Filters
  • Manufacturer
    • Swissbit
    • Apacer
    • Kingston
    • Advantech
    • Western Digital Corporation
    • Micron Technology
    • SanDisk
    • Samsung
    • FLEx
    • Transcend
    • TDK
    • Panasonic
    • Smart Global Holdings
    • Corsair
    • XKB Connectivity
    • Phoenix Contact
    • Greenliant
    • Viking Tech
    • Silicon Power
    • Exar Corporation
    • Analog Devices, Inc.
    • Microsemi
    • ISSI
    • Microchip
    • Adafruit
    • Kioxia
    • CIT
    • SparkFun
    • Eaton
    • Epson
    • HARTING
    • WAGO
    • E2V
    • Olimex
    • Omron
    • PNY Technologies
    • Raspberry Pi
    • Red Lion
    • Apex Tool Group
    • Parallax
    • Terasic Technologies
    • Toshiba
    • AMD
    • Bridgetek
    • DFRobot
    • Digilent
    • FTDI
    • KOA Speer
    • Philips
    • Schneider
    • Xilinx
    • ABB
    • Advanced Chemistry & Technology Inc
    • Alliance Memory
    • Atmel
    • Brady Corporation
    • Digi
    • IDEC
    • Keystone Electronics Corp
    • Maxim Integrated
    • MikroElektronika
    • Molex
    • Pi Supply
    • Rochester Electronics
    • Seeed
    • Siemens
    • TE Connectivity
    • Tripp Lite
    • Winchester
    • Xeltek
    • Yageo
  • Memory Size
  • Series
  • Part Status
  • RoHS Status
  • Memory Types
  • Operating Temperature
  • Factory Lead Time
  • Moisture Sensitivity Level (MSL)
  • Speed
  • JESD-30 Code
  • Published
  • Terminal Position

Attribute column

Categories

Memory Cards

View Mode:
4503 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Lifecycle Status

Mount

Surface Mount

Number of Pins

Number of Terminals

Access Time-Max

Card

CAS Latency

Chip Configuration

Chip Density (bit)

Chip Density (byte)

Chip Package Type

Clock Frequency-Max (fCLK)

Data Bus Width (bit)

ECC Support

ECCN (US)

HTS

Ihs Manufacturer

Interface Type

Lead Shape

Manufacturer

Manufacturer Part Number

Max. Access Time (ns)

Maximum Clock Rate (MHz)

Maximum Operating Supply Voltage (V)

Maximum Operating Temperature (°C)

Minimum Operating Supply Voltage (V)

Minimum Operating Temperature (°C)

Module

Module Density

Module Sides

Mounting

Number of Elements

Number of Chip Banks

Number of Chip per Module

Number of Ranks

Number of Words

Number of Words Code

Operating Current (mA)

Operating Temperature-Max

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Height

Package Length

Package Shape

Package Style

Package Width

Part Life Cycle Code

Part Package Code

PC Type

PCB changed

Pins

Programmability

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Schedule B

SPD EEPROM Support

Standard Package Name

Supplier Package

Supplier Temperature Grade

Supply Voltage-Nom (Vsup)

Typical Operating Supply Voltage (V)

Packaging

Part Status

ECCN Code

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Voltage

Max Supply Voltage

Min Supply Voltage

Number of Ports

Speed

Operating Mode

Supply Current-Max

Access Time

Data Bus Width

Organization

Output Characteristics

Seated Height-Max

Memory Width

Standby Current-Max

Memory Density

Max Frequency

PLL

I/O Type

Memory IC Type

Capacity

Refresh Cycles

Access Mode

Self Refresh

Module Type

Length

Width

Radiation Hardening

RoHS Status

MT18JDF1G72PDZ-1G6D1
MT18JDF1G72PDZ-1G6D1

Micron Technology

In Stock

-

Datasheet

-

-

Socket

NO

240

240

-

-

11

512Mx8

4G

-

-

-

72

Yes

EAR99

-

MICRON TECHNOLOGY INC

-

No Lead

Micron Technology Inc

MT18JDF1G72PDZ-1G6D1

-

1600

1.575

70

1.425

0

DRAM Module

8Gbyte

Double

Socket

18

8

18

Dual

1073741824 words

1000000000

1863

70 °C

UNSPECIFIED

DIMM

DIMM,

-

18.9(Max)

133.5(Max)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

4(Max)

Obsolete

DIMM

PC3-12800

240

-

-

NOT SPECIFIED

5.66

Compliant

Yes

8473300002

Yes

DIM

VLP RDIMM

Commercial

1.5 V

1.5

-

Obsolete

EAR99

70 °C

0 °C

AUTO/SELF REFRESH

8542.32.00.36

CMOS

DUAL

NO LEAD

NOT SPECIFIED

1

1 mm

unknown

240

R-XDMA-N240

-

1.5 V

1.575 V

-

COMMERCIAL

1.425 V

-

1.575 V

1.425 V

1

-

SYNCHRONOUS

-

-

-

1Gx72

-

18.9 mm

72

-

77309411328 bit

1.6 GHz

Yes

-

DDR DRAM MODULE

-

8K

DUAL BANK PAGE BURST

Yes

240RDIMM

133.35 mm

-

-

Yes with exemptions

KSM24RS8/8MEI
KSM24RS8/8MEI

Kingston Technology

In Stock

-

Datasheet

4 Weeks, 2 Days

-

-

NO

-

288

-

-

17

1Gx8

8G

-

FBGA

-

72

Yes

EAR99

8473.30.11.40

KINGSTON TECHNOLOGY COMPANY INC

-

-

Kingston Technology Company

KSM24RS8/8MEI

-

2400

-

85

-

0

DRAM Module

8Gbyte

-

Socket

-

-

9

Single

1073741824 words

1000000000

1305

85 °C

UNSPECIFIED

DIMM

DIMM,

-

31.25

133.35

RECTANGULAR

MICROELECTRONIC ASSEMBLY

-

End Of Life

-

-

288

-

-

NOT SPECIFIED

5.55

-

Yes

-

-

-

RDIMM

-

1.2 V

1.2

-

Obsolete

-

-

-

-

-

CMOS

DUAL

NO LEAD

NOT SPECIFIED

1

-

compliant

288

R-XDMA-N288

-

-

-

-

OTHER

-

-

-

-

1

-

SYNCHRONOUS

-

-

-

1Gx72

-

31.37 mm

72

-

77309411328 bit

-

-

-

DDR DRAM MODULE

-

-

MULTI BANK PAGE BURST

-

288DIMM

133.35 mm

-

-

Yes with exemptions

M393A1G43EB1-CTD
M393A1G43EB1-CTD

Samsung Electronics

42

-

Datasheet

-

-

-

-

-

-

-

-

19

512Mx8

4G

-

78FBGA

-

72

Yes

EAR99

8473.30.11.40

-

-

-

-

-

-

2666

1.26

-

1.14

-

DRAM Module

8Gbyte

Double

Socket

-

16

18

Dual

-

-

1435

-

-

-

-

-

31.25

133.35

-

-

1.4 + 2.8(Max)

-

-

-

288

-

-

-

-

-

-

-

No

-

RDIMM

-

-

1.2

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

288

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1Gx72

-

-

-

-

-

-

No

-

-

-

-

-

Yes

288RDIMM

-

-

-

-

MT4HTF6464HY-667G1
MT4HTF6464HY-667G1

Micron Technology

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

5

64Mx16

1G

-

-

-

64

No

EAR99

8542.32.00.02

-

-

No Lead

-

-

-

667

1.9

70

1.7

0

DRAM Module

512Mbyte

Single

Socket

-

8

4

Single

-

-

-

-

-

-

-

-

30(Max)

67.75(Max)

-

-

2.45(Max)

-

-

PC2-5300

200

-

-

-

-

-

-

-

Yes

DIM

SODIMM

Commercial

-

1.8

Tray

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

200

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

64Mx64

-

-

-

-

-

-

No

-

-

-

8K

-

Yes

200SODIMM

-

-

-

Yes with exemptions

5962R0622906VYC
5962R0622906VYC

Microchip Technology

In Stock

-

Datasheet

-

Production (Last Updated: 2 years ago)

Surface Mount

-

68

-

-

-

-

512Kx8

4M

-

68-MQFPT

-

4

No

ITAR (XV.e)

8542.32.00.41

-

-

-

-

-

18

-

3.6

125

3

-55

SRAM Module

16Mbit

-

Surface Mount

4

-

4

-

-

-

170

-

-

-

-

-

4.7(Max)

64.14(Max)

-

-

64.14(Max)

-

-

-

68

-

-

-

-

Non-Compliant

-

-

No

-

MQFP-T

Military

-

3.3

-

Active

-

125 °C

-55 °C

-

-

-

-

-

-

-

-

-

68

-

-

3.3 V

-

-

-

-

-

3.6 V

3 V

-

-

-

-

18 ns

-

4Mx4

-

-

-

-

-

-

No

-

-

-

-

-

No

-

-

-

-

RoHS non-compliant

TS8GEMC210
TS8GEMC210

Transcend Information

In Stock

-

Datasheet

-

-

-

-

-

-

-

Embedded Flash Drive

-

-

-

8G

-

-

-

-

EAR99

-

-

MMC

Ball

-

-

-

-

3.6

85

2.7

-25

-

-

-

Surface Mount

-

-

-

-

-

-

-

-

-

-

-

-

0.92(Max)

13

-

-

11.5

-

-

-

153

-

Yes

-

-

-

-

-

-

BGA

BGA

-

-

3.3

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

153

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

M393A2K40CB2-CTD6Q-2666
M393A2K40CB2-CTD6Q-2666

Samsung Electronics

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

19

2Gx4

8G

-

78FBGA

-

72

No

4A994.a

8473.30.11.40

-

-

-

-

-

-

2666

-

85

-

0

DRAM Module

16Gbyte

-

Socket

-

16

18

Single

-

-

-

-

-

-

-

-

31.25

133.35

-

-

4.3(Max)

-

-

-

288

-

-

-

-

-

-

-

-

DIM

RDIMM

Commercial

-

1.2

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

288

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2Gx72

-

-

-

-

-

-

-

-

-

-

-

-

-

288RDIMM

-

-

-

RoHS Compliant

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

1Mx8

8M

-

-

-

32

No

4A994.a

-

-

-

-

-

-

100

-

3.6

85

3

-40

Flash Module

32Mbit

-

Surface Mount

-

-

4

-

-

-

120

-

-

-

-

-

2.8(Max)

22.36

-

-

22.36

-

-

-

68

-

-

-

-

-

-

-

-

-

CQFP

Industrial

-

3.3

-

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

68

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1Mx32

-

-

-

-

-

-

-

-

-

-

-

-

No

-

-

-

-

RoHS non-compliant

SDSDJ-2048-J
SDSDJ-2048-J

Western Digital

In Stock

-

Datasheet

-

-

-

-

-

-

-

SD Card

-

-

-

2G

-

-

-

-

EAR99

-

-

SD/SPI

-

-

-

-

-

3.6

85

2.7

-25

-

-

-

Socket

-

-

-

-

-

-

-

-

-

-

-

-

2.1

32

-

-

24

-

-

-

9

-

Yes

-

-

-

-

-

-

SD

SD

-

-

3.3

-

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

9

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

M471B5674QH0-YK
M471B5674QH0-YK

Samsung Electronics

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

11

256Mx16

4G

-

78FBGA

-

64

Yes

4A994.a

-

-

-

No Lead

-

-

-

1600

1.45/1.575

95

1.283/1.425

0

DRAM Module

2Gbyte

-

Socket

-

-

4

Single

-

-

535

-

-

-

-

-

30

67.6

-

-

2.2(Max)

-

-

-

204

-

-

-

-

-

-

-

-

DIM

USODIMM

-

-

1.35/1.5

-

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

256Mx64

-

-

-

-

-

-

-

-

-

-

-

-

-

204USODIMM

-

-

-

RoHS Compliant

EVS32M16T-5 BITR
EVS32M16T-5 BITR

Teledyne e2v

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

3

32Mx16

512M

-

66TSOP-II

-

16

No

-

-

-

-

-

-

-

-

167

2.7

85

2.3

-40

DRAM Module

1Gbit

-

Surface Mount

-

4

2

-

-

-

-

-

-

-

-

-

1.8(Min)

22.62(Max)

-

-

-

-

-

-

66

-

-

-

-

-

-

-

No

-

TSOP-II

Industrial

-

2.5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

66

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

64Mx16

-

-

-

-

-

-

No

-

-

-

-

-

Yes

-

-

-

-

Supplier Unconfirmed

KVR667D2S5/2G
KVR667D2S5/2G

Kingston Technology

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

5

128Mx8

1G

-

-

-

64

No

EAR99

8542.32.00.36

KINGSTON TECHNOLOGY COMPANY INC

-

No Lead

Kingston Technology Company

KVR667D2S5/2G

-

667

1.9

-

1.7

-

DRAM Module

2Gbyte

Double

Socket

-

-

16

-

-

-

-

-

-

-

,

-

30

67.6

-

-

-

Obsolete

-

-

200

-

-

-

5.83

-

-

-

No

DIM

SODIMM

-

-

1.8

-

Obsolete

-

-

-

-

-

-

-

-

-

-

-

unknown

200

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

256Mx64

-

-

-

-

-

-

No

-

-

-

-

-

No

200SODIMM

-

-

-

Yes with exemptions

KVR13LR9D8/4HC
KVR13LR9D8/4HC

Kingston Technology

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

9

256Mx8

2G

-

FBGA

-

72

Yes

EAR99

-

-

-

No Lead

-

-

-

1333

1.45/1.575

85

1.28/1.425

0

DRAM Module

4Gbyte

Double

Socket

-

8

18

Dual

-

-

-

-

-

-

-

-

30

133.35

-

-

-

-

-

PC3-10600

240

-

-

-

-

-

-

-

No

DIM

RDIMM

-

-

1.35/1.5

-

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

240

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

512Mx72

-

-

-

-

-

-

Yes

-

-

-

-

-

No

240RDIMM

-

-

-

Supplier Unconfirmed

MT4HTF3264HY-667F1
MT4HTF3264HY-667F1

Micron Technology

In Stock

-

Datasheet

-

-

Socket

NO

200

200

0.45 ns

-

5

32Mx16

512M

-

-

333 MHz

64

No

EAR99

8542.32.00.32

MICRON TECHNOLOGY INC

-

No Lead

Micron Technology Inc

MT4HTF3264HY-667F1

-

667

1.9

70

1.7

0

DRAM Module

256Mbyte

Single

Socket

4

4

4

Single

33554432 words

32000000

1000

70 °C

PLASTIC/EPOXY

DIMM

-

DIMM200,24

30(Max)

67.75(Max)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.45(Max)

Obsolete

-

PC2-5300

200

-

-

-

5.84

Compliant

Yes

-

Yes

DIM

SODIMM

Commercial

1.8 V

1.8

Tray

Obsolete

-

70 °C

0 °C

-

-

CMOS

DUAL

NO LEAD

-

-

0.6 mm

unknown

200

R-PDMA-N200

Not Qualified

1.8 V

-

1.8 V

COMMERCIAL

-

-

1.9 V

1.7 V

-

-

-

1.4 mA

-

64 b

32Mx64

3-STATE

-

64

0.028 A

2147483648 bit

667 MHz

No

COMMON

DDR DRAM MODULE

-

8K

-

Yes

200SODIMM

-

-

No

RoHS Compliant

TS16D42AR00LNS
TS16D42AR00LNS

Transcend Information

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

1Gx8

8G

-

FBGA

-

64

No

4A994.a

8473.30.11.40

-

-

-

-

-

-

2400

1.26

85

1.14

0

DRAM Module

16Gbyte

-

Socket

-

-

-

Dual

-

-

1088

-

-

-

-

-

31.25

133.35

-

-

3.9(Max)

-

-

-

288

-

-

-

-

-

-

-

Yes

-

UDIMM

-

-

1.2

Bulk

Active

-

-

-

-

-

-

-

-

-

-

-

-

288

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2Gx64

-

-

-

-

-

-

-

-

-

-

-

-

-

288UDIMM

-

-

-

RoHS Compliant

KVR26S19S8/8
KVR26S19S8/8

Kingston Technology

49
Datasheet

4 Weeks, 2 Days

-

-

-

-

-

-

-

19

1Gx8

8G

-

FBGA

-

64

No

EAR99

8473.30.11.40

KINGSTON TECHNOLOGY COMPANY INC

-

-

Kingston Technology Company

KVR26S19S8/8

-

2666

-

85

-

0

DRAM Module

8Gbyte

Double

Socket

-

-

8

Single

-

-

-

-

-

-

,

-

30

69.6

-

-

3.7(Max)

Contact Manufacturer

-

PC4-2666

260

260

-

-

5.69

-

-

-

Yes

-

SODIMM

-

-

1.2

-

Active

-

-

-

-

-

-

-

-

-

-

-

unknown

260

-

-

-

-

-

-

-

1.2V

-

-

-

2666MHz

-

-

-

-

1Gx64

-

-

-

-

8

-

-

-

DDR DRAM MODULE

8 GB

-

-

Yes

260SODIMM

-

-

-

RoHS Compliant

MT8JTF51264HDZ-1G4D1
MT8JTF51264HDZ-1G4D1

Micron Technology

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

9

256Mx16

4G

-

-

-

64

No

EAR99

8473.30.11.40

-

-

No Lead

-

-

-

1333

1.575

70

1.425

0

DRAM Module

4Gbyte

Double

Socket

-

8

8

Dual

-

-

1040

-

-

-

-

-

30.15(Max)

67.75(Max)

-

-

3.8(Max)

-

-

PC3-10600

204

-

-

-

-

-

-

-

Yes

DIM

SODIMM

Commercial

-

1.5

-

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

512Mx64

-

-

-

-

-

-

No

-

-

-

8K

-

Yes

204SODIMM

-

-

-

Yes with exemptions

M393A1G43DB0-CPB
M393A1G43DB0-CPB

Samsung Electronics

In Stock

-

Datasheet

-

-

-

NO

-

288

-

-

15

512Mx8

4G

-

FBGA

-

72

Yes

EAR99

-

SAMSUNG SEMICONDUCTOR INC

-

-

Samsung Semiconductor

M393A1G43DB0-CPB

-

2133

1.26

-

1.14

-

DRAM Module

8Gbyte

Double

Socket

-

-

18

Dual

1073741824 words

1000000000

1750

-

UNSPECIFIED

DIMM

DIMM,

-

31.25

133.35

RECTANGULAR

MICROELECTRONIC ASSEMBLY

4.3(Max)

Active

-

-

288

-

-

NOT SPECIFIED

5.71

-

Yes

-

No

DIM

RDIMM

-

1.2 V

1.2

-

Obsolete

EAR99

-

-

AUTO/SELF REFRESH; WD-MAX

-

CMOS

DUAL

NO LEAD

NOT SPECIFIED

1

0.85 mm

compliant

288

R-XDMA-N288

-

-

1.26 V

-

-

1.14 V

-

-

-

1

-

SYNCHRONOUS

-

-

-

1Gx72

-

31.4 mm

72

-

77309411328 bit

-

No

-

DDR DRAM MODULE

-

-

DUAL BANK PAGE BURST

Yes

288RDIMM

133.35 mm

3.9 mm

-

RoHS Compliant

TS4FCFSAR00ISI
TS4FCFSAR00ISI

Transcend Information

In Stock

-

Datasheet

-

-

-

-

-

-

-

CompactFlash

-

-

-

4G

-

-

-

-

EAR99

8523.80.20.00

-

IDE/PCMCIA

-

-

-

-

-

3.63|5.5

85

4.5|2.97

-40

-

-

-

Socket

-

-

-

-

-

-

-

-

-

-

-

-

3.93

42.8

-

-

36.4

-

-

-

50

-

Yes

-

-

-

-

-

-

-

-

Industrial

-

5|3.3

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

50

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

M393AAK40B41-CTC0Y
M393AAK40B41-CTC0Y

Samsung Electronics

In Stock

-

Datasheet

-

-

-

-

-

-

-

-

-

8Gx4

8G

-

78FBGA

-

72

No

-

8473.30.11.40

-

-

-

-

-

-

-

1.26

-

1.14

-

DRAM Module

128Gbyte

Double

-

-

16

36

Octal

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

No

-

-

-

-

1.2

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

16Gx72

-

-

-

-

-

-

No

-

-

-

-

-

Yes

288RDIMM

-

-

-

-