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Embedded - PLDs (Programmable Logic Device)

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2797 Results

Product	Inventory	Pricing(USD)	Datasheet	Surface Mount	Number of Terminals	Clock Frequency-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of I/O Lines	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	JESD-609 Code	Terminal Finish	Additional Feature	HTS Code	Packing Method	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Temperature Grade	Propagation Delay	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Output Function	Number of Macro Cells	JTAG BST	Number of Dedicated Inputs	In-System Programmable	Number of Product Terms	Length	Width
PZ5064NS10A44-T Philips Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	44	-	PHILIPS SEMICONDUCTORS	-	-	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ, LDCC44,.7SQ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	Transferred	-	No	-	-	5 V	e0	Tin/Lead (Sn/Pb)	YES	8542.39.00.01	TAPE AND REEL	QUAD	J BEND	-	1.27 mm	unknown	-	-	S-PQCC-J44	-	Not Qualified	INDUSTRIAL	12 ns	-	-	-	-	EE PLD	-	64	YES	-	YES	-	-	-
CY7C335-50PC Cypress Semiconductor Tiny WHSL	In Stock	-	Datasheet	NO	28	33.3 MHz	CYPRESS SEMICONDUCTOR CORP	-	12	75 °C	-	PLASTIC/EPOXY	DIP	0.300 INCH, PLASTIC, DIP-28	DIP28,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5.5 V	4.5 V	5 V	e0	TIN LEAD	12 I/O MACROCELLS; 3 EXTERNAL CLOCKS; VARIABLE PRODUCT TERMS; SHARED INPUT/CLOCK	8542.39.00.01	-	DUAL	THROUGH-HOLE	-	2.54 mm	not_compliant	-	28	R-PDIP-T28	12	Not Qualified	COMMERCIAL EXTENDED	25 ns	PAL-TYPE	24	9 DEDICATED INPUTS, 12 I/O	-	OT PLD	MACROCELL	-	-	9	-	256	-	-
PZ5032I7A44-T NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	44	91 MHz	NXP SEMICONDUCTORS	-	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,	-	SQUARE	CHIP CARRIER	Transferred	-	-	5.5 V	4.5 V	5 V	-	-	-	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	-	S-PQCC-J44	-	Not Qualified	INDUSTRIAL	12 ns	-	-	2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD	MACROCELL	-	-	2	-	-	16.5862 mm	16.5862 mm
P5Z22V10IDD Philips Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	24	74 MHz	PHILIPS SEMICONDUCTORS	-	-	85 °C	-40 °C	PLASTIC/EPOXY	SOP	-	SOP24,.4	RECTANGULAR	SMALL OUTLINE	Transferred	-	No	-	-	5 V	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	-	DUAL	GULL WING	-	1.27 mm	unknown	-	-	R-PDSO-G24	10	Not Qualified	INDUSTRIAL	10 ns	PAL-TYPE	22	-	-	EE PLD	MACROCELL	-	-	-	-	132	-	-
XC95180-10HQG208C AMD Xilinx Tiny WHSL	941	-	Datasheet	YES	208	-	XILINX INC	3	166	70 °C	-	PLASTIC/EPOXY	HFQFP	HFQFP,	-	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	Obsolete	QFP	Yes	-	-	5 V	e3	MATTE TIN	-	8542.39.00.01	-	QUAD	GULL WING	-	0.5 mm	compliant	-	208	S-PQFP-G208	-	Not Qualified	COMMERCIAL	10 ns	-	-	0 DEDICATED INPUTS, 166 I/O	4.1 mm	FLASH PLD	MACROCELL	-	-	-	-	-	28 mm	28 mm
XCR3064-12PC68C AMD Xilinx Tiny WHSL	259	-	Datasheet	YES	68	67 MHz	XILINX INC	1	48	70 °C	-	PLASTIC/EPOXY	QCCJ	QCCJ, LDCC68,1.0SQ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	Obsolete	LCC	No	3.6 V	2.97 V	3.3 V	-	-	NO	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	68	S-PQCC-J68	-	Not Qualified	COMMERCIAL	12 ns	-	-	2 DEDICATED INPUTS, 48 I/O	5.08 mm	EE PLD	MACROCELL	64	NO	2	NO	-	24.2316 mm	24.2316 mm
PZ5032CS7A44 NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	44	80 MHz	NXP SEMICONDUCTORS	-	32	70 °C	-	PLASTIC/EPOXY	QCCJ	PLASTIC, SOT-187-2, LCC-44	-	SQUARE	CHIP CARRIER	Obsolete	LCC	-	5.25 V	4.75 V	5 V	-	-	32 MACROCELLS	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	44	S-PQCC-J44	-	Not Qualified	COMMERCIAL	10 ns	-	-	2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD	MACROCELL	-	-	2	-	-	16.5862 mm	16.5862 mm
EPM7160 Temic Semiconductors Tiny WHSL	In Stock	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
PZ3128AS7BP-T NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	100	95 MHz	NXP SEMICONDUCTORS	-	80	70 °C	-	PLASTIC/EPOXY	TFQFP	TFQFP,	-	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	Transferred	-	-	3.63 V	2.97 V	3.3 V	-	-	128 MACROCELLS	8542.39.00.01	-	QUAD	GULL WING	-	0.5 mm	unknown	-	-	S-PQFP-G100	-	Not Qualified	COMMERCIAL	9.5 ns	-	-	2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD	MACROCELL	-	-	2	-	-	14 mm	14 mm
PZ3128AS7BP-T AMD Xilinx Tiny WHSL	46	-	Datasheet	YES	100	95 MHz	XILINX INC	-	80	70 °C	-	PLASTIC/EPOXY	TFQFP	TFQFP,	-	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	Obsolete	QFP	-	3.63 V	2.97 V	3.3 V	-	-	128 MACROCELLS	8542.39.00.01	-	QUAD	GULL WING	-	0.5 mm	unknown	-	100	S-PQFP-G100	-	Not Qualified	COMMERCIAL	9.5 ns	-	-	2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD	MACROCELL	-	-	2	-	-	14 mm	14 mm
PZ5064-10A68-T AMD Xilinx Tiny WHSL	167	-	Datasheet	YES	68	77 MHz	XILINX INC	-	48	70 °C	-	PLASTIC/EPOXY	QCCJ	QCCJ,	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	Obsolete	LCC	-	5.25 V	4.75 V	5 V	-	-	64 MACROCELLS	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	68	S-PQCC-J68	-	Not Qualified	COMMERCIAL	12.5 ns	-	-	2 DEDICATED INPUTS, 48 I/O	4.57 mm	EE PLD	MACROCELL	-	-	2	-	-	24.2316 mm	24.2316 mm
PZ3032AS6BC-T AMD Xilinx Tiny WHSL	602	-	Datasheet	YES	44	111 MHz	XILINX INC	-	32	70 °C	-	PLASTIC/EPOXY	TQFP	TQFP,	-	SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	-	3.63 V	2.97 V	3.3 V	-	-	32 MACROCELLS	8542.39.00.01	-	QUAD	GULL WING	-	0.8 mm	unknown	-	44	S-PQFP-G44	-	Not Qualified	COMMERCIAL	8 ns	-	-	2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD	MACROCELL	-	-	2	-	-	10 mm	10 mm
PZ3032AS6BC-T NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	44	111 MHz	NXP SEMICONDUCTORS	-	32	70 °C	-	PLASTIC/EPOXY	TQFP	TQFP,	-	SQUARE	FLATPACK, THIN PROFILE	Transferred	-	-	3.63 V	2.97 V	3.3 V	-	-	32 MACROCELLS	8542.39.00.01	-	QUAD	GULL WING	-	0.8 mm	unknown	-	-	S-PQFP-G44	-	Not Qualified	COMMERCIAL	8 ns	-	-	2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD	MACROCELL	-	-	2	-	-	10 mm	10 mm
XH95216-7HQG208C AMD Tiny WHSL	294	-	Datasheet	YES	208	-	ADVANCED MICRO DEVICES INC	3	168	-	-	PLASTIC/EPOXY	HFQFP	HEAT SINK, QFP-208	-	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	Obsolete	-	Yes	-	-	5 V	e3	MATTE TIN	-	-	-	QUAD	GULL WING	245	0.5 mm	compliant	30	-	S-PQFP-G208	-	Not Qualified	-	-	-	-	0 DEDICATED INPUTS, 168 I/O	4.1 mm	MASK PLD	MACROCELL	-	-	-	-	-	28 mm	28 mm
EPM7064BUC49-3N Altera Corporation Tiny WHSL	In Stock	-	Datasheet	YES	49	303 MHz	ALTERA CORP	-	41	70 °C	-	PLASTIC/EPOXY	LFBGA	LFBGA, BGA49,7X7,32	BGA49,7X7,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	Yes	2.625 V	2.375 V	2.5 V	e1	TIN SILVER COPPER	YES	8542.39.00.01	-	BOTTOM	BALL	-	0.8 mm	compliant	-	49	S-PBGA-B49	-	Not Qualified	COMMERCIAL	3.5 ns	-	-	0 DEDICATED INPUTS, 41 I/O	1.55 mm	EE PLD	MACROCELL	64	YES	-	YES	-	7 mm	7 mm
XC95288XV-6PQG208C AMD Xilinx Tiny WHSL	726	-	Datasheet	YES	208	208 MHz	XILINX INC	3	168	70 °C	-	PLASTIC/EPOXY	FQFP	PLASTIC, QFP-208	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	Obsolete	QFP	Yes	2.62 V	2.37 V	2.5 V	e3	MATTE TIN	YES	8542.39.00.01	-	QUAD	GULL WING	245	0.5 mm	unknown	30	208	S-PQFP-G208	-	Not Qualified	COMMERCIAL	6 ns	-	-	0 DEDICATED INPUTS, 168 I/O	4.1 mm	FLASH PLD	MACROCELL	288	YES	-	YES	-	28 mm	28 mm
PZ3032CS12A44 AMD Xilinx Tiny WHSL	In Stock	-	Datasheet	YES	44	-	XILINX INC	3	-	70 °C	-	PLASTIC/EPOXY	QCCJ	-	LDCC44,.7SQ	SQUARE	CHIP CARRIER	Obsolete	-	No	-	-	3.3 V	e0	TIN LEAD	YES	8542.39.00.01	-	QUAD	J BEND	225	1.27 mm	not_compliant	30	-	S-PQCC-J44	-	Not Qualified	COMMERCIAL	15 ns	-	-	-	-	EE PLD	-	32	YES	-	YES	-	-	-
PLC42VA12A Philips Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	28	14.9 MHz	PHILIPS SEMICONDUCTORS	-	-	70 °C	-	PLASTIC/EPOXY	QCCJ	-	LDCC28,.5SQ	SQUARE	CHIP CARRIER	Transferred	-	No	-	-	5 V	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	-	S-PQCC-J28	12	Not Qualified	COMMERCIAL	-	PLS-TYPE	42	-	-	-	-	-	-	-	-	105	-	-
PZ5064I12A68-T NXP Semiconductors Tiny WHSL	In Stock	-	Datasheet	YES	68	67 MHz	NXP SEMICONDUCTORS	-	48	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	Transferred	-	-	5.5 V	4.5 V	5 V	-	-	-	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	-	S-PQCC-J68	-	Not Qualified	INDUSTRIAL	14.5 ns	-	-	2 DEDICATED INPUTS, 48 I/O	4.57 mm	EE PLD	MACROCELL	-	-	2	-	-	24.2316 mm	24.2316 mm
XC7272A-20WC68C AMD Xilinx Tiny WHSL	225	-	Datasheet	YES	68	50 MHz	XILINX INC	1	38	70 °C	-	CERAMIC, METAL-SEALED COFIRED	WQCCJ	WQCCJ, LDCC68,1.0SQ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER, WINDOW	Obsolete	QFJ	No	5.25 V	4.75 V	5 V	-	-	PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS	8542.39.00.01	-	QUAD	J BEND	-	1.27 mm	unknown	-	68	S-CQCC-J68	-	Not Qualified	COMMERCIAL	32 ns	-	-	8 DEDICATED INPUTS, 38 I/O	4.826 mm	UV PLD	MACROCELL	72	NO	8	NO	-	24.13 mm	24.13 mm