- Manufacturer
- Packaging
- Part Status
- RoHS Status
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Mounting Type
- Operating Temperature
- Package / Case
- Voltage - Supply
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Brand | Clock Frequency-Max (fCLK) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Tradename | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Halogen Free | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | I2C Control Byte | Product Category | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 27C64-12ISO Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
25LC160BT-E/SNG Microchip | In Stock | - | - | - | - | - | - | - | YES | - | 8 | - | - | 10 MHz | - | MICROCHIP TECHNOLOGY INC | - | Microchip Technology Inc | 25LC160BT-E/SNG | - | - | - | - | - | 1 | - | 2048 words | 2000 | - | - | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Not Recommended | SOIC | 40 | 5.25 | - | Yes | - | - | 5 V | - | - | - | - | - | - | e3 | Yes | - | - | - | EAR99 | - | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | EEPROMs | CMOS | - | DUAL | GULL WING | 260 | 1 | - | 1.27 mm | compliant | - | - | 8 | R-PDSO-G8 | Not Qualified | - | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | - | - | - | - | - | - | - | SYNCHRONOUS | - | 0.006 mA | - | - | - | - | 2KX8 | - | - | 1.75 mm | 8 | - | - | - | - | 0.000005 A | 16384 bit | - | SERIAL | - | - | - | EEPROM | - | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4.9 mm | 3.9 mm | - | - | - | - | ||
25C040XT-E/ST Microchip | In Stock | - | - | - | - | - | - | - | YES | - | 8 | - | - | 3 MHz | - | MICROCHIP TECHNOLOGY INC | - | Microchip Technology Inc | 25C040XT-E/ST | - | - | - | - | - | 1 | - | 512 words | 512 | - | - | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Not Recommended | SOIC | 40 | 5.38 | - | Yes | - | - | 5 V | - | - | - | - | - | - | e3 | Yes | - | - | - | EAR99 | - | Matte Tin (Sn) | - | - | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | 8542.32.00.51 | EEPROMs | CMOS | - | DUAL | GULL WING | 260 | 1 | - | 0.65 mm | compliant | - | - | 8 | R-PDSO-G8 | Not Qualified | - | 5.5 V | 5 V | AUTOMOTIVE | 4.5 V | - | - | - | - | - | - | - | SYNCHRONOUS | - | 0.005 mA | - | - | - | - | 512X8 | - | - | 1.2 mm | 8 | - | - | - | - | 0.000001 A | 4096 bit | - | SERIAL | - | - | - | EEPROM | - | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4.4 mm | 3 mm | - | - | - | - | ||
AT28C256E-35UM/883 Atmel | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 25AA640XT-I/ST Microchip Technology | 38 | - | Datasheet | 5 Weeks | - | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2004 | - | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | - | Matte Tin (Sn) | - | - | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | - | - | - | 1.8V~5.5V | DUAL | - | 260 | 1 | 2.5V | 0.65mm | - | 40 | 25AA640 | 8 | - | - | - | 5.5V | 2/5V | - | - | - | SPI, Serial | - | - | 64Kb 8K x 8 | - | 5mA | - | 1MHz | - | 475 ns | EEPROM | SPI | - | - | - | - | - | 8 | 5ms | - | - | 64 kb | 0.000001A | - | - | - | - | - | - | - | - | SPI | 100000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 4.4mm | 3mm | No | - | ROHS3 Compliant | Lead Free | ||
 CY7C1471V25-133AXC Cypress Semiconductor Corp | 2446 |
| Datasheet | 8 Weeks | - | Surface Mount | Surface Mount | 100-LQFP | - | 100 | - | - | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2004 | NoBL™ | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | - | Matte Tin (Sn) | - | - | FLOW-THROUGH ARCHITECTURE | - | - | - | 2.375V~2.625V | QUAD | - | 260 | 1 | 2.5V | 0.65mm | - | 20 | CY7C1471 | 100 | - | - | 2.5V | 2.625V | - | - | 2.375V | - | - | - | - | 72Mb 2M x 36 | 4 | 305mA | - | 133MHz | - | 6.5ns | SRAM | Parallel | - | 2MX36 | 3-STATE | - | - | 36 | - | 21b | - | 72 Mb | - | - | - | - | COMMON | Synchronous | 36b | - | - | - | - | - | - | - | 2.38V | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | - | No | - | ROHS3 Compliant | Lead Free | ||
 CY7C1470BV33-250BZXC Cypress Semiconductor Corp | 8 | - | - | 8 Weeks | - | Surface Mount | Surface Mount | 165-LBGA | - | 165 | - | - | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2004 | NoBL™ | e1 | - | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | PIPELINED ARCHITECTURE | - | - | - | 3.135V~3.6V | BOTTOM | - | 260 | 1 | 3.3V | 1mm | - | 40 | CY7C1470 | 165 | - | - | 3.3V | 3.6V | - | - | 3.135V | - | - | - | - | 72Mb 2M x 36 | 4 | 500mA | - | 200MHz | - | 3ns | SRAM | Parallel | - | 2MX36 | 3-STATE | - | - | 36 | - | 21b | - | 72 Mb | - | - | - | - | COMMON | Synchronous | 36b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 17mm | - | No | - | ROHS3 Compliant | - | ||
 S-24C08DI-M5T1U5 ABLIC U.S.A. Inc. | 70 | - | Datasheet | 18 Weeks | - | - | Surface Mount | SC-74A, SOT-753 | YES | - | - | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | - | - | e3 | - | Active | 1 (Unlimited) | 5 | - | - | TIN | - | - | IT ALSO OPERATES AT 0.4 MHZ AT 1.7 TO 5.5 V SUPPLY VOLTAGE | - | - | - | 1.7V~5.5V | DUAL | - | NOT SPECIFIED | 1 | 5V | 0.95mm | - | NOT SPECIFIED | - | - | R-PDSO-G5 | - | - | 5.5V | - | - | 2.5V | - | - | - | - | 8Kb 1K x 8 | - | - | SYNCHRONOUS | 1MHz | - | 500ns | EEPROM | I2C | - | 1KX8 | - | - | - | 8 | 5ms | - | - | - | - | 8192 bit | - | SERIAL | - | - | - | - | - | I2C | - | 5ms | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.3mm | 2.9mm | 1.6mm | - | - | RoHS Compliant | - | ||
25AA160B-I/SNG Microchip | In Stock | - | - | - | - | - | - | - | YES | - | 8 | - | - | 10 MHz | - | MICROCHIP TECHNOLOGY INC | - | Microchip Technology Inc | 25AA160B-I/SNG | - | - | - | - | - | 1 | - | 2048 words | 2000 | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Not Recommended | SOIC | 40 | 5.26 | - | Yes | - | - | 2.5 V | - | - | - | - | - | - | e3 | Yes | - | - | - | EAR99 | - | Matte Tin (Sn) | - | - | - | 8542.32.00.51 | EEPROMs | CMOS | - | DUAL | GULL WING | 260 | 1 | - | 1.27 mm | compliant | - | - | 8 | R-PDSO-G8 | Not Qualified | - | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | - | - | - | - | - | - | - | SYNCHRONOUS | - | 0.006 mA | - | - | - | - | 2KX8 | - | - | 1.75 mm | 8 | - | - | - | - | 0.000001 A | 16384 bit | - | SERIAL | - | - | - | EEPROM | - | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4.9 mm | 3.9 mm | - | - | - | - | ||
28C04A20-L Microchip | In Stock | - | - | - | - | - | - | - | YES | - | 32 | 200 ns | - | - | - | MICROCHIP TECHNOLOGY INC | - | Microchip Technology Inc | 28C04A-20/L | - | - | - | - | - | - | - | 512 words | 512 | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | NOT SPECIFIED | 5.89 | - | No | - | - | 5 V | - | - | - | - | - | - | e0 | - | - | - | - | EAR99 | - | Tin/Lead (Sn/Pb) | - | - | 10K WRITE/ERASE ENDURANCE MIN; DATA RETENTION >200 YEARS | 8542.32.00.51 | EEPROMs | CMOS | - | QUAD | J BEND | NOT SPECIFIED | 1 | - | 1.27 mm | unknown | - | - | 32 | R-PQCC-J32 | Not Qualified | - | 5.5 V | 5 V | COMMERCIAL | 4.5 V | - | - | - | - | - | - | - | ASYNCHRONOUS | - | 0.03 mA | - | - | - | - | 512X8 | 3-STATE | - | 3.56 mm | 8 | - | - | - | - | 0.0001 A | 4096 bit | - | PARALLEL | - | - | - | EEPROM | 5 V | - | 10000 Write/Erase Cycles | 1 ms | 200 | - | - | - | YES | NO | NO | - | - | - | - | - | - | - | - | - | 13.97 mm | 11.43 mm | - | - | - | - | ||
GS8162Z18DGB-250I GSI Technology | In Stock | - | - | 10 Weeks | - | - | - | BGA-119 | YES | - | 119 | 5.5 ns | GSI Technology | - | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8162Z18DGB-250I | 250 MHz | + 85 C | SDR | - 40 C | Yes | - | SMD/SMT | 1048576 words | 1000000 | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.26 | Details | Yes | 3.6 V | 2.3 V | 2.5 V | NBT SRAM | - | - | Tray | - | GS8162Z18DGB | - | - | - | - | - | 3A991.B.2.B | NBT Pipeline/Flow Through | - | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | - | BOTTOM | BALL | NOT SPECIFIED | 1 | - | 1.27 mm | compliant | - | - | 119 | R-PBGA-B119 | Not Qualified | - | 2.7 V | - | INDUSTRIAL | 2.3 V | - | - | - | - | 18 Mbit | - | - | SYNCHRONOUS | - | 230 mA, 250 mA | 5.5 ns | - | - | - | 1 M x 18 | - | - | 1.99 mm | 18 | - | - | SRAM | - | - | 18874368 bit | - | PARALLEL | - | - | - | ZBT SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SRAM | - | 22 mm | 14 mm | - | - | - | - | ||
 MX25L1636EM2I-08G Macronix | 72 |
| Datasheet | - | - | - | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | - | - | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2017 | - | e3 | - | Not For New Designs | 3 (168 Hours) | 8 | - | - | MATTE TIN (800) | - | - | IT ALSO CONFIGURED AS 16M X 1 | - | - | - | 2.7V~3.6V | DUAL | - | 260 | 1 | 3.3V | 1.27mm | - | 40 | - | - | R-PDSO-G8 | Not Qualified | - | 3.6V | 3/3.3V | - | 2.7V | - | - | - | - | 16Mb 2M x 8 | - | - | SYNCHRONOUS | 133MHz | - | - | FLASH | SPI | - | 4MX4 | - | - | - | 4 | 300μs, 3ms | - | - | - | 0.00002A | 16777216 bit | - | SERIAL | - | - | - | - | 2.7V | SPI | 100000 Write/Erase Cycles | - | 20 | HARDWARE/SOFTWARE | - | 2 | - | - | - | - | - | - | - | - | - | - | - | 2.16mm | 5.28mm | 5.23mm | - | - | Non-RoHS Compliant | Lead Free | ||
 SST25VF020B-80-4C-Q3AE-T Microchip Technology | 47 |
| Datasheet | 6 Weeks | - | Surface Mount | Surface Mount | 8-UFDFN Exposed Pad | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tape & Reel (TR) | 2011 | SST25 | e3 | - | Active | 1 (Unlimited) | 8 | - | - | Matte Tin (Sn) - annealed | - | - | - | - | - | - | 2.7V~3.6V | DUAL | - | - | - | - | 0.5mm | - | - | SST25VF020B | - | - | Not Qualified | 3.3V | - | - | - | - | - | SPI, Serial | - | - | 2Mb 256K x 8 | - | 20mA | - | 80MHz | - | 6 ns | FLASH | SPI | 8b | - | - | - | - | 8 | 10μs | 1b | - | 2 Mb | 0.00002A | - | - | - | - | Synchronous | 8b | - | - | SPI | 100000 Write/Erase Cycles | - | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MX25U1635FZUI-10G Macronix | 276 |
| Datasheet | - | - | - | - | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 85°C | -40°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | 2012 | - | e3 | - | Not For New Designs | 3 (168 Hours) | 8 | - | - | Matte Tin (Sn) | - | - | ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT | - | - | - | - | DUAL | NO LEAD | 260 | 1 | 1.8V | 0.8mm | - | 40 | - | - | S-PDSO-N8 | - | - | 2V | - | INDUSTRIAL | 1.65V | - | - | - | - | - | - | - | SYNCHRONOUS | 104MHz | - | - | - | - | - | 4MX4 | - | - | - | 4 | - | - | - | - | - | 16777216 bit | - | SERIAL | - | - | - | FLASH | 1.8V | - | - | - | - | - | - | 2 | - | - | - | - | - | - | - | - | - | - | - | 0.6mm | 4mm | 4mm | - | - | Non-RoHS Compliant | Lead Free | ||
CAT24C08C5ATR ON Semiconductor | 190000 |
| Datasheet | 10 Weeks | ACTIVE (Last Updated: 2 weeks ago) | Surface Mount | Surface Mount | 5-XFBGA, WLCSP | - | 5 | - | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | 2008 | - | - | yes | Active | 1 (Unlimited) | 5 | - | - | - | - | - | - | - | - | - | 1.7V~5.5V | BOTTOM | - | NOT SPECIFIED | 1 | 3.3V | 0.3mm | - | NOT SPECIFIED | - | 5 | - | Not Qualified | - | - | - | - | 1.7V | - | 2-Wire, I2C, Serial | - | - | 8Kb 1K x 8 | - | 2mA | SYNCHRONOUS | 400kHz | - | 900ns | EEPROM | I2C | - | 8KX1 | - | Halogen Free | - | 1 | 5ms | - | - | 8 kb | 0.000003A | - | - | - | - | - | - | - | - | I2C | 1000000 Write/Erase Cycles | - | 100 | HARDWARE | - | - | - | - | - | - | - | - | - | - | - | 10100MMR | - | 0.39mm | 0.86mm | 0.84mm | - | - | ROHS3 Compliant | Lead Free | ||
 CY7C1361C-133AXCT Cypress Semiconductor Corp | 5 | - | Datasheet | 6 Weeks | - | Surface Mount | Surface Mount | 100-LQFP | - | 100 | - | - | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tape & Reel (TR) | 2003 | - | e4 | yes | Active | 3 (168 Hours) | 100 | 3A991.B.2.A | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | FLOW-THROUGH ARCHITECTURE | - | - | - | 3.135V~3.6V | QUAD | - | 260 | 1 | 3.3V | 0.65mm | - | 20 | CY7C1361 | - | - | - | 3.3V | 3.6V | - | - | 3.135V | - | - | - | - | 9Mb 256K x 36 | 4 | 250mA | - | 133MHz | - | 6.5ns | SRAM | Parallel | - | 256KX36 | 3-STATE | - | - | 36 | - | 18b | - | 9 Mb | - | - | - | - | COMMON | Synchronous | 36b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | - | No | - | ROHS3 Compliant | Lead Free | ||
 CY7C1414AV18-200BZXC Cypress Semiconductor Corp | 150 |
| Datasheet | - | - | Surface Mount | Surface Mount | 165-LBGA | - | 165 | - | - | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2003 | - | e1 | - | Obsolete | 3 (168 Hours) | 165 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | PIPELINED ARCHITECTURE | - | - | - | 1.7V~1.9V | BOTTOM | - | 260 | 1 | 1.8V | 1mm | unknown | 20 | CY7C1414 | 165 | - | Not Qualified | 1.8V | 1.9V | - | - | 1.7V | - | - | - | - | 36Mb 1M x 36 | 2 | 850mA | - | 200MHz | - | 450 ps | SRAM | Parallel | - | 1MX36 | 3-STATE | - | - | 36 | - | 19b | - | 36 Mb | 0.3A | - | - | - | SEPARATE | Synchronous | 36b | - | - | - | - | - | - | - | 1.7V | - | - | - | - | - | - | - | - | - | - | - | - | 1.4mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
R1LP0408CSP-5SI Renesas | 1000 | - | - | - | - | - | - | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5 V | - | - | - | - | 5 V | - | 5.5 V | 4.5 V | 512 kB | 1 | - | - | - | - | 55 ns | - | - | - | - | - | - | - | - | - | 19 b | - | 4 Mb | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | No SVHC | - | - | ||
 S70FL01GSAGMFV011 Cypress Semiconductor Corp | In Stock | - | - | 13 Weeks | - | - | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | - | - | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tube | 2016 | FL-S | - | - | Active | 3 (168 Hours) | 16 | - | - | - | - | - | - | 8542.32.00.51 | - | - | 2.7V~3.6V | DUAL | - | NOT SPECIFIED | 1 | 3V | 1.27mm | - | NOT SPECIFIED | - | - | R-PDSO-G16 | Not Qualified | - | 3.6V | 3/3.3V | - | 2.7V | - | SPI, Serial | - | - | 1Gb 128M x 8 | - | - | SYNCHRONOUS | 133MHz | 0.1mA | - | FLASH | SPI - Quad I/O | - | 1GX1 | - | - | - | 1 | - | - | - | - | 0.0003A | 1073741824 bit | - | - | - | - | - | - | 3V | SPI | 1000000 Write/Erase Cycles | - | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 10.3mm | 7.5mm | - | - | ROHS3 Compliant | - | ||
 S29GL032N90BFI043 Cypress Semiconductor Corp | 1940 | - | - | 13 Weeks | - | - | Surface Mount | 48-VFBGA | YES | 48 | - | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2015 | GL-N | e1 | - | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 8542.32.00.51 | - | - | 2.7V~3.6V | BOTTOM | - | 260 | 1 | 3V | 0.8mm | - | 40 | - | - | - | Not Qualified | - | 3.6V | 3/3.3V | - | 2.7V | - | - | - | - | 32Mb 4M x 8 2M x 16 | - | - | ASYNCHRONOUS | - | 0.05mA | - | FLASH | Parallel | - | 2MX16 | - | - | - | 16 | 90ns | - | - | - | 0.000005A | 33554432 bit | 90 ns | - | - | - | - | - | 3V | - | - | - | - | - | - | 8 | YES | YES | YES | 863 | 8K64K | 8/16words | YES | BOTTOM | YES | - | - | 1mm | 8.15mm | 6.15mm | - | - | ROHS3 Compliant | - |