- Manufacturer
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Attribute column
Categories
Embedded - PLDs (Programmable Logic Device)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
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![]() XCR3384XL-7.5CSG280I AMD Xilinx | In Stock | - | Datasheet | YES | 280 | - | XILINX INC | 3 | 216 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.6 V | 2.7 V | 3.3 V | e1 | Yes | 3A991.D | TIN SILVER COPPER | - | 8542.39.00.01 | BOTTOM | BALL | - | 0.8 mm | compliant | - | 280 | S-PBGA-B280 | - | Not Qualified | INDUSTRIAL | 7.5 ns | - | - | 216 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 280 | - | ADVANCED MICRO DEVICES INC | 3 | 216 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Yes | 3.6 V | 2.7 V | 3.3 V | e1 | - | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B280 | - | Not Qualified | INDUSTRIAL | 7.5 ns | - | - | 216 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
![]() XC7354-12WC68I AMD Xilinx | 669 | - | Datasheet | YES | 68 | 66.7 MHz | XILINX INC | 1 | 42 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | - | - | - | - | 54 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 108 FLIP-FLOPS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 68 | S-CQCC-J68 | - | Not Qualified | INDUSTRIAL | 27 ns | - | - | 8 DEDICATED INPUTS, 42 I/O | 4.826 mm | UV PLD | MACROCELL | 54 | NO | 8 | NO | - | 24.13 mm | 24.13 mm | ||
![]() PALCE26V12H-10PC/4 Vantis Corporation | In Stock | - | Datasheet | NO | 28 | 105 MHz | VANTIS CORP | - | 12 | 70 °C | - | PLASTIC/EPOXY | DIP | - | DIP28,.3 | RECTANGULAR | IN-LINE | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T28 | 12 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 26 | 14 DEDICATED INPUTS, 12 I/O | - | EE PLD | MACROCELL | - | - | 14 | - | 136 | - | - | ||
![]() P3C18V8ZIAN NXP Semiconductors | In Stock | - | Datasheet | NO | 20 | 18 MHz | NXP SEMICONDUCTORS | - | 8 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | PROGRAMMABLE OUTPUT POLARITY | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T20 | - | Not Qualified | INDUSTRIAL | 45 ns | - | - | 8 DEDICATED INPUTS, 8 I/O | 4.2 mm | OT PLD | MACROCELL | - | - | 8 | - | - | 26.73 mm | 7.62 mm | ||
![]() P3C18V8ZIAN Philips Semiconductors | In Stock | - | Datasheet | NO | 20 | 16 MHz | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Transferred | - | No | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T20 | 8 | Not Qualified | INDUSTRIAL | 50 ns | PAL-TYPE | 18 | - | - | - | MACROCELL | - | - | - | - | 74 | - | - | ||
Tiny WHSL | In Stock | - | Datasheet | YES | 160 | - | ADVANCED MICRO DEVICES INC | 3 | 133 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | - | No | - | - | 5 V | e0 | - | - | TIN LEAD | - | - | QUAD | GULL WING | - | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
![]() XH95144-7PQ160I AMD Xilinx | In Stock | - | Datasheet | YES | 160 | - | XILINX INC | 3 | 133 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Transferred | QFP | No | - | - | 5 V | e0 | No | - | TIN LEAD | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | compliant | - | 160 | S-PQFP-G160 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
![]() TIBPLS506CJT Texas Instruments | In Stock | - | Datasheet | NO | 24 | 33 MHz | TEXAS INSTRUMENTS INC | - | - | 75 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5.25 V | 4.75 V | 5 V | - | - | - | - | FIELD-PROGRAMMABLE LOGIC SEQUENCER | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | - | R-GDIP-T24 | 8 | Not Qualified | COMMERCIAL EXTENDED | 6 ns | PLS-TYPE | 13 | 12 DEDICATED INPUTS, 0 I/O | - | OT PLD | REGISTERED | - | - | 12 | - | 97 | - | - | ||
![]() XH95144-10PQ160C AMD Xilinx | 813 | - | Datasheet | YES | 160 | - | XILINX INC | 3 | 133 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Transferred | QFP | No | - | - | 5 V | e0 | No | - | TIN LEAD | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | compliant | - | 160 | S-PQFP-G160 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
![]() PZ3128IS12BB1-T AMD Xilinx | 20 | - | Datasheet | YES | 100 | 69 MHz | XILINX INC | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | unknown | - | 100 | R-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 3.4 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
![]() PZ3128IS12BB1-T NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 66 MHz | NXP SEMICONDUCTORS | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Transferred | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | unknown | - | - | R-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 3.4 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
![]() PLUS20L8DN NXP Semiconductors | In Stock | - | Datasheet | NO | 24 | - | NXP SEMICONDUCTORS | - | 6 | 75 °C | - | PLASTIC/EPOXY | DIP | DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T24 | - | Not Qualified | COMMERCIAL EXTENDED | 10 ns | - | - | 14 DEDICATED INPUTS, 6 I/O | 4.7 mm | OT PLD | COMBINATORIAL | - | - | 14 | - | - | 31.7 mm | 7.62 mm | ||
![]() PLUS20L8DN YAGEO Corporation | In Stock | - | Datasheet | NO | 24 | - | PHILIPS COMPONENTS | - | 6 | 75 °C | - | PLASTIC/EPOXY | - | DIP-24 | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | - | unknown | - | - | R-PDIP-T24 | - | Not Qualified | COMMERCIAL EXTENDED | 10 ns | - | - | 14 DEDICATED INPUTS, 6 I/O | - | OT PLD | COMBINATORIAL | - | - | 14 | - | - | - | - | ||
![]() PZ3064-10A84-T NXP Semiconductors | In Stock | - | Datasheet | YES | 84 | 80 MHz | NXP SEMICONDUCTORS | - | 64 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Transferred | - | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J84 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 64 I/O | 4.57 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 29.3116 mm | 29.3116 mm | ||
![]() PZ3064-10A84-T AMD Xilinx | 345 | - | Datasheet | YES | 84 | 80 MHz | XILINX INC | - | 64 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 64 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 84 | S-PQCC-J84 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 64 I/O | 4.57 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 29.3116 mm | 29.3116 mm | ||
![]() PLC16V8H35N Philips Semiconductors | In Stock | - | Datasheet | NO | 20 | 18.1 MHz | PHILIPS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | DIP | - | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-PDIP-T20 | 8 | Not Qualified | COMMERCIAL | 35 ns | PAL-TYPE | 18 | - | - | - | MACROCELL | - | - | - | - | 72 | - | - | ||
![]() XC7372-7WC84C AMD Xilinx | 741 | - | Datasheet | YES | 84 | 95.2 MHz | XILINX INC | 1 | 37 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | LCC | No | 5.25 V | 4.75 V | 5 V | - | - | - | - | 72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 84 | S-CQCC-J84 | - | Not Qualified | COMMERCIAL | 18.5 ns | - | - | 12 DEDICATED INPUTS, 37 I/O | 4.826 mm | UV PLD | MACROCELL | 72 | NO | 12 | NO | - | 29.21 mm | 29.21 mm | ||
![]() PZ5128NS15BP-T NXP Semiconductors | In Stock | - | Datasheet | YES | 100 | 63 MHz | NXP SEMICONDUCTORS | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
![]() PZ5128NS15BP-T AMD Xilinx | 541 | - | Datasheet | YES | 100 | 63 MHz | XILINX INC | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 17.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm |