- Manufacturer
- Packaging
- Part Status
- RoHS Status
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Mounting Type
- Operating Temperature
- Package / Case
- Voltage - Supply
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Ambient Temperature Range High | Common Flash Interface | I2C Control Byte | Reverse Pinout | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 SST26VF032B-104V/MF Microchip Technology | 266 |
| Datasheet | 7 Weeks | - | - | Surface Mount | 8-WDFN Exposed Pad | - | 8 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tube | 2016 | SST26 SQI® | e3 | - | Active | 3 (168 Hours) | - | - | - | Matte Tin (Sn) - annealed | - | - | - | - | 2.7V~3.6V | - | - | - | - | - | - | - | - | - | SST26VF032 | - | - | - | - | - | - | - | - | SPI, Serial | 32Mb 4M x 8 | - | - | - | 104MHz | - | - | FLASH | SPI - Quad I/O | - | - | - | - | - | 1.5ms | - | 32 Mb | - | - | - | - | - | - | - | - | - | - | SPI | 100000 Write/Erase Cycles | - | - | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 BR24T256F-WE2 ROHM Semiconductor | 2120 | - | - | 11 Weeks | Copper, Tin | Surface Mount | Surface Mount | 8-SOIC (0.173, 4.40mm Width) | - | 8 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2013 | - | e3 | yes | Active | 1 (Unlimited) | 8 | - | - | MATTE TIN | SEATED HT-CALCULATED | - | - | - | 1.6V~5.5V | DUAL | - | 225 | 1 | - | 1.27mm | - | - | NOT SPECIFIED | BR24T256 | - | - | Not Qualified | - | 5.5V | - | - | 1.6V | 2-Wire, I2C, Serial | 256Kb 32K x 8 | - | - | SYNCHRONOUS | 400kHz | - | 900 ns | EEPROM | I2C | - | - | - | - | 8 | 5ms | - | 256 kb | 0.000002A | - | - | - | - | - | - | - | - | - | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | - | - | - | - | - | - | - | - | - | - | - | - | 1010DDDR | - | - | 1.71mm | 5mm | 4.4mm | - | - | ROHS3 Compliant | Lead Free | ||
 CY7C2263KV18-550BZXI Cypress Semiconductor Corp | 2434 |
| Datasheet | 13 Weeks | - | Surface Mount | Surface Mount | 165-LBGA | - | 165 | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2003 | - | e1 | - | Active | 3 (168 Hours) | 165 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | - | - | - | 1.7V~1.9V | BOTTOM | - | 260 | 1 | 1.8V | 1mm | - | - | 30 | CY7C2263 | 165 | - | - | 1.8V | 1.9V | - | - | 1.7V | - | 36Mb 2M x 18 | 2 | 850mA | - | 550MHz | - | 450 ps | SRAM | Parallel | - | - | 3-STATE | - | 18 | - | 19b | 36 Mb | 0.36A | - | - | - | - | SEPARATE | Synchronous | 18b | - | - | - | - | - | - | - | 1.7V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4mm | 15mm | - | No | - | ROHS3 Compliant | - | ||
 CY7C1515KV18-300BZXC Cypress Semiconductor Corp | 2500 |
| Datasheet | 13 Weeks | - | Surface Mount | Surface Mount | 165-LBGA | - | 165 | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2003 | - | e1 | - | Active | 3 (168 Hours) | 165 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | - | - | - | 1.7V~1.9V | BOTTOM | - | 260 | 1 | 1.8V | 1mm | - | - | 30 | CY7C1515 | 165 | - | - | 1.8V | 1.9V | - | - | 1.7V | - | 72Mb 2M x 36 | 2 | 790mA | - | 300MHz | - | 450 ps | SRAM | Parallel | - | - | 3-STATE | - | 36 | - | 19b | 72 Mb | - | - | - | - | - | SEPARATE | Synchronous | 36b | - | - | - | - | - | - | - | 1.7V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4mm | 15mm | - | No | - | ROHS3 Compliant | Lead Free | ||
 AT28C256-15UM/883 Microchip Technology | 2979 | - | Datasheet | 23 Weeks | Lead, Tin | Through Hole | Through Hole | 28-BCPGA | - | 28 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Military grade | -55°C~125°C TC | Tray | 1997 | - | e0 | no | Active | 1 (Unlimited) | 28 | - | - | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE | - | - | - | 4.5V~5.5V | PERPENDICULAR | - | 225 | 1 | 5V | 2.54mm | - | 150GHz | 30 | AT28C256 | - | - | - | 5V | - | 5V | - | - | - | 256Kb 32K x 8 | - | 50mA | - | - | - | 150ns | EEPROM | Parallel | - | 32KX8 | 3-STATE | - | 8 | 10ms | - | 256 kb | 0.0003A | - | MIL-STD-883 Class C | - | - | - | - | - | - | 5V | - | 10000 Write/Erase Cycles | 10ms | - | - | - | - | YES | YES | NO | - | - | 64words | - | - | - | - | - | - | - | 4.4mm | 16.51mm | 13.97mm | No | - | Non-RoHS Compliant | Contains Lead | ||
 SST39VF1601-70-4I-B3KE Microchip Technology | 30 |
| Datasheet | 7 Weeks | - | - | Surface Mount | 48-TFBGA | YES | 48 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | Active | 3 (168 Hours) | 48 | - | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM BOOT BLOCK | 8542.32.00.51 | - | - | 2.7V~3.6V | BOTTOM | - | 260 | 1 | 3V | 0.8mm | - | - | 40 | SST39VF1601 | 48 | - | - | 3.3V | 3.6V | - | - | 2.7V | - | 16Mb 1M x 16 | - | 18mA | - | - | - | 70ns | FLASH | Parallel | 16b | 1MX16 | - | - | 16 | 10μs | 20b | 16 Mb | 0.00002A | - | - | - | - | - | Asynchronous | 16b | - | 2.7V | - | - | - | - | - | - | - | YES | YES | YES | 512 | 2K | - | - | BOTTOM | - | YES | - | - | - | 1.2mm | 8mm | - | No | - | ROHS3 Compliant | Lead Free | ||
 S29GL128S90TFI010 Cypress Semiconductor Corp | In Stock | - | Datasheet | 13 Weeks | Tin | Surface Mount | Surface Mount | 56-TFSOP (0.724, 18.40mm Width) | - | 56 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2012 | GL-S | e3 | - | Active | 3 (168 Hours) | 56 | - | 3A991.B.1.A | - | - | 8542.32.00.51 | - | - | 2.7V~3.6V | DUAL | - | 260 | 1 | 3V | 0.5mm | - | - | - | - | - | - | - | - | 3.6V | 3/3.3V | - | 2.7V | - | 128Mb 8M x 16 | - | 60mA | - | - | - | 90ns | FLASH | Parallel | 16b | 16MX8 | - | - | - | 60ns | 23b | 128 Mb | 0.0001A | - | - | - | - | - | Asynchronous | 16b | - | 3V | - | - | - | - | - | - | - | YES | YES | YES | 128 | 64K | 32B | YES | BOTTOM/TOP | - | YES | - | - | 1.05mm | - | 18.5mm | 14.1mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 93LC46CT-I/MC Microchip Technology | 55 | - | Datasheet | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-VFDFN Exposed Pad | - | 8 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2008 | - | e3 | yes | Active | 3 (168 Hours) | 8 | - | - | - | - | - | - | - | 2.5V~5.5V | DUAL | - | 260 | 1 | 3V | 0.5mm | - | - | 40 | 93LC46C | 8 | - | - | 5V | - | - | - | - | Serial | 1Kb 128 x 8 64 x 16 | - | 2mA | - | 3MHz | - | 200 ns | EEPROM | SPI | - | 64X16 | - | - | 16 | 6ms | - | 1 kb | 0.000001A | - | - | - | - | - | - | - | - | - | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1mm | 3mm | 2mm | No | - | ROHS3 Compliant | Lead Free | ||
 23A256-I/ST Microchip Technology | 19875 |
| Datasheet | 6 Weeks | - | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | - | 8 | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2010 | - | e3 | yes | Active | 1 (Unlimited) | 8 | - | EAR99 | Matte Tin (Sn) - annealed | - | - | - | - | 1.7V~1.95V | DUAL | - | 260 | 1 | 1.8V | 0.65mm | - | - | 40 | 23A256 | 8 | - | - | 1.8V | - | - | - | - | SPI, Serial | 256Kb 32K x 8 | 1 | 10mA | - | 20MHz | - | 32 ns | SRAM | SPI | - | - | 3-STATE | - | 8 | - | 1b | 256 kb | 5e-7A | - | - | - | - | SEPARATE | Synchronous | 8b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4.4mm | - | No | - | ROHS3 Compliant | - | ||
 CY7C1440AV33-250AXC Cypress Semiconductor Corp | 5 | - | Datasheet | - | - | Surface Mount | Surface Mount | 100-LQFP | - | 100 | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2004 | - | e3 | yes | Obsolete | 3 (168 Hours) | 100 | - | 3A991.B.2.A | Matte Tin (Sn) | PIPELINED ARCHITECTURE | - | - | - | 3.135V~3.6V | QUAD | - | 260 | 1 | 3.3V | 0.65mm | - | - | 20 | CY7C1440 | 100 | - | - | 3.3V | 3.6V | - | - | 3.135V | - | 36Mb 1M x 36 | 4 | 475mA | - | 250MHz | - | 2.6ns | SRAM | Parallel | - | 1MX36 | 3-STATE | - | 36 | - | 20b | 36 Mb | - | - | - | - | - | COMMON | Synchronous | 36b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | - | No | - | ROHS3 Compliant | Lead Free | ||
 S25FL064LABMFI010 Cypress Semiconductor Corp | 5 | - | - | 13 Weeks | - | - | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2007 | FL-L | e3 | - | Active | 3 (168 Hours) | 8 | - | - | Matte Tin (Sn) | IT ALSO HAVE X1 MEMORY WIDTH | 8542.32.00.51 | - | - | 2.7V~3.6V | DUAL | - | NOT SPECIFIED | 1 | 3V | 1.27mm | - | - | NOT SPECIFIED | - | - | S-PDSO-G8 | - | - | 3.6V | - | - | 2.7V | SPI | 64Mb 8M x 8 | - | - | SYNCHRONOUS | 108MHz | - | 6 ns | FLASH | SPI - Quad I/O, QPI | - | 16MX4 | - | - | 4 | - | - | - | - | 67108864 bit | - | - | SERIAL | - | - | - | - | 3V | - | - | - | - | - | - | 2 | - | - | - | - | - | - | - | - | 85°C | - | - | - | 2.16mm | - | 5.28mm | 5.28mm | - | - | ROHS3 Compliant | - | ||
 24AA00-I/SNG Microchip | In Stock | - | - | - | - | - | - | - | YES | - | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24AA00-I/SNG | - | 1 | 16 words | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.16 | Yes | 2.5 V | - | - | - | - | - | e3 | Yes | - | - | - | - | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | EEPROMs | CMOS | - | DUAL | GULL WING | 260 | 1 | - | 1.27 mm | compliant | - | - | - | 8 | R-PDSO-G8 | Not Qualified | - | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | - | - | - | - | SYNCHRONOUS | - | 0.003 mA | - | - | - | - | 16X8 | - | 1.75 mm | 8 | - | - | - | 0.000001 A | 128 bit | - | - | SERIAL | - | - | - | EEPROM | - | I2C | 1000000 Write/Erase Cycles | 4 ms | 200 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1010XXXR | - | - | - | 4.9 mm | 3.9 mm | - | - | - | - | ||
 24AA014H-I/MS Microchip Technology | 38 |
| Datasheet | 5 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | - | 8 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2008 | - | e3 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | - | - | - | - | - | 1.7V~5.5V | DUAL | - | 260 | 1 | 2.5V | 0.65mm | - | - | 40 | 24AA014H | 8 | - | - | 5V | - | - | - | 1.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | - | 3mA | - | 400kHz | - | 900ns | EEPROM | I2C | - | - | - | - | - | 5ms | - | 1 kb | - | - | - | - | - | - | - | - | - | - | I2C | - | 5ms | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 850μm | - | 3mm | 3mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 S25FL512SAGMFIR10 Cypress Semiconductor Corp | 3452 |
| Datasheet | 13 Weeks | - | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | - | 16 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2014 | FL-S | e3 | - | Active | 3 (168 Hours) | 16 | - | 3A991.B.1.A | Matte Tin (Sn) | - | 8542.32.00.51 | - | - | 2.7V~3.6V | DUAL | - | 260 | 1 | 3V | 1.27mm | - | - | 30 | - | - | - | - | - | 3.6V | 3/3.3V | - | 2.7V | SPI | 512Mb 64M x 8 | - | 75mA | - | 133MHz | - | 8 ns | FLASH | SPI - Quad I/O | - | 64MX8 | - | - | 8 | - | 32b | 512 Mb | 0.0001A | - | - | - | SERIAL | - | Asynchronous | - | - | 3V | SPI | 100000 Write/Erase Cycles | - | 20 | HARDWARE/SOFTWARE | - | 1 | - | - | - | - | - | 512B | - | - | 85°C | - | - | - | 2.65mm | - | 10.3mm | - | No | - | ROHS3 Compliant | - | ||
 25LC040/P Microchip Technology | 2900 |
| Datasheet | 7 Weeks | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tube | 2001 | - | e3 | yes | Active | Not Applicable | 8 | - | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | - | - | - | 2.5V~5.5V | DUAL | - | - | 1 | 2.5V | 2.54mm | - | - | - | 25LC040 | 8 | - | - | - | 5.5V | 3/5V | - | 2.5V | SPI, Serial | 4Kb 512 x 8 | - | 5mA | - | 2MHz | - | 230 ns | EEPROM | SPI | - | - | - | - | - | 5ms | - | 4 kb | 0.000002A | - | - | - | - | - | - | - | - | - | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3mm | - | 9.27mm | 6.35mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 CY62157EV30LL-45ZXIT Cypress Semiconductor Corp | 7 |
| Datasheet | 6 Weeks | - | Surface Mount | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | - | 48 | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2011 | MoBL® | e3 | yes | Active | 3 (168 Hours) | 48 | - | - | Matte Tin (Sn) | - | - | - | - | 2.2V~3.6V | DUAL | - | 260 | 1 | 3V | 0.5mm | - | 45GHz | 30 | CY62157 | - | - | - | 3V | 3.6V | - | - | 2.2V | - | 8Mb 512K x 16 | 1 | 25mA | - | - | - | - | SRAM | Parallel | - | - | 3-STATE | - | 16 | 45ns | 19b | 8 Mb | 0.000005A | - | - | 45 ns | - | COMMON | Asynchronous | 16b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | - | ROHS3 Compliant | Lead Free | ||
 MX25L1606EM2I-12G Macronix | 2386 | - | Datasheet | 16 Weeks | - | - | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2016 | MX25xxx05/06 | e3 | yes | Not For New Designs | 3 (168 Hours) | 8 | - | EAR99 | Matte Tin (Sn) - annealed | - | 8542.32.00.51 | - | - | 2.7V~3.6V | DUAL | - | NOT SPECIFIED | 1 | 3V | 1.27mm | - | - | NOT SPECIFIED | - | 8 | R-PDSO-G8 | Not Qualified | 3.6V | - | 3/3.3V | - | 2.7V | SPI, Serial | 16Mb 2M x 8 | - | - | SYNCHRONOUS | 86MHz | - | - | FLASH | SPI | - | 8MX2 | - | - | 2 | 50μs, 3ms | - | 16 Mb | 0.00002A | - | - | - | - | - | - | - | - | 2.7V | SPI | 100000 Write/Erase Cycles | - | - | HARDWARE/SOFTWARE | - | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.16mm | 5.28mm | 5.23mm | - | - | ROHS3 Compliant | Lead Free | ||
 FM24V01A-GTR Cypress Semiconductor Corp | 500 | - | - | 6 Weeks | - | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2008 | F-RAM™ | e3 | - | Active | 3 (168 Hours) | 8 | - | EAR99 | Matte Tin (Sn) | - | 8542.32.00.71 | - | - | 2V~3.6V | DUAL | - | 260 | 1 | 3.3V | 1.27mm | - | - | 30 | - | - | R-PDSO-G8 | - | - | 3.6V | - | - | 2V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | - | - | SYNCHRONOUS | 3.4MHz | - | 130ns | FRAM | I2C | - | 16KX8 | - | - | 8 | - | - | - | - | 131072 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.727mm | 4.889mm | 3.898mm | - | - | ROHS3 Compliant | - | ||
 AT28HC256-90SU Microchip Technology | 2000 |
| Datasheet | 14 Weeks | Tin | Surface Mount | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | - | 28 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TC | Tube | 1997 | - | e3 | yes | Active | 2 (1 Year) | 28 | - | - | - | - | - | - | - | 4.5V~5.5V | DUAL | - | 250 | 1 | 5V | 1.27mm | - | 90GHz | 40 | AT28HC256 | - | - | Not Qualified | 5V | - | 5V | - | - | - | 256Kb 32K x 8 | - | 80mA | ASYNCHRONOUS | - | - | 90ns | EEPROM | Parallel | - | 32KX8 | - | - | 8 | 10ms | - | 256 kb | 0.0003A | - | - | - | - | - | - | - | - | 5V | - | 10000 Write/Erase Cycles | 10ms | - | - | - | - | YES | YES | NO | - | - | 64words | - | - | - | - | - | - | - | 2.65mm | 17.9mm | 7.5mm | - | - | ROHS3 Compliant | Lead Free | ||
 24AA04T-I/MS Microchip Technology | 33000 | - | Datasheet | 14 Weeks | - | Surface Mount | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | - | 8 | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2009 | - | e3 | yes | Active | 1 (Unlimited) | 8 | - | EAR99 | Matte Tin (Sn) | - | - | - | - | 1.7V~5.5V | DUAL | - | 260 | 1 | - | 0.65mm | - | - | 40 | 24AA04 | 8 | - | - | - | 5.5V | 2/5V | - | 1.7V | I2C, Serial | 4Kb 256 x 8 x 2 | - | 3mA | - | 400kHz | - | 900ns | EEPROM | I2C | - | - | - | - | 8 | 5ms | - | 4 kb | 0.000001A | - | - | - | - | - | - | - | - | - | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | - | - | - | - | - | - | - | - | - | - | - | - | 1010XXMR | NO | - | 1.1mm | 3mm | 3mm | No | - | ROHS3 Compliant | Lead Free |