- Manufacturer
- Mounting Type
- Package / Case
- Packaging
- Applications
- Moisture Sensitivity Level (MSL)
- Part Status
- Operating Temperature
- RoHS Status
- Voltage - Supply
- Length
- Width
- Terminal Position
Attribute column
Categories
PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Operating Temperature | Packaging | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Applications | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Adjustable Threshold | Current - Supply | Telecom IC Type | Height Seated (Max) | Length | Width | RoHS Status |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() MC32PF1550A5EPR2 NXP USA Inc. | 16 |
| - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC34PF1550A8EPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
![]() MC32PF1510A6EP NXP USA Inc. | 468 | - | Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C TA | Tray | - | Active | 3 (168 Hours) | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MWCT1012VLFR NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 48-LQFP | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | Wireless Power Transmitter | 3V~3.6V | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.7mA | TELECOM CIRCUIT | - | - | - | ROHS3 Compliant | ||
![]() MC32PF1550A9EP NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C TA | Tray | - | Active | 3 (168 Hours) | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
![]() MC32PF8121F1EPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | Industrial, IoT | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
![]() MC32PF4210A2ES NXP USA Inc. | 25 |
| Datasheet | 12 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | 0°C~85°C TA | Tray | - | Active | 3 (168 Hours) | - | Audio, Video | 2.8V~4.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8101A0ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8 Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PT2001MAER2 NXP USA Inc. | 9 |
| Datasheet | 28 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | -40°C~125°C TA | - | Automotive, AEC-Q100 | Active | - | - | Automotive, Solenoid Controller | 0V~72V | - | - | - | - | - | - | - | - | - | - | - | ANALOG CIRCUIT | - | - | - | - | - | - | - | ||
![]() MC34PF8100EREPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
![]() MC34PF8100CHEPR2 NXP USA Inc. | 9 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
![]() MC33PF8100A0ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8100EQESR2 NXP USA Inc. | 4000 | - | Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | YES | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 56 | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | QUAD | NO LEAD | - | 1 | 5V | 0.5mm | - | S-PQCC-N56 | 5.5V | 2.5V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | - | - | 1mm | 8mm | 8mm | - | ||
![]() MC33PF8100ERESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC34VR500VAES NXP USA Inc. | 100000 | - | Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | QorlQ LS1/T1 Communications Processors | 2.8V~4.5V | - | - | - | - | - | - | - | - | - | - | - | - | - | 15mA | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8200A0ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8200DEESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8200DFESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8200CXESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
![]() MC33PF8200DHESR2 NXP USA Inc. | 100000 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - |