | Datasheet | YES | 208 | 100 MHz | ALTERA CORP | - | 153 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | FQFP | FQFP, HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | GULL WING | 220 | 0.5 mm | unknown | - | 208 | S-CQFP-G208 | - | Not Qualified | COMMERCIAL | 23.6 ns | - | - | 0 DEDICATED INPUTS, 153 I/O | 4.1 mm | EE PLD | - | MACROCELL | 560 | YES | - | YES | - | 28 mm | 28 mm | ||
XH95216-10HQ208I AMD Xilinx | 798 | - | Datasheet | YES | 208 | - | XILINX INC | 3 | 168 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | No | - | - | 5 V | e0 | No | - | TIN LEAD | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
XCR3256XL-12PQG208Q AMD Xilinx | In Stock | - | Datasheet | YES | 208 | - | XILINX INC | 3 | 164 | 125 °C | -40 °C | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | Yes | 3.6 V | 3 V | 3.3 V | e3 | Yes | - | Matte Tin (Sn) | - | 8542.39.00.01 | QUAD | GULL WING | 245 | 0.5 mm | compliant | 30 | 208 | S-PQFP-G208 | - | Not Qualified | AUTOMOTIVE | 12 ns | - | - | 0 DEDICATED INPUTS, 164 I/O | 4.1 mm | EE PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
GAL16V8-10LVC Texas Instruments | In Stock | - | Datasheet | YES | 20 | 58.8 MHz | NATIONAL SEMICONDUCTOR CORP | - | - | 70 °C | - | PLASTIC | QCCJ | QCCJ, LDCC20,.4SQ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J20 | 8 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 18 | - | - | EE PLD | - | MACROCELL | - | - | - | - | 64 | - | - |
