- Manufacturer
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Programmable Type
- Voltage - Supply
- RoHS Status
- Number of Functions
- Number of Terminations
- Supply Voltage
Attribute column
Categories
Memory - Configuration Proms for FPGAs
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Programmable Type | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Organization | Output Characteristics | Memory Width | Density | Standby Current-Max | Memory Density | Max Frequency | Access Time (Max) | Parallel/Serial | I/O Type | Memory IC Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XCF02SVO20C Xilinx Inc. | 2000 | - | Datasheet | 10 Weeks | Lead, Tin | Surface Mount | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | - | 20 | - | - | - | -40°C~85°C | Tube | 1999 | - | e0 | no | Active | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | - | - | 3V~3.6V | DUAL | GULL WING | 225 | 1 | 3.3V | 0.65mm | - | - | 30 | XCF*S | 20 | - | - | 3.3V | 3.6V | - | 3V | In System Programmable | - | - | - | 2Mb | - | - | - | - | - | 2MX1 | - | 1 | - | 0.001A | - | - | - | SERIAL | - | CONFIGURATION MEMORY | - | - | 20 | 1.19mm | 6.5024mm | 4.4mm | No | Non-RoHS Compliant | Contains Lead | ||
 XC18V256PC20C Xilinx Inc. | 845 | - | Datasheet | - | - | - | Surface Mount | 20-LCC (J-Lead) | YES | 20 | - | - | - | 0°C~70°C | Tube | 1999 | - | e0 | - | Obsolete | 3 (168 Hours) | 20 | 3A991.B.1.A | Tin/Lead (Sn85Pb15) | - | - | - | 8542.39.00.01 | 3V~3.6V | QUAD | J BEND | - | 1 | 3.3V | 1.27mm | - | - | - | XC18V256 | 20 | - | - | 3.3V | 3.6V | - | 3V | In System Programmable | - | - | - | 256Kb | - | - | - | 33MHz | - | 32KX8 | - | 8 | 256 kb | 0.01A | - | - | 15 ns | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | 10000 Write/Erase Cycles | - | 10 | 4.572mm | 8.9662mm | 8.9662mm | No | Non-RoHS Compliant | Contains Lead | ||
 XC17S05PD8I Xilinx Inc. | 5000 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | -40°C~85°C | Tube | 1999 | - | e0 | - | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | - | - | 4.5V~5.5V | DUAL | - | - | 1 | 5V | 2.54mm | not_compliant | - | - | XC17S05 | 8 | - | Not Qualified | - | 5.5V | 5V | 4.5V | OTP | - | - | - | 50kb | - | - | SYNCHRONOUS | 10MHz | - | - | 3-STATE | 1 | - | 0.00005A | - | - | - | - | COMMON | MEMORY CIRCUIT | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | - | Non-RoHS Compliant | Contains Lead | ||
 AT17LV128-10SI Microchip Technology | In Stock | - | Datasheet | - | - | Surface Mount | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | - | 20 | 20-SOIC | EEPROM | - | -40°C~85°C | Tube | 1997 | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | 85°C | -40°C | - | - | 3V~3.6V 4.5V~5.5V | - | - | - | - | - | - | - | - | - | AT17LV128 | - | - | - | - | - | - | - | Serial EEPROM | 2-Wire, Serial | 5.5V | 4.5V | 128kb | 10mA | 10mA | - | - | - | - | - | - | 128 kb | - | - | 12.5MHz | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
XC17V02PC20I Xilinx Inc. | 334 | - | Datasheet | - | - | - | Surface Mount | 20-LCC (J-Lead) | YES | 20 | - | - | - | -40°C~85°C | Tube | 1998 | - | e0 | no | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | - | 8542.32.00.61 | 3V~3.6V | QUAD | J BEND | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC17V02 | 20 | - | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | - | - | - | - | 15MHz | 0.015mA | 2MX1 | 3-STATE | 1 | 2 Mb | 0.001A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | 4.572mm | 8.9662mm | 8.9662mm | No | Non-RoHS Compliant | Contains Lead | ||
 XC17S10VO8I Xilinx Inc. | 608 | - | Datasheet | - | - | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | - | - | - | -40°C~85°C | Tube | 1999 | - | e0 | - | Obsolete | 1 (Unlimited) | 8 | EAR99 | - | - | - | - | - | 4.5V~5.5V | DUAL | GULL WING | - | 1 | 5V | 1.27mm | not_compliant | - | - | XC17S10 | 8 | - | Not Qualified | - | 5.5V | 5V | 4.5V | OTP | - | - | - | 100kb | - | - | SYNCHRONOUS | 10MHz | - | - | 3-STATE | 1 | - | 0.00005A | - | - | - | - | COMMON | MEMORY CIRCUIT | - | - | - | 1.2mm | 4.9mm | 3.9mm | - | Non-RoHS Compliant | Contains Lead | ||
 AT17F16A-30CU Microchip Technology | 55 |
| Datasheet | 17 Weeks | Gold | Surface Mount | Surface Mount | 8-TDFN | - | 8 | - | - | - | -40°C~85°C | Tube | 1997 | - | e4 | yes | Active | 3 (168 Hours) | 8 | - | - | - | - | - | - | 2.97V~3.63V | DUAL | - | 260 | 1 | 3.3V | 1.27mm | - | 10MHz | 40 | AT17F16A | - | - | - | 3.3V | 3.63V | - | 2.97V | FLASH | 2-Wire, Serial | - | - | - | - | 50mA | - | - | - | 16MX1 | - | 1 | 16 Mb | - | - | - | - | - | - | CONFIGURATION MEMORY | - | 0.03ms | - | 1.14mm | 5.99mm | 5.99mm | No | ROHS3 Compliant | Lead Free | ||
 XC18V256VQ44I Xilinx Inc. | 206 | - | Datasheet | - | - | - | Surface Mount | 44-TQFP | YES | 44 | - | - | - | -40°C~85°C | Tray | 1999 | - | - | - | Obsolete | 3 (168 Hours) | 44 | 3A991.B.1.A | - | - | - | - | 8542.39.00.01 | 3V~3.6V | QUAD | GULL WING | - | 1 | 3.3V | 0.8mm | - | - | - | XC18V256 | 44 | - | - | 3.3V | 3.6V | - | 3V | In System Programmable | - | - | - | 256Kb | - | - | - | 33MHz | - | 32KX8 | - | 8 | 256 kb | 0.01A | - | - | 15 ns | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | 10000 Write/Erase Cycles | - | 10 | 1.2mm | 10mm | 10mm | No | Non-RoHS Compliant | Contains Lead | ||
XC1736EPC20I Xilinx Inc. | 183 | - | Datasheet | - | - | - | Surface Mount | 20-LCC (J-Lead) | YES | 20 | - | - | - | -40°C~85°C | Tube | 2000 | - | e0 | - | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | - | - | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.61 | 4.5V~5.5V | QUAD | J BEND | 225 | 1 | 5V | 1.27mm | not_compliant | - | 30 | XC1736E | 20 | - | Not Qualified | - | 5.5V | 5V | 4.5V | OTP | - | - | - | 36kb | - | - | SYNCHRONOUS | 10MHz | 0.01mA | 36288X1 | 3-STATE | 1 | - | 0.00005A | 36288 bit | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | 4.572mm | 8.9662mm | 8.9662mm | - | Non-RoHS Compliant | Contains Lead | ||
XC17S200APD8I Xilinx Inc. | 955 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | -40°C~85°C | Tube | 1999 | - | e0 | no | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | - | - | 3V~3.6V | DUAL | - | 225 | 1 | 3.3V | 2.54mm | - | - | 30 | XC17S200A | 8 | - | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | 2Mb | - | - | - | - | - | - | 3-STATE | 1 | - | 0.001A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | No | Non-RoHS Compliant | Contains Lead | ||
 EPC1441TI32 Intel | In Stock | - | Datasheet | - | - | - | Surface Mount | 32-TQFP | YES | - | - | - | - | -40°C~85°C | Tray | - | EPC | e0 | - | Obsolete | 3 (168 Hours) | 32 | EAR99 | TIN LEAD | - | - | IT CAN ALSO OPERATE AT 5V SUPPLY | 8542.32.00.61 | 3V~3.6V 4.75V~5.25V | QUAD | GULL WING | 235 | 1 | 3.3V | 0.8mm | compliant | - | 30 | EPC1441 | - | S-PQFP-G32 | Not Qualified | - | 3.6V | 3.3/5V | 3V | OTP | - | - | - | 440kb | - | - | SYNCHRONOUS | 10MHz | 0.03mA | 440800X1 | 3-STATE | 1 | - | - | 440800 bit | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | 1.2mm | 7mm | 7mm | - | Non-RoHS Compliant | - | ||
AT17LV512-10CC Microchip Technology | 58 |
| Datasheet | - | - | Surface Mount | Surface Mount | 8-TDFN | - | 8 | 8-LAP (6x6) | EEPROM | - | 0°C~70°C | Tube | 1997 | - | - | - | Active | 3 (168 Hours) | - | - | - | 70°C | 0°C | - | - | 3V~3.6V 4.75V~5.25V | - | - | - | - | - | - | - | 15MHz | - | AT17LV512 | - | - | - | - | - | - | - | Serial EEPROM | Serial | 5.5V | 4.5V | 512kb | - | 10mA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
XC18V01SO20I Xilinx Inc. | 369 | - | Datasheet | - | - | - | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | - | - | - | -40°C~85°C | Tube | 1998 | - | e0 | no | Obsolete | 1 (Unlimited) | 20 | 3A001.B.1.A | Tin/Lead (Sn85Pb15) | - | - | - | 8542.32.00.71 | 3V~3.6V | DUAL | GULL WING | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC18V01 | 20 | - | - | 3.3V | 3.6V | - | 3V | In System Programmable | - | - | - | - | - | - | - | 33MHz | - | 128KX8 | - | 8 | 1 Mb | 0.01A | - | - | 15 ns | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | 10000 Write/Erase Cycles | - | 10 | 2.65mm | 12.8mm | 7.5mm | No | Non-RoHS Compliant | Contains Lead | ||
XC17S20PD8C Xilinx Inc. | 1150 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | 0°C~70°C | Tube | 1999 | - | e0 | no | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | - | - | 4.75V~5.25V | DUAL | - | 225 | 1 | 5V | 2.54mm | not_compliant | - | 30 | XC17S20 | 8 | - | Not Qualified | - | 5.25V | 5V | 4.75V | OTP | - | - | - | 200kb | - | - | SYNCHRONOUS | 10MHz | - | - | 3-STATE | 1 | - | 0.00005A | - | - | - | - | COMMON | MEMORY CIRCUIT | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | - | Non-RoHS Compliant | Contains Lead | ||
 EPCE4QC100N Intel | In Stock | - | Datasheet | - | - | - | Surface Mount | 100-BQFP | YES | - | - | - | - | 0°C~70°C | Tray | - | EPC | e3 | - | Obsolete | 3 (168 Hours) | 100 | - | MATTE TIN | - | - | - | 8542.32.00.51 | 3V~3.6V | QUAD | GULL WING | NOT SPECIFIED | 1 | 3.3V | 0.65mm | compliant | - | NOT SPECIFIED | EPCE4 | - | R-PQFP-G100 | - | - | 3.6V | - | 3V | In System Programmable | - | - | - | 4MB | - | - | SYNCHRONOUS | - | - | 4MX1 | - | 1 | - | - | 4194304 bit | - | - | PARALLEL | - | CONFIGURATION MEMORY | - | - | - | 3.4mm | 20mm | 14mm | - | RoHS Compliant | - | ||
XC17S200AVO8C Xilinx Inc. | 20 | - | Datasheet | - | - | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | - | - | - | 0°C~70°C | Tube | 1999 | - | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | - | - | - | - | - | 3V~3.6V | DUAL | GULL WING | 225 | 1 | 3.3V | 1.27mm | - | - | 30 | XC17S200A | 8 | - | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | 2Mb | - | - | - | - | - | - | 3-STATE | 1 | - | 0.001A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | 1.2mm | 4.9mm | 3.9mm | No | Non-RoHS Compliant | Contains Lead | ||
AT17LV512A-10PC Microchip Technology | In Stock | - | Datasheet | - | - | Through Hole | Through Hole | 8-DIP (0.300, 7.62mm) | - | 8 | 8-PDIP | EEPROM | Commercial grade | 0°C~70°C | Tube | 1997 | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | 70°C | 0°C | - | - | 3V~3.6V 4.75V~5.25V | - | - | - | - | - | - | - | 15MHz | - | AT17LV512A | - | - | - | - | - | - | - | Serial EEPROM | 2-Wire, Serial | 5.5V | 4.5V | 512kb | - | 10mA | - | - | - | - | - | - | 512 kb | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
XC17S200APDG8C Xilinx Inc. | 747 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | 0°C~70°C | Tube | 1999 | - | e3 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | - | - | - | - | 3V~3.6V | DUAL | - | 250 | 1 | 3.3V | 2.54mm | - | - | 30 | XC17S200A | 8 | - | - | 3.3V | 3.6V | - | 3V | OTP | - | - | - | 2Mb | - | - | - | - | - | - | 3-STATE | 1 | - | 0.001A | - | - | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | No | RoHS Compliant | - | ||
AT17LV512-10SI Microchip Technology | 23000 |
| Datasheet | - | - | Surface Mount | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | - | 20 | 20-SOIC | EEPROM | - | -40°C~85°C | Tube | 1997 | - | - | - | Active | 1 (Unlimited) | - | - | - | 85°C | -40°C | - | - | 3V~3.6V 4.5V~5.5V | - | - | - | - | - | - | - | - | - | AT17LV512 | - | - | - | - | - | - | - | Serial EEPROM | Serial | 5.5V | 4.5V | 512kb | 10mA | - | - | - | - | - | - | - | - | - | - | 15MHz | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
XC17S30PD8I Xilinx Inc. | 300 | - | Datasheet | - | - | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | - | - | - | -40°C~85°C | Tube | 1999 | - | e0 | no | Obsolete | Not Applicable | 8 | EAR99 | - | - | - | - | - | 4.5V~5.5V | DUAL | - | 225 | 1 | 5V | 2.54mm | - | - | 30 | XC17S30 | 8 | - | - | 5V | - | 5V | - | OTP | - | - | - | 300kb | - | - | - | 10MHz | - | - | 3-STATE | 1 | - | 0.00005A | - | - | - | - | COMMON | MEMORY CIRCUIT | - | - | - | 4.5974mm | 9.3599mm | 7.62mm | No | Non-RoHS Compliant | Contains Lead |