- Manufacturer
- Mounting Type
- Package / Case
- Packaging
- Applications
- Moisture Sensitivity Level (MSL)
- Part Status
- Operating Temperature
- RoHS Status
- Voltage - Supply
- Length
- Width
- Terminal Position
Attribute column
Categories
PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Operating Temperature | Packaging | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Applications | Voltage - Supply | Terminal Position | Terminal Form | Number of Functions | Supply Voltage | Terminal Pitch | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Adjustable Threshold | Telecom IC Type | Height Seated (Max) | Length | Width | RoHS Status |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() MC32PF1550A8EP NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C TA | Tray | - | Active | 3 (168 Hours) | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ||
![]() MC32PF8121F2EPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | Industrial, IoT | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ||
![]() MC32PF8121EUEPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | Industrial, IoT | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ||
![]() MC33PT2001AER2 NXP USA Inc. | 3000 | - | Datasheet | 28 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | -40°C~125°C TA | - | Automotive, AEC-Q100 | Active | - | - | Automotive, Solenoid Controller | 0V~72V | - | - | - | - | - | - | - | - | - | ANALOG CIRCUIT | - | - | - | - | - | - | ||
![]() MC33VR5500V1ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | - | - | - | - | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33VR5500V0ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | - | - | - | - | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MWCT1R24ZVHT NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | - | - | - | - | Tray | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | ||
![]() MC34PF8100EPEPR2 NXP USA Inc. | 100000 | - | Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC34PF8100CFEPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC34PF8100A0EPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ||
![]() MC34PF8100CCEPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8100CHESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC34PF8100EQEPR2 NXP USA Inc. | 25 | - | Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC34PF8100F3EPR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8100EPESR2 NXP USA Inc. | 10000 | - | Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | YES | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 56 | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | QUAD | NO LEAD | 1 | 5V | 0.5mm | S-PQCC-N56 | 5.5V | 2.5V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | - | 1mm | 8mm | 8mm | - | ||
![]() MC33PF8100EAESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | ROHS3 Compliant | ||
![]() MWPR1024IZVHT NXP USA Inc. | 9 |
| Datasheet | 2 Weeks | - | - | - | - | Tray | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RF AND BASEBAND CIRCUIT | - | - | - | - | ||
![]() MC33PF8200EMESR2 NXP USA Inc. | 100000 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC33PF8200D2ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ||
![]() MC33PF8100CEES NXP USA Inc. | In Stock | - | - | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |