- Manufacturer
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
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- Programmable Type
- Voltage - Supply
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- Number of Terminations
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Categories
Memory - Configuration Proms for FPGAs
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Usage Level | Operating Temperature | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Programmable Type | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Organization | Output Characteristics | Memory Width | Density | Standby Current-Max | Memory Density | Max Frequency | Access Time (Max) | Parallel/Serial | I/O Type | Memory IC Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XC17V16PC44C Xilinx Inc. | 5 | - | Datasheet | - | - | - | Surface Mount | 44-LCC (J-Lead) | YES | 44 | - | - | - | - | 0°C~70°C | Tube | 1998 | e0 | no | Obsolete | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | - | 8542.32.00.71 | 3V~3.6V | QUAD | J BEND | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC17V16 | 44 | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | - | - | - | - | 20MHz | - | 2MX8 | 3-STATE | 8 | 16 Mb | 0.001A | - | - | - | PARALLEL/SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.57mm | 16.5862mm | 16.5862mm | No | Non-RoHS Compliant | Contains Lead | ||
 XC17V01PC20C Xilinx Inc. | 30 | - | Datasheet | - | - | - | Surface Mount | 20-LCC (J-Lead) | YES | 20 | - | - | - | - | 0°C~70°C | Tube | 1998 | e0 | no | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | - | 8542.32.00.61 | 3V~3.6V | QUAD | J BEND | 225 | 1 | 3.3V | 1.27mm | not_compliant | - | 30 | XC17V01 | 20 | Not Qualified | - | 3.6V | 3.3V | 3V | OTP | - | - | - | 1Mb | - | - | SYNCHRONOUS | 15MHz | - | 1MX1 | 3-STATE | 1 | - | 0.001A | 1048576 bit | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.572mm | 8.9662mm | 8.9662mm | - | Non-RoHS Compliant | Contains Lead | ||
 AT17LV256-10JI Microchip Technology | In Stock | - | Datasheet | - | - | Surface Mount | Surface Mount | 20-LCC (J-Lead) | - | 20 | 20-PLCC (9x9) | - | EEPROM | - | -40°C~85°C | Tube | 1997 | - | - | Obsolete | 2 (1 Year) | - | - | - | 85°C | -40°C | - | - | 3V~3.6V 4.5V~5.5V | - | - | - | - | - | - | - | 12.5MHz | - | AT17LV256 | - | - | - | - | - | - | Serial EEPROM | 2-Wire, Serial | 5.5V | 4.5V | 256Kb | - | 10mA | - | - | - | - | - | - | 256 kb | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
 AT17LV256-10SU Microchip Technology | 20 | - | Datasheet | 1 Weeks | - | Surface Mount | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | - | 20 | - | - | EEPROM | Industrial grade | -40°C~85°C | Tube | 1997 | e3 | yes | Active | 1 (Unlimited) | 20 | - | Matte Tin (Sn) | - | - | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | - | 3V~3.6V 4.5V~5.5V | DUAL | GULL WING | 250 | 1 | 3.3V | 1.27mm | - | 33MHz | 40 | AT17LV256 | - | - | 5V | 3.6V | 3.3V | 3V | Serial EEPROM | 2-Wire, Serial | - | - | 256Kb | 10mA | 10mA | - | - | - | 256KX1 | - | - | 256 kb | 0.00015A | - | - | 80 ns | - | - | - | 100000 Write/Erase Cycles | - | 90 | HARDWARE | 2.35mm | - | 13mm | 7.6mm | No | ROHS3 Compliant | Lead Free | ||
XC17128EPC20I Xilinx Inc. | 919 | - | Datasheet | - | - | - | Surface Mount | 20-LCC (J-Lead) | YES | 20 | - | - | - | - | -40°C~85°C | Tube | 2000 | e0 | - | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.61 | 4.5V~5.5V | QUAD | J BEND | 225 | 1 | 5V | 1.27mm | not_compliant | - | 30 | XC17128E | 20 | Not Qualified | - | 5.5V | 5V | 4.5V | OTP | - | - | - | 128kb | - | - | SYNCHRONOUS | 15MHz | - | 128KX1 | 3-STATE | 1 | - | 0.00005A | 131072 bit | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.572mm | 8.9662mm | 8.9662mm | - | Non-RoHS Compliant | Contains Lead | ||
 XC17S150APD8I Xilinx Inc. | 8 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | - | -40°C~85°C | Tube | 1999 | e0 | no | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | - | - | 3V~3.6V | DUAL | - | 225 | 1 | 3.3V | 2.54mm | - | - | 30 | XC17S150A | 8 | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | 1.5Mb | - | - | - | - | - | 1040096X1 | 3-STATE | 1 | 1 Mb | 0.00005A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | No | Non-RoHS Compliant | Contains Lead | ||
XC18V512SO20I Xilinx Inc. | 8680 | - | Datasheet | - | - | - | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | - | - | - | - | -40°C~85°C | Tube | 1999 | e0 | no | Obsolete | 1 (Unlimited) | 20 | 3A991.B.1.A | Tin/Lead (Sn85Pb15) | - | - | - | 8542.32.00.71 | 3V~3.6V | DUAL | GULL WING | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC18V512 | 20 | - | 3.3V | 3.6V | - | 3V | In System Programmable | - | - | - | - | - | - | - | 33MHz | - | 64KX8 | - | 8 | 512 kb | 0.01A | - | - | 15 ns | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | 10000 Write/Erase Cycles | - | 10 | - | - | 2.65mm | 12.8mm | 7.5mm | No | Non-RoHS Compliant | Contains Lead | ||
 XC18V02VQ44C Xilinx Inc. | 50780 | - | Datasheet | 10 Weeks | - | - | Surface Mount | 44-TQFP | YES | 44 | - | - | - | - | 0°C~70°C | Tray | 1998 | e0 | no | Active | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | - | - | 3V~3.6V | QUAD | GULL WING | 225 | 1 | 3.3V | 0.8mm | - | - | 30 | XC18V02 | 44 | - | 3.3V | 3.6V | - | 3V | In System Programmable | - | - | - | - | - | - | - | 20MHz | - | 256KX8 | - | 8 | 2 Mb | 0.01A | - | - | 20 ns | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | 20000 Write/Erase Cycles | - | 20 | - | - | 1.2mm | 10mm | 10mm | No | Non-RoHS Compliant | Contains Lead | ||
XC17S30APD8I Xilinx Inc. | 741 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | - | -40°C~85°C | Tube | 1999 | e0 | no | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | - | - | 3V~3.6V | DUAL | - | 225 | 1 | 3.3V | 2.54mm | - | - | 30 | XC17S30 | 8 | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | 300kb | - | - | - | - | - | - | 3-STATE | 1 | 512 kb | 0.00005A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | No | Non-RoHS Compliant | Contains Lead | ||
XC1736EPD8I Xilinx Inc. | 20 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | - | -40°C~85°C | Tube | 2000 | e0 | - | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | - | 4.5V~5.5V | DUAL | - | 225 | 1 | 5V | 2.54mm | - | - | 30 | XC1736E | 8 | - | 5V | - | 5V | - | OTP | - | - | - | 36kb | - | - | - | 10MHz | 0.01mA | - | 3-STATE | 1 | - | 0.00005A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | No | Non-RoHS Compliant | Contains Lead | ||
XC17S30XLPD8I Xilinx Inc. | 5048 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | - | -40°C~85°C | Tube | 1999 | e0 | - | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | - | - | 3V~3.6V | DUAL | - | - | 1 | 3.3V | 2.54mm | not_compliant | - | - | XC17S30XL | 8 | Not Qualified | - | 3.6V | 3.3V | 3V | OTP | - | - | - | 300kb | - | - | SYNCHRONOUS | 10MHz | - | - | 3-STATE | 1 | - | 0.00005A | - | - | - | - | COMMON | MEMORY CIRCUIT | - | - | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | - | Non-RoHS Compliant | Contains Lead | ||
XC17S100ASO20C Xilinx Inc. | 673 | - | Datasheet | - | - | - | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | - | - | - | - | 0°C~70°C | Tube | 1999 | e0 | no | Obsolete | 1 (Unlimited) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | - | 8542.32.00.71 | 3V~3.6V | DUAL | GULL WING | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC17S100A | 20 | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | - | - | - | - | - | - | 781216X1 | 3-STATE | 1 | 1 Mb | 0.001A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 2.65mm | 12.8mm | 7.5mm | No | Non-RoHS Compliant | Contains Lead | ||
 XC17S20VO8I Xilinx Inc. | 613 | - | Datasheet | - | - | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | - | - | - | - | -40°C~85°C | Tube | 1999 | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | - | - | - | - | - | 4.5V~5.5V | DUAL | GULL WING | 225 | 1 | 5V | 1.27mm | not_compliant | - | 30 | XC17S20 | 8 | Not Qualified | - | 5.5V | 5V | 4.5V | OTP | - | - | - | 200kb | - | - | SYNCHRONOUS | 10MHz | - | - | 3-STATE | 1 | - | 0.00005A | - | - | - | - | COMMON | MEMORY CIRCUIT | - | - | - | - | - | 1.2mm | 4.9mm | 3.9mm | - | Non-RoHS Compliant | Contains Lead | ||
AT17F16-30JU Microchip Technology | 55 |
| Datasheet | 17 Weeks | - | - | Surface Mount | 20-LCC (J-Lead) | YES | 20 | - | - | - | Industrial grade | -40°C~85°C | Tube | 1997 | e3 | yes | Active | 2 (1 Year) | 20 | - | Matte Tin (Sn) - annealed | - | - | - | - | 2.97V~3.63V | QUAD | J BEND | 245 | 1 | 3.3V | 1.27mm | - | - | 40 | AT17F16 | - | Not Qualified | - | 3.63V | - | 2.97V | FLASH | - | - | - | 16Mb | - | - | SYNCHRONOUS | 33MHz | - | 16MX1 | - | 1 | - | - | 16777216 bit | - | - | SERIAL | - | CONFIGURATION MEMORY | - | 0.03ms | - | - | - | 4.572mm | 8.9662mm | 8.9662mm | - | ROHS3 Compliant | Lead Free | ||
XC17S50APDG8C Xilinx Inc. | 791 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | - | 0°C~70°C | Tube | 1999 | e3 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | - | - | - | - | 3V~3.6V | DUAL | - | 250 | 1 | 3.3V | 2.54mm | - | - | 30 | XC17S50A | 8 | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | 500kb | - | - | - | - | - | 559200X1 | 3-STATE | 1 | 1 Mb | 0.001A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | No | RoHS Compliant | - | ||
 AT17LV256-10NI Microchip Technology | In Stock | - | Datasheet | - | - | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | - | 8 | 8-SOIC | - | EEPROM | - | -40°C~85°C | Tube | 1997 | - | - | Obsolete | 1 (Unlimited) | - | - | - | 85°C | -40°C | - | - | 3V~3.6V 4.5V~5.5V | - | - | - | - | - | - | - | - | - | AT17LV256 | - | - | - | - | - | - | Serial EEPROM | 2-Wire, Serial | 5.5V | 4.5V | 256Kb | 10mA | 10mA | - | - | - | - | - | - | 256 kb | - | - | 12.5MHz | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
AT17F040A-30JU Microchip Technology | 20 |
| Datasheet | 17 Weeks | Tin | Surface Mount | Surface Mount | 20-LCC (J-Lead) | - | 20 | - | 722.005655mg | - | Industrial grade | -40°C~85°C | Tube | 1997 | e3 | yes | Active | 2 (1 Year) | 20 | - | - | - | - | - | - | 2.97V~3.63V | QUAD | J BEND | 245 | 1 | 3.3V | 1.27mm | - | 10MHz | 40 | AT17F040A | - | Not Qualified | 3.3V | 3.63V | - | 2.97V | FLASH | 2-Wire, Serial | - | - | - | 50mA | 50mA | SYNCHRONOUS | - | - | 4MX1 | - | - | 4 Mb | - | - | - | - | - | - | CONFIGURATION MEMORY | - | 0.03ms | - | - | 3.68mm | - | 9.04mm | 9.04mm | - | ROHS3 Compliant | Lead Free | ||
XC17S150ASO20C Xilinx Inc. | 988 | - | Datasheet | - | - | - | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | - | - | - | - | 0°C~70°C | Tube | 1999 | e0 | no | Obsolete | 1 (Unlimited) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | - | 8542.32.00.71 | 3V~3.6V | DUAL | GULL WING | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC17S150A | 20 | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | 1.5Mb | - | - | - | - | - | 1040096X1 | 3-STATE | 1 | 1 Mb | 0.00005A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 2.65mm | 12.8mm | 7.5mm | No | Non-RoHS Compliant | Contains Lead | ||
XC17512LPC20I Xilinx Inc. | 30 | - | Datasheet | - | - | - | Surface Mount | 20-LCC (J-Lead) | YES | 20 | - | - | - | - | -40°C~85°C | Tube | 2000 | e0 | no | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.39.00.01 | 3V~3.6V | QUAD | J BEND | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC17512L | 20 | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | - | - | - | - | 15MHz | 0.005mA | 512KX1 | 3-STATE | 1 | 512 kb | 0.00005A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | 4.572mm | 8.9662mm | 8.9662mm | No | Non-RoHS Compliant | Contains Lead | ||
XC17256EVO8C Xilinx Inc. | 2900 | - | Datasheet | - | - | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | - | - | - | - | 0°C~70°C | Tube | 2000 | e0 | - | Obsolete | 1 (Unlimited) | 8 | EAR99 | - | - | - | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | - | 4.75V~5.25V | DUAL | GULL WING | 225 | 1 | 5V | 1.27mm | not_compliant | - | 30 | XC17256E | 8 | Not Qualified | - | 5.25V | 5V | 4.75V | OTP | Serial | - | - | 256Kb | - | - | SYNCHRONOUS | 15MHz | - | 256KX1 | 3-STATE | 1 | - | 0.00005A | 262144 bit | - | - | - | COMMON | CONFIGURATION MEMORY | - | - | - | - | - | - | 4.9276mm | 3.937mm | - | Non-RoHS Compliant | Contains Lead |